634results about "Microstructural devices" patented technology

The invention relates to the technical field of semiconductor manufacturing, and discloses an edge breakage defect prediction and compensation method in a wafer cutting process, and the method comprises the steps: obtaining a wafer cutting initial scheme and historical cutting data, extracting edge breakage key parameters, defining an edge vulnerability function, and building a high-risk region space mapping model; according to the real-time cutting position, multi-dimensional data are collected through a three-level monitoring mode, the abnormal deviation state of the track is judged, and an edge breakage risk assessment model is constructed and early warning is carried out; a compensation scheme is formulated after early warning is triggered, cutting is implemented, and the effect is verified; according to the method, multi-dimensional data are fused, the risk area is dynamically delimited, self-adaptive adjustment of the cutting parameters is achieved, and the wafer cutting yield is remarkably improved.

A method of operating a microelectromechanical system (MEMS) includes, in a first operational mode, converting an analog output of the MEMS into a first internal data stream and a first external data stream having a first sampling rate; transitioning from the first operational mode to a second operation mode without restarting the MEMS; and in the second operational mode, converting the analog output of the MEMS into a second internal data stream having a second sampling rate different from the first sampling rate, and performing a sampling rate conversion of the second internal data stream to generate a second external data stream.

The present invention provides a display device and a method for manufacturing the display device. A metal layer is formed on a highly light-transmissive substrate; a resist mask having an opening pattern is formed on the metal layer; exposed portions of the metal layer is etched away in this state to form openings; then the resist mask is removed; and a surface of the metal layer and an inner side wall of each of the openings are oxidized to form a metal oxide layer. Thus, a front surface and a rear surface of the aperture plate are caused to have different reflectances. The oxide layer is formed at the same time as when the resist mask is ashed to remove resist.

Aspects relate to a compact and low-cost gas analyzer that can be used for different types of gas analysis, such as air quality analysis. The gas analyzer can include a light source, a gas cell configured to receive a sample (e.g., a gas under test), a spectral sensor including a spectrometer and a detector, and an artificial intelligence (AI) engine. Light can enter the gas cell and interact with the sample to produce output light that may be measured by the spectral sensor. The resulting spectrum produced by the spectral sensor may be analyzed by the AI engine to produce a result. The gas analyzer further includes a self-calibration component configured to enable calibration of the sample spectrum to compensate for spectral drift of the spectral sensor.

A chamber, e.g. in a heat exchanger or flowing electrolytic half-cell, for through flow of a fluid which is capable of elastic turbulence has an internal structure with obstructions to compel flow to undergo successive changes of direction thereby applying stress to the flow of fluid through the chamber. The internal structure comprises an upstream portion in which the applied stress induces elastic turbulence to begin and a downstream portion which applies less stress per unit length and sustains the elastic turbulence while providing economy of pressure to propel the fluid. Configuration of the upstream portion may be planned with computer modeling so as to avoid formation of stagnant zones.

The invention discloses a piezoelectric air cooling device based on a piezoelectric film PZT technology, and relates to the technical field of MEMS. The device adopts a two-layer packaging structure of a piezoelectric cantilever beam MEMS chip and a PCB (Printed Circuit Board) with a vent hole. A cantilever beam of the MEMS chip is integrated with an SOI top silicon layer and an ultrathin PZT driving stack, low rigidity and high driving force are achieved, and the surface of the cantilever beam is covered with a PDMS flexible sealing layer to achieve dynamic sealing. When the device works, the cantilever beam is driven to resonate in an ultrasonic frequency band, and efficient synthetic jet is generated at the vent hole by periodically changing the volume of the pump cavity. The technical bottleneck that miniaturization and high performance are difficult to consider at the same time is broken through, and the device has the advantages of being compact in structure, mute and efficient and is suitable for precise heat dissipation of miniature electronic equipment.

The utility model discloses an MEMS sensor and an electronic atomization device. The MEMS sensor comprises a substrate, a passivation layer, a base plate, a first force application element, a second force application element and a conductive contact. The first surface of the substrate is provided with a groove, and the second surface is provided with a Wheatstone bridge circuit; the passivation layer covers the second surface of the substrate; the substrate covers the groove so as to form a sealed cavity with the substrate; at least part of the first force application element is arranged on the side, away from the substrate, of the passivation layer; at least part of the second force application element is arranged on the bottom wall of the groove; the conductive contacts are arranged on the substrate and / or the base plate; the first force application element and the second force application element are both configured to apply acting force close to or away from the substrate to the bottom wall of the groove under the power-on condition. Through the mode, the substrate can be always in a flat initial state, so that the problem that deformation of the substrate does not have ideal linear change with pressure is well improved, and the detection precision of the MEMS sensor is improved.

The invention provides a large-mirror-surface MEMS two-dimensional scanning micromirror which comprises a fast scanning shaft, a slow scanning shaft, a balance frame with multiple turns of coils, a micromirror surface and reinforcing ribs on the back face of the micromirror, the fast scanning shaft extends in the first direction, one end of the fast scanning shaft is connected with the micromirror surface, the slow scanning shaft extends in the second direction, and the other end of the fast scanning shaft is connected with the micromirror surface. The other end is connected with a balance frame with a plurality of turns of coils; the slow scanning shaft extends in a second direction perpendicular to the first direction, one end of the slow scanning shaft is connected with the balance frame with the multi-turn coil, and the other end of the slow scanning shaft is used for being connected with an external substrate; the balance frame with a plurality of turns of coils is of a hollow structure and is arranged around the mirror surface of the micro-mirror; the reinforcing ribs on the back face of the micro-mirror are of an oval hollow structure and are fixedly arranged on the lower surface of the mirror face of the micro-mirror, and the reinforcing ribs are connected in the first direction and the second direction to form a supporting structure. According to the structure, the rigidity of the mirror surface is greatly improved, and the capability of resisting external force interference is remarkably enhanced.

