48 results about "Tube socket" patented technology

The invention provides an electronic tube socket, a manufacturing method and a performance testing method thereof. An electronic tube socket comprises an alloy bottom layer and a metal top layer, and the metal top layer is plated on the alloy bottom layer. Through the design of the alloy bottom layer and the metal top layer, the production cost is obviously reduced while various performance indexes of the electronic tube socket are met. The problem that an existing gold-plated tube socket is too high in cost is solved.

The utility model discloses a packaging tool for a high-performance MEMS pressure sensor chip, which comprises a base, a tube socket fixing assembly and a vertical movable assembly, the base is used for bearing the tube socket fixing assembly and the vertical movable assembly, the tube socket fixing assembly is used for fixing a packaging tube socket, the vertical movable assembly can move horizontally and vertically relative to the base, and the tube socket fixing assembly is used for fixing the packaging tube socket. Therefore, the flattening operation of the MEMS pressure sensor chip in the packaging tube socket is realized. According to the packaging tool provided by the utility model, the height of the chip chamber wall is matched with the structures of the flattening column and the horizontal arm, so that the thickness of the fixing glue is accurately controlled, and the consistency of the thickness of the fixing glue is ensured; fixing glue is prevented from diffusing to the vent holes through the anti-overflow columns, and the vent holes are prevented from being blocked; the tube socket cavity can be matched with products with different sizes or shapes through the lining, so that the packaging efficiency is improved; an anti-static gasket on the bottom surface of the flattening column avoids mechanical and static damage to the chip; positioning and pressing are achieved through horizontal sliding and vertical pressing, the operation difficulty is reduced, and the packaging yield is improved.

The invention discloses a CRDM tube socket external thread positioning and electric spark machining device, method and system, and relates to the technical field of nuclear power plant CRDM tube socket external thread machining. The machining device comprises a driving platform assembly, a machining liquid tank, an electrode driving device, an electrode set and a clamping assembly. Two electrode sets are arranged in the machining fluid tank and used for conducting formed thread rough machining and formed thread finish machining on a pipe base to be machined respectively, and each electrode set comprises two semi-separated thread electrodes oppositely arranged in the radial direction of the machining fluid tank. Four electrode driving devices are arranged between the driving platform assembly and the machining fluid tank, and each electrode driving device is connected with the corresponding semi-separation type thread electrode and used for driving the semi-separation type thread electrode to move in the radial direction of the machining fluid tank. According to the invention, the stability, the success rate and the efficiency of positioning work can be improved, and the efficiency and the precision of machining the external threads of the tube socket can be improved.

The invention discloses a To tube socket and TEC packaging method, and belongs to the technical field of electronic packaging. The method comprises the following steps: firstly, carrying out fine cleaning treatment on a TO tube socket and TEC to remove surface impurities and oxides; a brazing filler metal with a specific formula and a scaling powder matched with the brazing filler metal are selected, a brazing temperature curve is accurately controlled, and brazing operation is carried out in a proper protective gas atmosphere. Precise positioning and fixing are achieved through a special clamp, and the accuracy and stability of connection of the two are ensured. After welding is completed, whether defects exist or not is detected through appearance inspection. The method effectively improves the packaging quality and reliability, and has a wide application prospect.

The invention relates to a connection device for an internally cooled cable, in particular a high-voltage cable. The invention further relates to a cable system with an internally cooled cable and such a connection device. An embodiment of the connection device (100) comprises: an outer cable receptacle (160) for connection to the internally cooled cable (1000); and an inner, at least partially tubular, hose receptacle (120), in particular a capillary, arranged at least partially in the outer cable receptacle (160), for receiving at least a section of a cooling hose (1200) arranged in the internally cooled cable (1000).

