The application relates to the technical field of semiconductors, and particularly relates to a high-brightness red LED
chip for display and a manufacturing method thereof. The high-brightness red LED
chip for display comprises, from bottom to top, an AlN substrate, an Au bonding layer, an In bonding layer, a
barrier layer, a
silver mirror layer, a transparent conductive layer, a
silicon dioxide pattern layer, a
magnesium fluoride pattern layer, a P-type window layer, a P-type
transition layer, a P-type confinement layer, an MQW light-emitting layer, an N-type confinement layer, an N-type current expansion layer, an N-type
electrode protection layer and an N-type
ohmic contact layer; the
chip sidewall has a step
cutting path etched from the chip upper surface to the P-type window layer, the step
cutting path is locally widened on the opposite side of the N
electrode to form a step surface, the step surface is used for arranging the P
electrode, and the P electrode expansion pad is embedded in the transparent conductive layer; the above LED chip structure provided by the application has good current expansion uniformity, luminous brightness, heat dissipation and reliability.