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44results about How to "Improve the exit rate" patented technology

LED chip electrode and fabrication method thereof

The invention discloses a fabrication method of an LED chip electrode. The fabrication method includes the following steps that: dry etching is performed on an epitaxial layer, an N type GaN layer is exposed; an indium tin oxide film conductive layer is fabricated; a chromium layer is formed through evaporation; a nickel layer is formed through evaporation; annealing treatment is performed on the nickel layer under a nitrogen atmosphere, so that the nickel layer can form uniformly-distributed spherical nickel particles on the surface of the chromium layer; with the spherical nickel particles adopted as an etching mask, the chromium layer is etched, so that nanoscale recessed rectangular pits can be formed on the surface of the chromium layer through etching; the spherical nickel particles are removed through corrosion; an aluminized layer, a titanium layer, a platinum layer and a gold layer are formed sequentially through evaporation; and glue is removed through peeling, and as a result, the LED chip electrode can be obtained. The invention also discloses an LED chip electrode; the LED chip electrode includes a chromium layer, an aluminum layer, an evaporation aluminum, a titanium layer, a platinum layer and a gold layer which are distributed sequentially from bottom to top; and nanoscale recessed rectangular pits can be formed on the surface of the chromium layer through etching. According to the LED chip electrode and the fabrication method thereof of the invention, the nanoscale lumpy structures can be formed on the surface of the chromium layer, so that the exitance of light on the surface of the chromium layer can be increased; light that is reflected into the chip by the aluminum layer and is further reflected out can be increased, and therefore, the luminous efficiency of an LED can be obviously improved.
Owner:XIANGNENG HUALEI OPTOELECTRONICS

Double-sided electroluminescent display panel and display device

The invention discloses a double-sided electroluminescent display panel and a display device. The display panel comprises a first absorption polarization structure arranged on a first light-emitting face of a transparent EL structure, and a first reflection polarization structure arranged on a second light-emitting face of an EL structure, wherein the homology axis of the first absorption polarization structure and the homology axis of the first reflection polarization structure are perpendicular to each other, the first absorption polarization structure is used for absorbing light of a first wave component and transmitting light of a second wave component, and the first reflection polarization structure is used for transmitting light of the first wave component and reflecting light of the second wave component. Through the common effect of the first absorption polarization structure and the first reflection polarization structure, the intensity of environment light can be weakened when the high emission ratio of self-illumination is ensured, the contrast ratio of the double-sided display panel is increased, the influences of environment light on the double-sided display panel are reduced, and the problem that an existing double-sided display panel is low in contrast ratio due to the transparent EL structure is solved.
Owner:BOE TECH GRP CO LTD +1

Transparent conducting layer manufacturing method for increasing light emitting diode chip brightness

The invention discloses a transparent conducting layer manufacturing method for increasing light emitting diode chip brightness. The method comprises following steps: etching a light emitting diode chip epitaxial layer through a dry method preparing a tin indium oxide film conducting layer on the epitaxial layer; preparing a nickel layer with thickness from 5 to 10 nm on the tin indium oxide film conducting layer by a vapor plating method; performing annealing to the nickel layer; forming uniformly distributed spherical nickel particles on the tin indium oxide film conducting layer surface; etching the tin indium oxide film conducting layer with the spherical nickel particles as a mask layer to form uniform concave rectangular pits on the tin indium oxide film conducting layer surface; removing the spherical nickel particles; coating the tin indium oxide film conducting layer with negative photoresist and exposing electrode zones after exposure and development; preparing metal electrodes at the electrode zones by means of the vacuum electron beam evaporation method; peeling the metal electrodes to obtain light emitting diode chip electrodes and removing the negative photoresist. By means of the method, the brightness of light diode chip is increased.
Owner:XIANGNENG HUALEI OPTOELECTRONICS

Gan-based light-emitting diode with nanoscale silicon dioxide grating passivation layer and its processing method