The application discloses a tube base clamping and positioning eutectic device for an eutectic machine, which comprises a tube base configuration assembly and a tube base clamping and positioning assembly. The tube base configuration assembly comprises a heating base and a tube base positioning seat, and the tube base positioning seat is provided with a eutectic cavity. The tube base clamping and positioning assembly comprises a tube base radial positioning mechanism and a tube base axial positioning mechanism. The tube base radial positioning mechanism is provided with a radial positioning driving part and a radial positioning block, and the tube base axial positioning mechanism is provided with an axial positioning driving part and an axial positioning block. When the eutectic part of the tube base is inserted into the eutectic cavity through a tube base configuration opening, the radial positioning block is driven by the radial positioning driving part to abut against a seat body second clamping hole arranged on the outer periphery of the seat body of the tube base, so that the radial positioning of the tube base is realized. Then, the tube base axial positioning block is driven by the axial positioning driving part to abut against the seat body, so that the side of the seat body close to the eutectic part abuts against the outer periphery of the tube base configuration opening, and the axial positioning of the tube base is realized.

The invention discloses a constant-temperature connector suitable for flywheel energy storage, and relates to the technical field of electric connectors, the constant-temperature connector comprises a socket shell and a plug shell, a conductive core is arranged in the socket shell, a conductive plate is arranged in the plug shell, a jack is formed in the conductive core, and a heat pipe is inserted in the jack; hooks capable of being connected with the plug shell are arranged on the two sides of the socket shell in a sliding mode, a U-shaped pulling rod used for controlling the height of the hooks is further arranged on the outer side of the socket shell, a plug pin used for positioning the U-shaped pulling rod is arranged on the U-shaped pulling rod, and a reverse pushing ejector block capable of pushing the plug pin outwards in the case of overheating is arranged in the socket shell. The conductive core can be cooled through the heat pipe, the plug pin can be pushed out through the reverse pushing ejector block when the conductive core is overheated, secondary protection is achieved, large-area and low-resistance tight electric connection is formed through double-face clamping contact between the wedge-shaped part and the hinged conductive plate and under the pressure of the spring, poor contact caused by vibration is effectively resisted, and the service life of the conductive core is prolonged. The conductive effect is ensured.

This invention relates to the field of electron tube socket technology and discloses a tensile-resistant electron tube socket for precision electronic components and its processing technology, solving the current problem of inconvenience in leading out the cathode of the electron tube die column. It includes a base, with an electron tube die column at the bottom and a glass tube at the top. The base has multiple insertion holes, and multiple electron tube cathode pins are fixedly connected to the bottom of the electron tube die column. Each electron tube cathode pin is inserted into its respective insertion hole. The base has a groove containing a fixing mechanism, a protective mechanism, and a locking mechanism. The fixing mechanism includes a guide post fixed in the groove, and a bidirectional lead screw rotatably connected to the groove below the guide post. Two nuts are symmetrically threaded onto the outer side of the bidirectional lead screw. This invention allows the base block to be pushed upwards, facilitating the disengagement of the electron tube cathode pins from the insertion holes, thereby facilitating the lead-out of the electron tube die column cathode.

The invention discloses a packaging tool for a high-performance MEMS pressure sensor chip and a using method thereof.The packaging tool comprises a base, a tube base fixing assembly and a vertical movable assembly, the base is used for bearing the tube base fixing assembly and the vertical movable assembly, the tube base fixing assembly is used for fixing a packaging tube base, and the vertical movable assembly is used for fixing the packaging tube base; and the vertical movable assembly can horizontally move and vertically move relative to the base so as to flatten the MEMS pressure sensor chip in the packaging tube socket. According to the packaging tool, the height of the chip chamber wall is matched with the structures of the flattening column and the horizontal arm, so that the thickness of the fixing glue is accurately controlled, and the consistency of the thickness of the fixing glue is ensured; fixing glue is prevented from diffusing to the vent holes through the anti-overflow columns, and the vent holes are prevented from being blocked; the tube socket cavity can be matched with products with different sizes or shapes through the lining, so that the packaging efficiency is improved; an anti-static gasket on the bottom surface of the flattening column avoids mechanical and static damage to the chip; positioning and pressing are achieved through horizontal sliding and vertical pressing, the operation difficulty is reduced, and the packaging yield is improved.

