The invention discloses a processing method and device of a transparent material, and provides an optical fiber laser of which the wave length is 1020 nm to 1090 nm. The processing method is characterized in that laser beams output by a seed laser are subjected to energy amplification through an optical fiber amplifier, laser pulse trains are output, each pulse train comprises at least two laser pulses, pulse width is smaller than 200 ps, peak power of the pulses is larger than 100 kW, the time among the laser pulses in each pulse train is smaller than 90 ns, the interval among the pulse trains is larger than 240 ns, and the total pulse number in each second is larger than 50,000, wherein ultrafast laser beams output by the laser are subjected to energy amplification only through the optical fiber amplifier; and the laser is focused on a to-be-processed position of the transparent material, a focus position is moved, processing is carried out according to a set track, a focus point isgradually risen, and the transparent material is processed from bottom to up. According to the processing method, material removal efficiency can be greatly improved, a heating or etching follow-up procedure is not required, and bevel angles are avoided.