41results about How to "Reduce chipping" patented technology

The utility model relates to the field of crystal bar flaw piece recovery, in particular to a crystal bar flaw piece material taking mechanism and a crystal bar processing system.The crystal bar flaw piece material taking mechanism comprises two material taking modules which are arranged in a bilateral symmetry mode, each material taking module comprises a supporting frame and a material receiving unit which are arranged at the bottom, a supporting plate is arranged on each supporting frame, and the two material taking modules are symmetrical; the supporting plate is vertically arranged, and the top end of the supporting plate is a sharp end and can be in direct contact with a crystal bar; a first reference surface and a second reference surface which are perpendicular to each other are established by taking the central axis of the crystal bar as a reference, the crystal bar subjected to squaring comprises a square bar and crystal bar edge pieces on the left side and the right side, the distance between the gravity center of each crystal bar edge piece and the first reference surface is L1, the distance between the tip end of each crystal bar edge piece and the first reference surface is L2, and L1 is larger than L2; and the material receiving unit is obliquely arranged and is used for receiving the poured crystal bar edge skin. Cost and maintenance difficulty can be reduced, stability is guaranteed, edge skins are prevented from being collided in the placing process, and the edge breakage phenomenon is reduced.

The invention relates to a material mixing packaging bottle and a using method, the material mixing packaging bottle comprises a liquid material barrel and a solid material barrel, the solid material barrel is inserted into the liquid material barrel in a sliding mode, the inner wall of the solid material barrel is provided with a plurality of limiting supporting pieces, and the limiting supporting pieces are distributed around the axis of the solid material barrel at intervals; a gap is formed between every two adjacent limiting supporting pieces to form a liquid flowing groove, a freeze-drying bin is formed between the upper surfaces of the limiting supporting pieces and an inner cavity in the upper portion of the solid material barrel, freeze-drying balls are arranged in the freeze-drying bins, the lower end face of the solid material barrel is fixedly covered with a diaphragm, the inner wall of the bottom of the liquid material barrel is fixedly connected with a puncturing piece, and an inner cavity in the lower portion of the liquid material barrel is filled with essence. A mixed liquid flowing opening is formed in the bottom wall of the liquid material barrel in a penetrating mode, a bottom cover is detachably connected to the bottom face of the liquid material barrel, and a detachable limiting piece for limiting the solid material barrel to move downwards relative to the liquid material barrel is detachably connected to the outer wall of the upper portion of the solid material barrel. The freeze-drying device has the advantage that the possibility of freeze-drying ball fragmentation is reduced.

This disclosure provides a light-emitting diode and a method for manufacturing the same. The light-emitting diode includes an epitaxial structure; the epitaxial structure has a plurality of protrusions located on a first surface, and the epitaxial structure also has a mesh-like isolation groove formed on a second surface and extending toward the first surface, the epitaxial structure being divided into a plurality of epitaxial units by the isolation groove; the bottom of the isolation groove is spaced apart from the first surface; in a direction perpendicular to the second surface of the epitaxial structure, the connection between the sidewall of the isolation groove and the bottom surface of the isolation groove corresponds to the middle portion of the protrusion; the first surface and the second surface are two opposite surfaces of the epitaxial structure.

The utility model relates to abrasive disc technical field discloses a kind of high-strength brown corundum wear-resistant resin abrasive disc, including wheel core, the transition layer is equipped outside wheel core, the abrasive ring is equipped outside transition layer, and the transition layer and abrasive ring are detachably connected by bolt;Several convex teeth are distributed in the surface one side of transition layer, several grooves are opened in abrasive ring inner wall, and several convex teeth are embedded in the inner wall of several grooves;The utility model is connected by the circumferential limit of convex tooth and groove, annular limiting plate and annular groove and the axial restriction of mounting block and mounting groove, plus the fastening effect of bolt, multiple structure cooperation makes transition layer and abrasive ring connect exceptionally stable, when abrasive ring wears, it can be replaced by only disassembling bolt, wheel core and transition layer can be reused, without integral replacement abrasive disc, substantially reduce the equipment use cost, reduce resource waste, and it is convenient to replace abrasive ring of different granularity according to processing requirement.