The utility model belongs to the technical field of high-speed optical communication application, and discloses a vertically packaged TO-CAN assembly with a refrigerator, the TO-CAN assembly comprises a 7PIN tube socket and a tube cap sealing cap, the top of the 7PIN tube socket is provided with a TO tube socket boss, the side surface of the TO tube socket boss is pasted with a second TEC, the side surface of the second TEC is pasted with a second LD substrate, and the top of the second TEC is provided with a second LD substrate. A TO tube base boss is attached to the top of the second LD substrate, a second MPD is attached to the side face of the second LD substrate, an AC circuit in the second LD substrate is directly bonded with an AC pin through a gold wire, a tube cap sealing cap is arranged at the top of the 7PIN tube base, and the tube cap sealing cap packages the TO tube base boss, the second MPD and a thermistor fixed in the second LD substrate at the top of the 7PIN tube base. The utility model has the beneficial effects that the routing distance from the high-speed AC PIN to the substrate is shorter, the gold wire consumption is lower, and the key point is that the TEC directly adopts a vertical packaging mode, so that a low-cost tube socket can be adopted, a tube socket preset adapter plate is omitted, and the cost of the tube socket is greatly reduced.

The invention relates to a heat exchanger (1), in particular for heating up, heating and / or evaporating a fluid, said heat exchanger (1) comprising a heat exchanger tube (2) and a plurality of tubes (10) penetrating the heat exchanger tube (2) and being spaced apart from each other, wherein the heat exchanger tube (2) has double the number of openings (5, 6) based on the number of tubes (10), wherein each tube (10) is guided through two of these openings (5, 6), and wherein the tubes (10) are connected to the heat exchanger tube (2) on both sides via their end tube sockets (11, 12).

The invention discloses a universal intelligent drop-out fuse which is composed of an insulating outer tube, a fuse wire, a tube socket, a conductive cap and a connecting seat, rotating arms are symmetrically arranged on the left side and the right side of the connecting seat, and the upper ends of the rotating arms are coaxially and rotatably connected with the tube socket and the connecting seat through rotating pin shafts. A connecting rod is transversely arranged in the middle of the rotating arm, a limiting swing groove is formed in the connecting base, the rotating arm and the connecting base conduct limiting and resetting movement through the connecting rod, and the rotating arm is fixedly connected with the connecting base in a limiting mode through a plug pin and a limiting pin hole. Compared with the prior art, the structure is simpler and more reliable, the conductive effect is good, the failure rate is low, the requirements of the power grid industry are met, remote control over the fuse is achieved, resetting and self-locking of the rotating arm and the connecting base can be completed in the fuse falling process, convenience is achieved, the fuse is subjected to universal design, and the practicability is high. And the fuse can be matched with insulators of different manufacturers for use.

The invention discloses a tube socket and a processing technology thereof, and relates to the technical field of electronic components. Wherein the tube seat comprises a substrate I, a substrate II, a silver welding layer, a pin and a glass insulating ring. And the substrate I is made of a copper-based material. The first substrate comprises a first sheet layer and a copper column integrally connected with the first sheet layer. The first sheet layer is provided with a first hole. The second substrate is made of iron-based alloy matched with glass sealing and comprises a second sheet layer and an insertion tube integrally connected with the second sheet layer. The second sheet layer is provided with a second hole and a third hole. And the intubation tube is communicated with the hole II and is inserted and positioned with the hole I. The copper column penetrates through the third hole, and a gap is reserved between the copper column and the inner wall of the third hole. The first sheet layer and the second sheet layer are welded and connected through the silver welding layer. And the plurality of pins pass through the substrate I and the substrate II at the same time through the corresponding holes II and the insertion tubes. And the glass insulating ring is connected to an annular gap between the substrate II and the pin in a sealing manner. Compared with the prior art, the tube socket and the processing technology thereof have the advantage that both air tightness and heat dissipation performance can be realized.

