Silicon-based airtight packaging casing

An encapsulation shell and airtightness technology, which is applied in the airtight packaging field of MEMS chips, can solve the problems of high process temperature and high packaging cost, and achieve the effects of simple process, low cost and long cycle.

Inactive Publication Date: 2012-07-18
HUAZHONG UNIV OF SCI & TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In the ceramic packaging process, ceramics and metallized patterns must be sintered at high temperature, the process temperature is high, and the packaging cost is relatively high

Method used

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  • Silicon-based airtight packaging casing
  • Silicon-based airtight packaging casing
  • Silicon-based airtight packaging casing

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specific Embodiment approach

[0020] The present invention adopts monocrystalline silicon as the base and cap material of airtight packaging, which can realize low-cost MEMS chip airtight packaging, and its specific implementation is as follows:

[0021] Such as figure 1 As shown, the stem 1 is a monocrystalline silicon wafer with a groove, and the bottom of the groove has a through hole. The signal channel 4 is formed after the through hole is plated. There are pads at both ends of the signal channel 4, and a pad 7 is made on the side of the groove for wire bonding with the MEMS chip to conduct the signal; at the bottom of the tube base (the side without the groove), a Pad 8.

[0022] The overall thickness of the monocrystalline silicon wafer is between 600 μm and 800 μm; the depth of the groove is between 200 μm and 300 μm. The groove is processed by anisotropic wet etching, and the bottom of the groove is chemically mechanically polished for Stick the chip to be packaged on the tube socket; the bott...

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PUM

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Abstract

The invention discloses a silicon-based airtight packaging casing structure, which is made of monocrystalline silicon for airtight packaging for an MEMS (micro-electromechanical system) chip. The casing comprises a tube socket and a cap, the tube socket is a monocrystalline chip with a socket, through holes are reserved at the bottom of the socket, conductive metal is plated in the trough holes, the through holes serve as signal TSVs (through silicon vias), the MEMS chip to be packaged is placed in the socket, and the cap which is a monocrystalline silicon chip is bonded to the tube socket by means of silicon-silicon direct bonding or eutectic bonding. Silicon serving as airtight seal material can be used for airtight connection. High-temperature sintering process for the silicon-based airtight packaging casing is omitted, so that packaging cost can be lowered.

Description

technical field [0001] The invention belongs to the technical field of MEMS packaging, and in particular relates to a silicon-based airtight packaging shell, which is used for the airtight packaging of MEMS chips. Background technique [0002] Packaging technology has always been one of the key technologies that plague the development and practical application of MEMS devices, and hermetic packaging is particularly difficult. However, the working characteristics of many devices containing high-speed moving structures strongly depend on the vacuum degree of the sealed chamber. Therefore, the airtightness has a decisive effect on the performance of such devices. Some special-purpose MEMS devices, such as resonant beam MEMS devices, micro-accelerometers, micro-bolometers, gas boxes for chip-level atomic clocks, etc., require hermetic packaging due to their physical working principle, stable operation and low drift requirements . [0003] Commonly used materials for hermetic p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B81B7/00
Inventor 刘胜汪学方方靖吕植成
Owner HUAZHONG UNIV OF SCI & TECH
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