The invention relates to a novel LED die bonding method which comprises the steps: firstly, coating a thin layer of die bonding glue on a bottom die bonding surface of a LED crystal particle fixing concave pit with a reflection layer on a metal base; after completion, placing the LED crystal particles at a base die bonding surface dispensed with die bonding glue, compacting and completing primary die bonding, then welding gold thread, coating fluorescent powder, and finally encapsulating by silica gel so as to wholly wrap LED crystal particles in the silica gel, thus completing final die bonding. The traditional LED carry out die bonding by the die bonding glue, while in the invention, only a thin layer of die bonding glue is coated for playing a role of primary die bonding, and finally the die bonding protection is carried out by encapsulating the silica gel. The method does not influence LED solid luminescence, and the light emitted from the periphery thereof is reflected out by the fixing concave pit, thus improving light extraction efficiency.