An overheating through-wall pipe device comprises a wall, a header pipe base arranged on the wall, a through-wall pipe and a sealing box, one end of the through-wall pipe is welded and fixed to the header pipe base, the sealing box is arranged, one part of the sealing box is fixed to the header pipe base, and the other part of the sealing box protrudes out of the wall. The through-wall pipe penetrates through the sealing box and is welded with the header pipe seat, and the sealing box is filled with high-aluminum refractory castable. The sealing box structurally reinforces the header tube socket, and further damage caused by stress change can be reduced. The phenomenon of stress concentration at the header tube socket can be dispersed and relieved, so that the risk of breakage of the header tube socket is reduced. The sealing box can effectively prevent steam at the position of the superheater header pipe base from leaking, working steam can be prevented from leaking due to the broken header pipe base and the broken through-wall pipe, it is guaranteed that steam in the through-wall pipe at the position of the header pipe base cannot leak through the good sealing performance of the sealing box, and therefore safe operation of a boiler is guaranteed.

The utility model discloses cutting equipment for producing and processing a gas chromatograph, which belongs to the technical field of gas chromatograph processing, and comprises a workbench, two pipe sockets are fixed on the top surface of the workbench, a cutting blade is arranged right above a notch, end sleeve seats are fixed at the end parts of the two pipe sockets, and the end sleeve seats are fixed on the top surface of the workbench. A jack communicated with the interior of the pipe socket is formed in each end sleeve seat in a penetrating manner, a wrapping and clamping assembly is arranged in each end sleeve seat, and a rotary adjusting assembly is connected to each wrapping and clamping assembly; a pipe is symmetrically and stably clamped through hydraulic pressure through the two sets of clamping assemblies, the pipe is comprehensively fixed and limited at multiple positions through cooperation of the pipe socket and the two sets of clamping assemblies, the stability of pipe fixing and limiting is greatly improved, the pipe is prevented from shaking in the cutting process, and the cutting efficiency is improved. The pipe cutting precision is effectively improved, the flatness of the cut section of the pipe is improved, the overall cutting quality of the pipe is improved, and it is ensured that cutting machining is high in efficiency.

The utility model discloses a TO packaging structure of a photoelectric detector. The packaging structure comprises a metal shell, a light window arranged at the top of the shell, a tube socket fixed at the bottom of the shell, and a detector chip arranged on the tube socket. The micro-lens array is integrated on the inner surface of the light window, and the focus of the micro-lens array coincides with the light-sensitive surface of the detector chip. The micro-lens array is composed of hexagonal convex lens units which are closely arranged and covers a light-transmitting area of the light window, and efficient convergence of incident light is achieved. The light window is of a double-layer structure and comprises an outer plane glass layer and a hot-melting integrated micro-lens array layer, and the risk of failure of a gluing interface is avoided. The light window is hermetically connected with the metal shell through the annular welding part, and the micro-lens array is located on the inner side of the annular welding part to ensure the stability of an optical path. A signal pin on the tube socket is connected with a chip electrode through a gold wire, and a gold wire bridging path is located below the focus of the micro lens, so that incident light is prevented from being shielded.

The invention discloses a method, a device, equipment and a medium for determining the structural size of a lower tube socket of a fuel assembly, and relates to the technical field of nuclear reactor fuel assemblys.The method comprises the steps that parametric modeling is conducted on the lower tube socket of the fuel assembly, and a three-dimensional model of the lower tube socket is obtained; based on the three-dimensional model of the lower tube socket, calculating first performance parameters corresponding to mechanical bearing, flow resistance and foreign matter filtering of the lower tube socket under the first structure size data set; utilizing a Kriging agent model to predict second performance parameters corresponding to mechanical bearing, flow resistance and foreign matter filtering of the lower tube socket under the second structure size data set based on the first structure size data set and the first performance parameters; and screening a target structure size data set of the lower tube socket from the first structure size data set and the second structure size data set by using a particle swarm optimization algorithm based on the first performance parameter and the second performance parameter. According to the invention, the optimal structure size and comprehensive performance of the lower tube socket can be comprehensively, accurately and efficiently obtained.

