The invention relates to the field of
semiconductor technology, and proposes a method for passivating the cavity surface of a GaN-based EEL
laser chip, comprising the following steps: S1, cavity surface dehumidification: heating the cavity surface of a bar strip to remove the
moisture; S2, cavity
surface cleaning: continuing to increase the temperature, and introducing gas to bombard the cavity surface; S3, cavity surface annealing: continuing to increase the temperature, and introducing gas to bombard the cavity surface, and then annealing to form a
transition layer; the gas in steps S2 and S3 is one or more of O2, N2 and H2; S4, cavity surface
passivation: transferring the bar strip into a
passivation chamber, maintaining the annealing temperature, introducing one or more of O2, O3 or N2 to bombard the cavity surface, and forming an Al2O3, AlON or AlN
single crystal film on the surface of the
transition layer. The invention adopts high-temperature annealing to form a
transition layer on the cavity surface. Compared with CaN, the mismatch rate between the transition layer and Al2O3, AlON and AlN is lower, it is easier to grow a
single crystal film, and it will not cause light absorption of the cavity surface, thereby achieving the technical effect of increasing the cavity surface damage threshold and extending the service life of the
laser.