ActiveCN108461593BImprove the exit rateBreak the total reflection interfaceSemiconductor devicesGratingNucleation
The invention discloses a GaN-based LED (Light Emitting Diode) having a nano-sized SiO2 grating passivation layer, and a processing method thereof. The GaN-based LED comprises a substrate and an epitaxial layer, wherein the epitaxial layer comprises an AIN nucleation layer, a GaN buffer layer, an n-type GaN layer, an InGaN / GaN superlattice layer, an In0.16Ga0.84N multiple quantum well layer, a p-AlGaN / GaN electronic blocking layer and a p-type GaN layer; a part of the epitaxial layer is etched to the n-type GaN layer, an un-etched part of the epitaxial layer forms a comb-shaped raised structure, the etched part of the epitaxial layer forms a comb-shaped groove structure matched with the comb-shaped raised structure; the p-type GaN layer is provided with an IOT layer, a SiO2 passivation layer and a P electrode thereon, the exposed n-type GaN layer after etching is provided with an N electrode, the SiO2 passivation layer is deposited between the N electrode and the n-type GaN layer, theSiO2 passivation layer is deposited on a sidewall of the raised structure; the ITO layer and the SiO2 passivation layer have graphical through-hole structures of which shapes are evenly distributed along the P electrode or the N electrode. The GaN-based LED of the invention has the beneficial effects that: the surface of the LED is protected, generation of a leakage current is limited, at the sametime, a current is expanded, current gathering is reduced, and luminous efficiency is improved.
Owner:JIANGXI ZHAO CHI SEMICON CO LTD

Deep ultraviolet LED with high external quantum efficiency and production method thereof

The invention relates to a deep ultraviolet LED with high external quantum efficiency and a production method thereof. The deep ultraviolet LED comprises a patterned sapphire substrate, the upper surface and the lower surface of the patterned sapphire substrate are respectively provided with a micro-dome-shaped structure arranged in a regular hexagonal array shape, the upper surface of the patterned sapphire substrate is provided with an epitaxial lamination layer, the epitaxial lamination layer is provided with an mesa step exposing an n-AlGaN layer, and a nano-particle array of an Al-SiO2 core-shell structure is arranged on the side, close to the multiple quantum wells in the epitaxial laminated layer, of the surface of the n-AlGaN layer. By using the micro-dome type patterned sapphire substrate which is symmetrical up and down, the light emitting probability can be improved, the light extraction efficiency can be increased, the defect density of the AlGaN epitaxial layer can be reduced, the non-radiative recombination can be decreased, and the internal quantum efficiency can be improved; and the nano-particle array resonates with photons emitted by an LED through the local surface plasmon resonance effect of Al nanoparticles so that the field intensity near a quantum well is enhanced, and the internal quantum efficiency is improved.
Owner:SOUTH CHINA NORMAL UNIVERSITY

Method for making transparent conductive layer for improving brightness of light-emitting diode chip

The invention discloses a transparent conducting layer manufacturing method for increasing light emitting diode chip brightness. The method comprises following steps: etching a light emitting diode chip epitaxial layer through a dry method preparing a tin indium oxide film conducting layer on the epitaxial layer; preparing a nickel layer with thickness from 5 to 10 nm on the tin indium oxide film conducting layer by a vapor plating method; performing annealing to the nickel layer; forming uniformly distributed spherical nickel particles on the tin indium oxide film conducting layer surface; etching the tin indium oxide film conducting layer with the spherical nickel particles as a mask layer to form uniform concave rectangular pits on the tin indium oxide film conducting layer surface; removing the spherical nickel particles; coating the tin indium oxide film conducting layer with negative photoresist and exposing electrode zones after exposure and development; preparing metal electrodes at the electrode zones by means of the vacuum electron beam evaporation method; peeling the metal electrodes to obtain light emitting diode chip electrodes and removing the negative photoresist. By means of the method, the brightness of light diode chip is increased.
Owner:XIANGNENG HUALEI OPTOELECTRONICS

Method for enhancing internal quantum efficiency of ultraviolet LED through femtosecond laser

The invention relates to a method for enhancing the internal quantum efficiency of an ultraviolet LED through femtosecond laser, which belongs to the technical field of semiconductor optoelectronic devices. According to the method, the femtosecond laser beam is used for processing on the surface of the GaN-based LED, the Ga nano-particles are obtained through single-point ablation in an oblique incidence mode, and the GaN-based LED internal quantum efficiency in the ultraviolet band is improved based on surface plasmon excimer excitation regulation and control. The method is simple and easy to implement, single-pulse processing is carried out through oblique incidence of femtosecond laser under the condition that new metal impurities are not introduced, and the material is induced to generate coulomb explosion phase change by utilizing the high peak density of the femtosecond laser and the high-temperature decomposition characteristic of the GaN material, so that the metal Ga nano-particles are formed, and large-area efficient processing can be achieved; and finally, the photoluminescence (PL) intensity and the internal quantum efficiency of the ultraviolet band are effectively enhanced, and the method can be widely applied to the fields of medical sterilization, secret communication and the like.
Owner:BEIJING INSTITUTE OF TECHNOLOGYGY
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