The utility model provides a packaging shell and a functional module. The packaging shell comprises a tube socket, a plurality of inner cover plates, an outer cover plate and a leading-out end, the tube base is provided with a plurality of first containing grooves and second containing grooves which are formed through separation of separation walls. The inner cover plate and the outer cover plate are matched to form a plurality of first cavities and second cavities. The first cavity is used for arranging a photoelectric coupling unit; the second chamber is used for arranging a processing circuit. An optocoupler mounting area and a plurality of optocoupler metallization areas are arranged in the first cavity; a plurality of processing circuit metallization areas are arranged in the second cavity and / or at the top of the peripheral isolation wall of the second cavity; part of the optocoupler metallization areas and part of the processing circuit metallization areas are electrically connected with each other, and part of the optocoupler metallization areas and part of the processing circuit metallization areas are electrically connected with the leading-out end. A plurality of mutually isolated cavities are formed in a tube shell, a coupling device and a front / rear-stage processing circuit are respectively arranged, and the coupling device and the front / rear-stage processing circuit are integrally arranged in one tube shell, so that the overall size is reduced, and the occupied space is reduced.

The utility model relates to the technical field of die bonders, and discloses a reversible workbench and a die bonder, the reversible workbench is used for assisting the die bonder to complete wafer pasting of a tube socket in a material tray, the reversible workbench comprises a reversible clamping table, the reversible clamping table comprises bearing seats arranged on two sides of a bottom plate, the interiors of the bearing seats are connected with rotating shafts through bearings, the rotating shafts are externally provided with cushion blocks, and the cushion blocks are arranged on the bottom plate. A vacuum plate is arranged outside the cushion block, a connecting base is arranged on the same side of the end, away from the cushion block, of the vacuum plate, a rail and a third air cylinder are arranged on the bottom plate, a sliding block is arranged on the rail in a sliding mode, the pipe base is fixed through the workbench, the workbench can be turned over to enable the pipe base to incline, and the inclined face of the pipe base is made to be horizontal relative to the horizontal plane. And a chip is fixed on the inclined surface of the tube socket.

This invention provides a collimated light source based on COB packaging, including a PCB circuit board, a light-emitting chip, an all-plastic aspherical collimating lens, and connecting pins. The PCB circuit board has a negative electrode connection part and a preset pad (8). The light-emitting chip is fixed to the preset pad through a die bonding process, and a conductive path is formed between the light-emitting chip, the preset pad (8), and the negative electrode connection part by gold wire bonding. The PCB circuit board has an integrally formed heat dissipation structure. The all-plastic aspherical collimating lens is fixed on the PCB circuit board corresponding to the light emission direction of the light-emitting chip. The connecting pins are fixed to the edge of the PCB circuit board for electrical connection with external circuits. The advantages of this invention are: no need for gold-plated tube sockets and special equipment, the PCB can be customized, significantly reducing costs, the heat dissipation structure of the integral molding is equivalent to that of TO packaging, avoiding light decay, the integrated design eliminates the need for secondary assembly, high efficiency, adaptability to multiple types of chips, and wide applicability.

This application relates to an automated packaging device for laser production, belonging to the field of laser packaging technology. It includes a material tray, a temperature control hood, a sealing head, a clamping assembly, a positioning assembly, and a temperature control device. The material tray has several slots for accommodating tube sockets. The temperature control hood covers the material tray and isolates the tube sockets from external dust. The sealing head aligns and welds the tube sockets and caps. The clamping assembly clamps the tube sockets on the material tray to the lower electrode position and the caps to the upper electrode position. The positioning assembly adjusts the tube sockets to align with the caps. The temperature control device includes a temperature sensor and a heating assembly disposed within the temperature control hood. The temperature sensor monitors the temperature inside the temperature control hood and controls the heating assembly to raise the temperature inside the hood. This application effectively increases the temperature inside the temperature control hood, reduces the embrittlement of laser tube sockets in low-temperature environments, and ensures the performance of the laser tube sockets.