The invention discloses a processing method for a copper-clad ceramic substrate, which relates to the technical field of copper-clad ceramic substrate processing, and comprises the following steps of: taking a pre-treated copper-clad ceramic substrate, introducing nitrogen, and carrying out layered progressive micropore processing on an exposed aluminum oxide ceramic substrate of the pre-treated copper-clad ceramic substrate through picosecond laser to form micropores; each micropore is divided into an inlet layer, a middle layer and an outlet layer from top to bottom; the layer number of the micropores, the thickness of each layer of the micropores and the pulse width are controlled, and a light spot and long-focal-depth lens is adopted; adjusting monopulse energy and frequency parameters of picosecond laser, and punching an inlet layer; adjusting monopulse energy and frequency parameters of picosecond laser, and punching the middle layer; and adjusting monopulse energy and frequency parameters of the picosecond laser, and punching the outlet layer to obtain the copper-clad ceramic substrate. In the middle layer, the monopulse energy is gradually increased, and it is ensured that the material is evenly removed; at the inlet layer and the outlet layer, energy is reduced, and cracks caused by stress generated instantly when the material is punctured are avoided.

The utility model relates to the technical field of batten cutting, and discloses a batten cutting device convenient for fixing a batten, which comprises a cutting knife mounted on a working table through a mounting frame I, the two pressing wheels are installed on the workbench through two second installation frames correspondingly, and the two pressing wheels are located on the two sides of the cutting knife. The condensing equipment is installed on the bottom plate, the condensing equipment is communicated with a condensing pipe, the condensing pipe penetrates through the cutting knife, and the cutting knife is provided with a containing cavity used in cooperation with the condensing pipe; the dust collection plate is mounted above the cutting knife; the dust collection equipment is mounted on the bottom plate, and the dust collection equipment is communicated with the dust collection plate through a connecting pipe. According to the shaving board cutting device, efficient, accurate and environment-friendly cutting of shaving boards is achieved through the cutting knife, the pressing wheel, the condensing device, the dust collection device, high-hardness materials, precise design, stable pressing, heat absorption and strong suction force.

The utility model discloses an antique Beijing brick with ventilative and moisture-proof function, including brick body, still including support body, the support body is installed on the ground after hardening, and the bottom of support body is more than 2cm from the ground, the brick body is stacked in the top of support body, dry granule, the dry granule is filled in the inside of support body, when removing the brick body upward, the dry granule is exposed, the buffer layer is glued and fixed in the bottom of brick body, and the lower end of buffer layer is fixed with support body alignment, and the product can avoid the ground moisture return, and is easy to maintain.

A wafer hybrid bonding method and grinding device, the method comprising: performing first grinding processing on an initial edge region from the first surface to the second surface direction to form a first wafer structure, the first wafer structure comprising a functional region and an edge region surrounding the functional region, the edge region having a first grinding opening, the side wall of the first grinding opening having an obtuse angle with the first surface; forming a first conductive structure in a first dielectric layer, the surface of the first dielectric layer exposing the surface of the first conductive structure; providing a second wafer structure, the second wafer structure comprising a second dielectric layer and a second conductive structure in the second dielectric layer, the surface of the second dielectric layer exposing the surface of the second conductive structure; performing bonding processing on the first wafer structure and the second wafer structure, so that the second dielectric layer is bonded to the first dielectric layer, and the first conductive structure is bonded to the second conductive structure, thereby improving the uniformity of the first conductive structure.

The utility model belongs to medical instrument technical field, concretely relates to a lung cancer tissue sample rapid collection device, including sampling cylinder, one end of sampling cylinder is provided with outer needle tube, the outer needle tube is connected with sampling cylinder and forms the communication structure through luer joint, and the end of outer needle tube is handled with open blade, the inside of outer needle tube is provided with inner needle rod, one end of inner needle rod extends to the inside of sampling cylinder from the inside of outer needle tube, and the outside of inner needle rod is provided with spiral blade, the inside of sampling cylinder is slidably connected with piston, and inner needle rod is fixedly connected with piston, the end of piston away from inner needle rod is fixed with threaded column. This utility model can utilize the spiral cutting characteristic of spiral blade, shorten sample acquisition time, and the spiral winding mode can keep the tissue form completely, reduce sample fragmentation and loss, through the threaded transmission structure of threaded column and split nut, medical staff can accurately control the advancing depth of inner needle rod, ensure the accuracy of sample collection position.

The utility model relates to the technical field of linear motor production auxiliary devices, and provides a magnet positioning and pasting device of a linear motor, which comprises a positioning frame, the positioning frame comprises a rectangular frame body and first lower division bars arranged in the rectangular frame body at intervals, and an inner cavity of the rectangular frame body is divided by a group of first lower division bars to form a plurality of lower positioning holes. A slope extending from top to bottom is arranged on one side of the lower positioning hole in the length direction. The positioning frame overcomes the defects in the prior art, is reasonable in design and convenient to use, and solves the technical problem that magnets are broken when an existing positioning frame is used.

