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Homogenization method of chipping allowance and periphery grinding apparatus of plate

A cutting allowance, homogenization technology, applied in the direction of grinding machine parts, grinding/polishing equipment, machine tools suitable for grinding workpiece edges, etc. Errors and other problems, to achieve the effect of improving machining accuracy, stable product quality, and prolonging life.

Inactive Publication Date: 2015-02-11
NAKAMURATOME SEIMITSU IND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0013] However, for such existing methods, since the workpiece needs to be unloaded from the device when the processed workpiece is measured, and because a reference line is added to the blank workpiece, or the cutting amount is measured and corrected manually The calculation of the value and the setting of the controller require the operator's proficiency, so there may be problems such as measurement errors or input errors.
In addition, with the conventional method of correcting machine precision as shown in Patent Document 2, it is difficult to realize the correction to make the cutting allowance uniform.

Method used

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  • Homogenization method of chipping allowance and periphery grinding apparatus of plate
  • Homogenization method of chipping allowance and periphery grinding apparatus of plate
  • Homogenization method of chipping allowance and periphery grinding apparatus of plate

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Embodiment Construction

[0049] Hereinafter, embodiments of the peripheral edge grinding device of the present invention will be described with reference to the drawings. figure 1 is a schematic side view of the peripheral grinding device in polar coordinates, figure 2 is a plan view showing the configuration of the device.

[0050] In the figure, the workpiece shaft 1 is a hollow shaft in the vertical direction, and is rotatably supported by a bearing 11 on an unillustrated machine frame. A table 12 is fixed to the upper end of the workpiece shaft 1 , and the upper surface of the table serves as a horizontal workpiece holding surface 13 . Negative pressure is supplied to the workpiece holding surface 13 through the hollow hole of the workpiece shaft 1 , and the workpiece w placed on the workpiece holding surface 13 is vacuum-adsorbed by the lower surface and fixed to the table 12 . A spindle motor (servo motor) 15 is connected to the lower end of the workpiece shaft 1 . The spindle motor 15 is co...

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Abstract

The invention provides a homogenization method of chipping allowance and a periphery grinding apparatus of a plate, and relates to an apparatus for grinding a glass substrate of a display panel of a portable terminal and peripheries of other plates, even in a polar coordinate system, the grinding apparatus can automatically set a corrected value for homogenizing chipping allowance of a workpiece at the whole periphery of the workpiece. Before processing and after processing the workpiece held on a workbench, images of predefined periphery portions at more than three positions of the workpiece are acquired by using a camera, differences of positions of sides of the workpiece before processing and after processing at the periphery portions of each position are detected, a corrected value for homogenizing the differences of the positions of the sides at the periphery portions at more than three positions is calculated, and the corrected value is set to a controller. The controller uses the set corrected value to correct instruction values provided to a spindle motor driving the workbench to rotate and a feed motor of a grinding wheel.

Description

technical field [0001] The present invention relates to a method of equalizing a cutting allowance of a device for grinding the periphery of a glass substrate and other small plate materials, and the above-mentioned device for implementing the method. Background technique [0002] As for the grinding device of the plate material, there is a device of the vertical coordinate system (Patent Document 1) and a device of the polar coordinate system (Patent Document 3) as follows, which make the grinding wheel relative to the workpiece The relative position is moved in two vertical directions to perform processing, and the device of the polar coordinate system controls the rotation angle of the table holding the workpiece in relation to the position of the grinding wheel moving in the radial direction of the rotation, thereby for processing. Cartesian coordinate system equipment is suitable for processing large and rectangular plates such as glass plates for display panels of tel...

Claims

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Application Information

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IPC IPC(8): B24B9/08B24B49/02
CPCB24B9/00B24B9/08B24B17/04B24B9/10B24B49/12
Inventor 酒井友基
Owner NAKAMURATOME SEIMITSU IND
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