The utility model provides an optical isolation switch with high assembly density. The optical isolation switch comprises a ceramic tube shell. The bottom of the ceramic tube shell is processed into a plurality of steps, and metallization areas with the same number and corresponding positions are processed on each step; according to the utility model, the photovoltaic diodes are installed on the substrate, and the structure is opposite to a traditional installation mode, so that the risk of electric connection is reduced, and the reliability of the optical isolation switch is improved; through the optimized structural design of the high-low lamination and the cavity isolation wall on the tube socket, each path of the tube socket part of the optical isolation switch can be provided with two field-effect tube areas to realize the use of a unidirectional switch and a bidirectional switch in the same tube shell, and electrical isolation with a light emitting diode at an input side is realized. Therefore, the size of the optical isolation switch is greatly reduced, and the power density of the optical isolation switch is improved.

The invention discloses a high-heat-dissipation semiconductor packaging tube socket, belongs to the technical field of electronic device packaging, and aims to solve the technical problem that an existing TO packaging tube socket cannot give consideration to high heat dissipation and reliable air tightness at the same time. The tube socket comprises a device body with copper as the main component and a base body with iron as the main component, the base body is provided with a vertically-through communicating groove and a built-in step, a protrusion of the device body penetrates through the communicating groove and forms a welding flux containing groove with the step, and the device body and the step are fixedly connected through welding flux in the groove. The base body is provided with two first through holes, a first lead and a second lead are arranged in the first through holes and are sealed and fixed through a glass connecting part, the device body is correspondingly provided with a second through hole with a larger diameter, and the periphery of the base body is also provided with a positioning structure. According to the scheme, rapid heat dissipation is achieved by means of high thermal conductivity of a copper-based material, airtightness is guaranteed through a mature sealing process of an iron-based material, solder overflow is avoided through a solder containing groove, the assembly precision is improved through a positioning structure, the overall structure integrates high heat dissipation, high airtightness and excellent manufacturability, the use requirement of a high-power electronic device can be met, and the service life of the electronic device is prolonged. The service life of the device is effectively prolonged.

The utility model discloses an AF quadratic element tube socket measuring jig, and relates to the technical field of TO-CAN communication laser manufacturing, the AF quadratic element tube socket measuring jig comprises a jig body and a through hole, the jig body is made of an aluminum alloy material, and the through hole is located in the middle of the jig body. The jig body is made of A6061 imported aluminum alloy materials for anodic oxidation black process, stress corrosion cracking tendency is avoided, corrosion resistance is excellent, the problem of measurement errors caused by corrosion and abrasion of the jig body is avoided, meanwhile, double-row design is adopted for the through holes, 10 PCS hole positions are arranged in each row, 20 PCS elements to be tested can be fixed and detected at the same time, and the test efficiency is improved. The production efficiency is greatly improved, the concave-convex parts on the through holes and the concave-convex parts on the tube socket are mutually embedded, so that the structure of the fixture is firm, the fixture can be effectively attached to the tube socket to be measured, and the center of the tube socket and the center of each through hole in the fixture body are kept at the same position.

This invention discloses a laser chip assembly position correction mounting device and its usage method, including a robotic arm, a gripping device, a CCD camera, a point laser emitter, a photodetector, a TO tube socket, and a tube tongue. The gripping device and CCD camera are both vertically positioned and fixed adjacent to each other on the robotic arm. The CCD camera is located on the right side of the gripping device, and the gripping device is capable of horizontal rotation. Several photodetectors are symmetrically distributed on both sides of the point laser emitter in the horizontal direction, with each side's photodetectors extending outwards sequentially. The laser emitted by the point laser emitter is perpendicular to the vertical plane where the photodetectors are located. The tube tongue is fixed to the TO tube socket, and the horizontal tube tongue and the point laser emitter are located on the same axis. This invention effectively solves the problems of existing packaging technologies, such as the tendency for manual calibration of COS mounting positions to lead to die contamination, low efficiency, and high cost.