This application discloses a method, system, and manufacturing method for cleaving silicon carbide wafers. The cleaving method includes the following sequential steps: a pre-cleaving step: guiding and extending microcracks within the modified layer of a silicon carbide ingot that has undergone internal laser-modified layer scanning using a first ultrasonic field; a faceting step: connecting and connecting the extended cracks within the modified layer plane using a second ultrasonic field to form a continuous separation interface; and a separation step: applying a separation force to separate the wafer from the ingot body along the continuous separation interface. This application's technical solution, through a three-step method of guided extension, faceting, and gentle separation, achieves precise stepwise application of ultrasonic energy, effectively reducing the risk of wafer edge chipping and microcracks, and improving wafer separation yield.

The utility model discloses wafer chamfering equipment which is used for chamfering the edge of a wafer, and chamfering of the edge of the wafer is achieved through relative rotation between a grinding module and the wafer. The contact position between the grinding and cutting module and the wafer is sprayed through the cooling and lubricating module, so that in the process that the grinding and cutting module conducts chamfering on the wafer, cooling and lubricating of the contact position between the grinding and cutting module and the wafer are achieved through the cooling and lubricating module, the grinding and cutting acting force borne by the edge of the wafer is reduced, and the grinding and cutting efficiency is improved. And the cooling and lubricating module can continuously spray through the liquid storage tank, so that cooling and lubricating can be carried out in the whole wafer chamfering process, the edge breakage phenomenon in the wafer chamfering process is reduced, and the wafer yield is improved.

The application discloses a cylindrical glass piece packaging box and a packaging method thereof, wherein the packaging box comprises a spliced cover plate which is spliced by wooden boards and flexible buffer boards in a horizontal direction; a clamping groove is formed in the wooden board and is embedded with a notch on a support to limit the displacement of a protection mechanism in a vertical direction; wherein a first limiting support is arranged on the outermost side of a first protection part, and a second limiting support opposite to the first limiting support is arranged on the outermost side of a second protection part; a slope is arranged on the opposite surface of the first limiting support and the second limiting support respectively, and the two slopes are oppositely arranged and used for abutting against and limiting the sharp end of the end part of the cylindrical glass piece; through the above mode, the application can effectively solve the breakage problem of the cylindrical glass piece caused by the shaking of the protection mechanism and the lack of reliable limiting of the special-shaped end part during transportation, and improve the protection performance and loading and unloading convenience of the packaging.

The utility model relates to the technical field of tooth finish machining, and provides a double-sided clamping type trimming cutter for an internal tooth honing wheel, which comprises a base body provided with a first surface, the first surface is provided with a bulge, and the bulge is provided with a second surface which forms an angle with the first surface; the trimming wheel is arranged on the protrusion in a sleeving mode, and the first side abuts against the first surface; the pressing piece is arranged on the protrusion in a sleeving mode and comprises a first part and a second part, and the first part extends in the direction of the first surface and abuts against the second side of the dressing wheel; the second portion extends toward the second surface. According to the trimming cutter provided by the utility model, the first part of the pressing piece extends towards the direction of the first surface and tightly abuts against the second side of the trimming wheel, and the second part of the pressing piece extends towards the direction of the second surface of the bulge. The trimming wheel is fixed in the axial direction and the radial direction, eccentricity of the trimming wheel and the base body is avoided, the portion, close to the tooth crest, of the trimming wheel is effectively fixed, and the phenomena of tipping and breakage are reduced.

The utility model discloses salted egg yolk sorting equipment, relates to the technical field of salted egg yolk sorting, and aims to solve the problems that in the prior art, salted egg yolks are sorted in a sorting bin rotating mode, but the salted egg yolks are soft in texture and prone to breakage due to rotating and rolling, and the production quality of the salted egg yolks is affected. Supporting seats are fixedly connected to the front end and the rear end of the middle of the upper end of the inner side of the first H-shaped support correspondingly, first rotating blocks are rotationally connected to the upper ends of the two supporting seats correspondingly, second rotating blocks are rotationally connected to the upper ends of the two sliding blocks correspondingly, and third rotating shafts are rotationally connected between the two first rotating blocks and the two second rotating blocks correspondingly; and conical sorting rollers are fixedly arranged on the two third rotating shafts correspondingly, through the design of the conical sorting rollers, rotation and rolling of the salted egg yolk in the sorting process are avoided, the fragmentation situation of the salted egg yolk is effectively reduced, and the production quality of the salted egg yolk is improved.

