2results about How to "Achieve machining accuracy" patented technology

The utility model discloses a double -position filling and tail sealing machine, it includes frame, double -position internal heating filling head, filling mechanism, rotary disc and multi -position processing system. Filling mechanism is through switching valve control paste and pushes to the dip, realizes steady filling, and double -position internal heating filling head cooperation lift air cylinder and filling cylinder complete accurate filling, and the rotary disc is arranged loading, and to the mark, and heating, and clamping shaping, and the surplus material cutting and unloading mechanism, realizes the efficient processing of plastic hose. The application can carry out the filling and tail of two plastic hose simultaneously, and the production efficiency and product quality are improved significantly, and it is suitable for the packaging demand of various paste or liquid of daily necessities industry.

The application discloses a method for fine modification of the interior of a crystal based on double-beam laser focus interference, and belongs to the field of laser precision machining. The method is realized by adjusting the divergence angle of double beams by using a laser shaping device to realize the overlap of focus A and focus B. The double foci overlap and interfere, and the interference phenomenon of the energy intensity alternately changing occurs in the focus overlap area; under the interference, laser energy is concentrated to the interference enhancement position, and the energy peak value can exceed the modification threshold of the material interior, and modification occurs; the size of the double-focus overlap area is compressed relative to the conventional single-focus area, and the modification by interference only occupies a part of the overlap area, and the size of the modification area is further compressed. Compared with the conventional single-focus modification area, the longitudinal size of the modification by the method can be compressed by at least 50%, and the precision of the micro-nano structure in the processed crystal is higher. According to the characteristics of the crystal material, laser parameters are selected, and scanning is carried out according to a preset track, modification points form a modification line, and then high-precision machining of a complex micro-nano structure in the crystal can be realized.