The utility model discloses a high-precision airtight electronic tube socket, which relates to the technical field of electronic tube sockets, and comprises an electronic tube socket body, the bottom of the electronic tube socket body is fixedly connected with a pin, the top of the electronic tube socket body is provided with a pin jack, and the top of the electronic tube socket body is provided with a limit slot. According to the utility model, through the arrangement of the limiting assembly, when the limiting column at the bottom of the electron tube is inserted into the limiting slot arranged at the top of the electron tube socket body, the extruded limiting spring restores the elastic performance, the sliding block drives the limiting plate to move, and the limiting column at the bottom of the electron tube can be limited and fixed in cooperation with the rubber pad; according to the electronic tube socket, the problems that the electronic tube slightly rotates above the electronic tube socket body under the action of external force in the use process of the electronic tube, the pins of the electronic tube are easy to bend due to rotation, and the pins of the electronic tube are damaged are solved, so that the protectiveness of the electronic tube is improved.

The utility model relates to a high-power TO device, which is characterized in that a tube socket is provided with a semiconductor cooler TEC, the semiconductor cooler TEC is provided with a tungsten copper block, the tungsten copper block is L-shaped, the lower end face of the tungsten copper block is attached to the semiconductor cooler TEC, a laser chip is arranged on the vertical face of the tungsten copper block in a dispensing manner, the tungsten copper block is provided with a collimating lens above the laser chip, and the collimating lens is connected with the laser chip. A converging lens is arranged in the laser through hole in the tube cap; after the scheme is adopted, the chip is arranged on the vertical face of the tungsten copper block, the collimating lens is tightly attached to the upper portion of the chip, more light emitted by the chip can be converged to the converging lens and transmitted to the optical fiber, the light loss is small, and the assembly coupling power is high.

The utility model provides a CRDM tube socket welding position monitoring device, and relates to the CRDM tube socket welding technology field, the CRDM tube socket welding position monitoring device is used for monitoring the position of a tube socket relative to the axis of a top cover, the top cover is provided with a first through hole for the tube socket to pass through, the CRDM tube socket welding position monitoring device comprises a support device, a displacement sensor and a display, the displacement sensor is arranged on the support device, a telescopic probe of the displacement sensor makes contact with the peripheral side wall of the bottom end of the tube base, the displayer is arranged at the position, close to the top end of the tube base, of the top cover, and the displacement sensor is electrically connected with the displayer. After the telescopic probe of the displacement sensor monitors the position change of the bottom end of the tube socket, the change information can be transmitted to the display, and the display is located at the welding position, close to the top end of the tube socket, of the top cover, so that a welder can check the position degree change condition of the tube socket during welding, and the welding efficiency is finally ensured; and the position precision after the tube seat and the top cover are welded is ensured.

The invention relates to a semiconductor device. The purpose of the present disclosure is to provide a semiconductor device capable of easily electrically connecting a signal line and a wiring pattern. This semiconductor device is provided with: a semiconductor module; a socket on which the semiconductor module is mounted, the socket having a socket protrusion protruding toward the same side as the semiconductor module; a bridge substrate disposed on an upper surface of the header protrusion; a pin; and an engagement block. The tube socket is provided with a through hole penetrating from a main surface having the tube socket protruding part to an opposite surface of the surface. The pin has a pin protruding portion that passes through the through-hole and protrudes toward the same side as the base protruding portion. The bonding block is solder-bonded to the bridge substrate on the first surface and solder-bonded to the lead protrusion on the second surface. The bridge substrate and the lead are electrically connected via the bonding block. The melting point of the solder used for solder bonding is lower than the melting point of the bonding block.

This utility model discloses an in-service crack monitoring device for CRDM tube sockets, belonging to the field of CRDM tube socket technology. Its key technical features include a top cover, a base welded to the top of the top cover, a fixing ring welded to the top of the top cover, a rotating ring rotatably connected to the top of the outer circumference of the fixing ring, and a mounting base fixed to the top of the rotating ring by bolts. An ultrasonic probe is provided on one side of the mounting base, and a power assembly for driving the ultrasonic probe to reciprocate. This utility model utilizes the ultrasonic probe, rotating once clockwise and once counterclockwise, performing two detections to greatly avoid detection blind spots and prevent the ultrasonic probe's wiring from tangling. Regular inspection of the weld between the base and the top cover achieves weld point monitoring, thereby reducing the probability of radioactive material release and improving the safety of the reactor vessel.