This invention discloses a wafer protective film and its manufacturing method. The wafer protective film includes: a bottom layer film formed on the surface of the wafer; an intermediate layer film formed on the surface of the bottom layer film; and a surface layer film formed on the surface of the intermediate layer film. By forming a protective film on the wafer surface using the technical solution of this invention, vibration and collisions during wafer transportation and processing can be effectively mitigated, reducing the risk of wafer breakage and damage, thereby improving wafer manufacturing efficiency and quality.

The utility model relates to a child carrier. The child carrier comprises a seat body and a passer component. The seat body comprises a backrest component and a seat component, and the backrest component and the seat component are detachably connected. The passer component is suitable for limiting the safety belt of a vehicle. The rear side of the seat component is provided with a receiving part, the passer component is connected to the receiving part, the receiving part is provided with a receiving groove, the receiving groove is suitable for at least partially containing the passer component, and the connecting point between the passer component and the receiving part is located outside the receiving groove. The passer component according to the utility model can be conveniently stored or taken out.

The application discloses a machining method of a casing inner cavity weight-reducing groove and a casing, and the machining method comprises the following steps: using a milling cutter with a diameter greater than twice the radial allowance width of the casing inner cavity weight-reducing groove, and extending the milling cutter into the casing inner cavity along an axial direction; adopting a deep hole peck drilling mode to perform axial plunge milling along the weight-reducing groove, and performing interval plunge milling along a circumferential direction for multiple times to form a plurality of lace grooves and assembly bosses; wherein, when the axial plunge milling is performed, the circumferential direction and the width direction of the radial allowance of the weight-reducing groove are combined into one layer and are milled through by one cutter. The machining method adopts the milling cutter with the diameter greater than twice the radial allowance width, improves the cutting force of the cutter, and reduces vibration and the phenomenon of broken edges in the machining process; the machining method adopts the machining mode of one cutter from top to bottom to penetrate and mill the circumferential direction and the width direction, improves the machining efficiency, and the main stress of the milling cutter in the drilling and milling process is an axial force, so that the acting force on the radial cutting force of the machine tool is greatly reduced, and the deformation of the casing can be reduced.

The utility model relates to abrasive disc technical field discloses a kind of high-performance white corundum ceramic base precision abrasive disc, including mounting ring, the outer wall surface of mounting ring is equipped with tenacity matrix layer, the outer wall surface of tenacity matrix layer is equipped with transition layer, the outer wall surface of transition layer is equipped with working layer, and the periphery of working layer is provided with several air holes.The high-performance white corundum ceramic base precision abrasive disc, through the unique three-layer composite structure design of tenacity matrix layer, transition layer and working layer, inner layer is high-strength, tenacity matrix, middle layer is as stress buffer and outer layer multiple toughening, can effectively customer traditional white corundum ceramic abrasive disc tenacity deficiency, easy to break, abrasive grain easy to fall off Problem, realizes the qualitative leap of abrasive disc strength, tenacity, durability, security and grinding performance, and comprehensive performance significantly improves, prolongs service life and reduces use cost.

The application discloses a through hole method for a glass substrate of a Mini-LED backlight plate, and the through hole method comprises the following steps: S1, forming a plurality of groups of blind holes coaxial and corresponding in position by using laser to open holes on the upper and lower surfaces of a glass substrate covered with acid-resistant films; and S2, spraying an acid etching solution into the blind holes to form through holes through acid etching. The through hole method disclosed by the application can not only obtain straight holes with small edge collapse and small roughness of hole walls, and meet the requirements of the Mini-LED backlight plate, but also can realize rapid through holes of the glass substrate, and meet the requirements of industrial production.

The invention relates to the technical field of semiconductor-grade quartz product processing, in particular to a vertical rotary grinding processing method for a semiconductor-grade quartz ring, which comprises the following steps: step 1, a quartz ring blank is adhered to a quartz disc by wax; then fixing the quartz disc on a vertical rotary workbench; 2, a CNC machining program is programmed, and quartz ring three-dimensional model establishment, machining coordinate system establishment, machining mode and tool selection, machining parameter setting and program post-processing and checking are completed based on computer-aided programming software; and 3, equipment is started, the inner diameter and the outer diameter of the quartz ring blank are ground according to the programmed CNC program, and the machining allowance is removed. By means of the method, the problems that a traditional machining method is low in machining efficiency, unstable in size precision, multiple in surface defect and the like are solved.

