The invention discloses a high-heat-dissipation
semiconductor packaging tube socket, belongs to the technical field of electronic device packaging, and aims to solve the technical problem that an existing TO
packaging tube socket cannot give consideration to
high heat dissipation and reliable
air tightness at the same time. The
tube socket comprises a device body with
copper as the main component and a base body with iron as the main component, the base body is provided with a vertically-through communicating groove and a built-in step, a protrusion of the device body penetrates through the communicating groove and forms a
welding flux containing groove with the step, and the device body and the step are fixedly connected through
welding flux in the groove. The base body is provided with two first through holes, a first lead and a second lead are arranged in the first through holes and are sealed and fixed through a glass connecting part, the device body is correspondingly provided with a second through hole with a larger
diameter, and the periphery of the base body is also provided with a positioning structure. According to the scheme, rapid heat dissipation is achieved by means of high
thermal conductivity of a
copper-based material, airtightness is guaranteed through a mature sealing process of an iron-based material, solder overflow is avoided through a solder containing groove, the
assembly precision is improved through a positioning structure, the overall structure integrates
high heat dissipation, high airtightness and excellent manufacturability, the use requirement of a high-power electronic device can be met, and the service life of the electronic device is prolonged. The service life of the device is effectively prolonged.