The invention discloses a method for manufacturing a
silicon substrate microcavity
laser device. The method for manufacturing the
silicon substrate microcavity
laser device comprises the steps that a
germanium layer is formed on the front face of a
silicon substrate in an extension mode by adopting an ultra-high vacuum
chemical vapor deposition method; the silicon substrate with the epitaxial
germanium layer is put in an MOCVD
reaction chamber, and a low-temperature nucleary
gallium arsenide layer and a high-temperature
gallium arsenide layer are grown in sequence respectively; a
laser device structure is formed in an extension mode after surface
polishing is carried out on the high-temperature
gallium arsenide layer; a mocrocavitie and an output
waveguide are formed on the laser device structure in a
drying etching mode; a
silicon dioxide layer is deposited after the mocrocavitie and the output
waveguide are formed, and an
electrode window is formed in the upper portion of the microcavity; positive electrodes are manufactured on the
silicon dioxide layer and the upper surface of the
electrode window, and
electrode isolation is carried out; a back electrode is manufactured on the back face of the silicon substrate, and the manufacturing of the device is completed. According to the method for manufacturing the silicon substrate microcavity laser device, high-quality III-V group
layers are achieved by combining the ultra-high vacuum chemical
vapor phase epitaxy and MOCVD, and the cleanness and leveling of the surface are achieved by
polishing and cleaning. The smooth side wall of the microcavity is achieved through
drying etching and wet
etching, and the losses of the laser device are reduced.