This application relates to the field of food machinery technology, specifically disclosing a curved block clamping and conveying device. The device is mounted on a transfer frame and includes a movable frame. An installation plate is located at one end of the movable frame, and a fixed plate is located at the lower end of the installation plate. A baffle is located below the fixed plate, and a clamping assembly is mounted on the fixed plate. A rotating assembly is located at the end of the movable frame. When curved blocks need to be transferred, the clamping and conveying device can be moved to a designated position via the transfer frame and the movable frame. After the movement is complete, the rotating assembly in this application can rotate the installation plate and the fixed plate to adjust them to a suitable angle for clamping the curved blocks, improving clamping efficiency and flexibility. After the angle adjustment, the clamping assembly and the baffle can simultaneously and stably clamp multiple curved blocks, thereby improving clamping stability and efficiency.

This invention relates to the field of gear processing and casting technology, specifically to a casting and forming device for processing planar helical cylindrical gears. The device includes a worktable and a vertical block on the worktable. A first rotating gear disk is rotatably mounted on one side of the worktable, and a lower mold is mounted on the first rotating gear disk. A mounting base is located on one side of the vertical block, and a rotating column is rotatably mounted inside the mounting base. An electric telescopic rod is located inside the rotating column, and an upper mold adapted to the lower mold is located at the telescopic end of the electric telescopic rod. A rotating assembly is also included, comprising a lower rotating module and an upper rotating module. Compared to existing technologies, this application uses the upper rotating module to drive the upper mold and the lower rotating module to drive the lower mold to synchronously output micro-rotation in opposite directions, causing the relative motion of the two molds to exhibit a helical composite trajectory. This allows for unlocking before gradual disengagement when there is a mechanical engagement tendency between the helical positioning teeth and the tooth cavity.

The utility model provides a scale surface protection structure of a weighing scale, and belongs to the technical field of weighing scales. Comprising a weighing scale body and a scale surface body fixed at the top of the weighing scale body, and further comprises a protection mechanism, the protection mechanism comprises an air bag type protection sleeve sleeved at the corner of the scale surface body, a fitting part is formed at the fitting part of the air bag type protection sleeve and the corner of the scale surface body, and the inner wall of the fitting part is fitted at the corner of the scale surface body. According to the utility model, the air bag type protective sleeve is arranged and is sleeved at the corner position of the scale surface body, so that a sharp object can be prevented from being in direct contact with the corner of the scale surface body, the scale surface body is protected, the probability that the scale surface is broken or damaged is greatly reduced, and the service life of the weighing scale body is prolonged.

The invention relates to the technical field of deep hole drilling machines, in particular to an ultrasonic numerical control deep hole drilling machine. The technical scheme comprises a machine body; the guide rail is mounted on the machine body; the workpiece fixing module and the drilling module are slidably mounted at two ends of the machine body through guide rails; the first limiting module is installed on the machine body and located between the machine body and a first limiting sleeve is embedded in the first limiting module. The vertical plate is installed at the end, close to the drilling module, of the machine body. The guide rod is mounted on the machine body through the first limiting module and the vertical plate; the second limiting module is slidably installed on the guide rod and locked and fixed through a bolt, and a second limiting sleeve is embedded in the second limiting module. The hydrodynamic force and cooling system is connected between the drilling module and the workpiece fixing module, and when the drilling module conducts feeding motion, the system drives the workpiece fixing module to move oppositely and conveys cooling liquid to a machining part. Accurate limiting is achieved through the double limiting modules, the fluid system synchronously drives workpieces to feed oppositely and convey cooling liquid, and the drilling precision and efficiency are effectively improved.

The utility model discloses an automatic feeding and discharging device for central control screen production, and relates to the field of central control screen production, the automatic feeding and discharging device comprises a conveyor and an adjustable feeding and discharging mechanism, the conveyor is located in the conveying range of the adjustable feeding and discharging mechanism, the adjustable feeding and discharging mechanism comprises a portal frame, a sliding seat, a lifting beam, a middle suction cup and side suction cups, the sliding base is installed on the portal frame in a sliding mode, the moving direction of the sliding base is perpendicular to the moving direction of the portal frame on the horizontal plane, the lifting beam is installed on the sliding base, a middle suction cup and two side suction cups are installed at the bottom of the lifting beam, and the two side suction cups are symmetrically arranged relative to the middle suction cup. The side suction cups and the lifting beam have the freedom degree of moving in the vertical direction, a traditional clamping mode is replaced with a suction cup flexible contact adsorption mode, the risk that a mechanical claw extrudes and scratches the edge of a screen is completely eliminated, the middle suction cup and the side suction cups work cooperatively, adsorption force is evenly distributed on the surface of the screen, and the production reject ratio is reduced.

This invention relates to the field of pile foundation construction technology and discloses a construction method for improving the bearing capacity and durability of mixed-pile foundations in hard strata. The method includes driving a first set of drill rods to drive a soil-breaking drill bit into the strata while simultaneously injecting fluid for cooling. After reaching the target elevation, the drill is lifted upwards, and cement grout, curing agent grout, or water is injected into the hole during the lifting stage. A second set of drill rods is then used to drive a multi-directional mixing drill bit downwards while simultaneously injecting grout, performing multi-dimensional cross-shearing and mixing of the in-situ fractured rock and soil with the grout. The multi-directional mixing drill bit is controlled to rotate in the opposite direction and lifted out of the hole; grouting can be performed or stopped during the lifting stage. Before the mixed medium in the hole initially sets, the precast pile is implanted to the target elevation. This invention employs an in-situ soil-breaking process without slag removal combined with an alternating blade reverse mixing technology using inner and outer pipes. This overcomes the excessive cutting resistance in hard strata and the phenomenon of mud clumps trapping at the bottom of the hole, achieving uniform forced mixing of the medium in the hole, reducing the pile penetration resistance, and improving the overall bearing capacity of the composite pile.

This invention relates to a method for forming large-size thin-plate ceramics, a forming mold, and the ceramic itself, belonging to the field of ceramic material forming technology. The method includes: filling, floating film floating, pressurization, depressurization-demolding-depressurization, and isostatic pressing steps. The depressurization-demolding-depressurization step includes: gradually depressurizing the upper pressure head while retaining a pre-set pressure; demolding, keeping the sample clamped between the upper and lower pressure heads, and lowering the floating mold until the sample is completely removed; and secondary depressurization: slowly reducing the pre-set pressure to zero, and retracting the upper pressure head to its initial position after leaving the sample. This invention effectively solves the problems of easy cracking, uneven density, difficult demolding, and easy deformation and damage during isostatic pressing of large-size thin-plate ceramics during the forming process, thereby enabling the preparation of high-quality, high-density, and uniform large-size thin-plate ceramic products.

The application discloses a prefabricated box girder assembly type tensioning groove die and belongs to the field of prefabricated part pouring forming. The prefabricated box girder assembly type tensioning groove die comprises a bottom plate, two first connecting plates capable of synchronously and reversely sliding are arranged at the upper end of the bottom plate, and one first die plate is fixed on each of the two first connecting plates. A fixing frame is fixed on the bottom plate, two second connecting plates capable of synchronously and reversely sliding in the vertical direction are arranged on the fixing frame, one second die plate is fixed on each of the two second connecting plates, the two second die plates are capable of being close to each other to contact the upper and lower two sides of the first die plate, and a rectangular cavity is formed by the two second die plates and the first die plate, and the two second die plates are installed at the tensioning groove for pouring. After pouring is completed, the two first die plates and the two second die plates are controlled to be far away from each other to realize block demolding, so that the edge collapse of the tensioning groove concrete is reduced.

The application relates to the technical field of special glass, and provides a glass substrate, chemically strengthened glass and a strengthening method and cover plate glass. The glass substrate provided by the application comprises the following components in terms of the total mole content of oxides in the glass substrate: SiO2: 58-68%; Al2O3: 7.5-9.2%; Na2O: 11.3-14.5%; K2O: 2.5-5%; MgO: 7.5-10.2%; B2O3: 0-2%; ZnO: 0.1-2%; and WO3: 0.1-4%. The size change rate of the glass substrate provided by the application is less than or equal to 0.015% before and after chemical strengthening. During the chemical strengthening process, the glass substrate needs to be inserted into a holder, and then the glass substrate and the holder are placed in a strengthening salt bath for strengthening. Since the size change rate of the glass substrate provided by the application is small, the holder does not need to reserve a large size change gap, and the risk of glass film falling can be obviously reduced.