A camera module includes a movable substrate comprising a first main surface and a second main surface arranged opposite to the first main surface; an image sensor mechanically coupled to the first main surface and configured to capture image data; a piezoelectric-actuated micro-electrical-mechanical systems (MEMS) platform mechanically coupled to the second main surface such that the movable substrate and the piezoelectric-actuated MEMS platform are configured to move in unison; at least one piezoelectric actuator coupled to the piezoelectric-actuated MEMS platform; and an actuation circuit configured to receive a motion sensor signal corresponding to a movement, generate at least one actuation signal based on the motion sensor signal, and provide the at least one actuation signal to the at least one piezoelectric actuator to produce a counter mechanical response at the piezoelectric-actuated MEMS platform in response to the movement indicated by the motion sensor signal.

The invention relates to aluminum borosilicate glass with low dielectric constant and low dielectric loss and a preparation method and application thereof, and relates to the field of aluminum borosilicate glass manufacturing, the aluminum borosilicate glass comprises the following main components by molar percentage: 60%-85% of SiO2, 0-10% of Al2O3, 2%-30% of B2O3, 0-20% of alkaline earth oxide, 0-10% of alkali metal oxide, 0-10% of ZnO, 0-1% of P2O5 and 0-2% of TiO2 and / or ZrO2; during preparation, the raw materials are melted, clarified and homogenized according to the corresponding dosage, and then are annealed for 3-8 hours at the temperature of 600-650 DEG C. The obtained aluminum borosilicate glass can reduce transmission loss during high-frequency signal transmission, has dielectric constant stability which does not exceed + / -0.5 change under a 1-30 GHz signal test, and can be applied to preparation of integrated antennas, electronic packaging and micro electro mechanical system packaging.

The invention belongs to the technical field of power equipment monitoring, and discloses a quantum sensing and MEMS sensing integrated partial discharge detection device and method. Partial discharge signals are collected through the quantum sensor and the electric field sensor; the data acquisition card transmits data to the microprocessor, the microprocessor judges the discharge type by using a wavelet transform method, extracts characteristic parameters, transmits the data to the computer, analyzes and determines calculation weights of different sensors according to the characteristic parameters to perform data fusion, and calculates and displays the partial discharge electric field intensity. According to the method, data fusion of the quantum sensor and the MEMS sensor is realized, more comprehensive and accurate information is provided, the source and characteristics of partial discharge can be better identified, the diagnosis accuracy and the reliability of a detection system are improved, false alarm and missing alarm are reduced, and reliable data are provided for the operation state, fault diagnosis and maintenance of power equipment.

The invention discloses a combined sensor and electronic equipment, and relates to the technical field of sensors, the combined sensor comprises a packaging shell, an MEMS chip and an ASIC chip which are in signal connection, a waterproof breathable film and a water residue detection assembly, the packaging shell forms a containing cavity and is provided with a breathable hole communicating the containing cavity with the external environment, the MEMS chip is arranged in the containing cavity, and the ASIC chip is arranged in the waterproof breathable film. The ASIC chip is arranged in the accommodating cavity or embedded in the packaging shell; the waterproof breathable film covers the breathable hole, the water residue detection assembly is arranged on the packaging shell and corresponds to the waterproof breathable film, and the water residue detection assembly is in signal connection with the ASIC chip; the water residue detection assembly is used for detecting whether water residues exist at the waterproof breathable film or not, and the ASIC chip is used for starting heating to remove the water residues when detecting that the water residues exist. According to the technical scheme, the waterproof requirement can be met, and meanwhile the measurement precision of the acoustic signal and the air pressure signal is improved.

The invention provides an angle detection device and a laser radar scanning system, and relates to the field of optical detection, the device is used for detecting the inclination angle of an MEMS micromirror based on a first rotating shaft and a second rotating shaft, and the device comprises a light source; the photoelectric detector matrix comprises N photoelectric detector arrays, the photoelectric detector matrix and the light source are located on the same plane, N is larger than or equal to 4, and the light source is located in the center of the photoelectric detector matrix. Based on the device, angle detection of the MEMS micromirror based on biaxial inclination can be realized, light spot distribution of reflected laser is detected through a detection array formed by a plurality of photoelectric detectors, the response time of a sensor can be shortened so as to realize real-time detection of angle change of the MEMS micromirror, and the photoelectric detectors are arranged in a matrix form, so that the detection accuracy is improved. The MEMS micro-mirror angle detection device is compact in overall structure arrangement and small in occupied space, so that the device can be arranged in a laser radar scanning system more easily, and angle detection can be directly carried out on the MEMS micro-mirror.

The invention discloses a micro-nano structure machining and detecting integrated device for a micro-spherical surface and a centering method. The device comprises an AFM, a high-precision air floating main shaft, a centering mechanism, an XZ-direction two-dimensional manual displacement table and a Y-direction one-dimensional manual displacement table, and the centering mechanism comprises a clamp, a clamp adapter and an XY-direction two-dimensional manual displacement table; the clamp is fixed on the clamp adapter; the clamp adapter is fixed on the XY-direction two-dimensional manual displacement table; the XY-direction two-dimensional manual displacement table is fixed on the rotary table; the rotary table is fixed on the Y-direction one-dimensional manual displacement table; and the AFM is fixed on the XZ-direction two-dimensional manual displacement table. According to the invention, the AFM is combined with the high-precision air floating main shaft and other devices, so that the integration of processing and detection on the surface of the microsphere is realized, and high-precision aligning is realized. The center adjusting operation is simple, machining and detection of the spherical surface can be achieved, the machined structure is stable, the consistency is good, mass copying can be achieved, the detection performance is stable, and the data repeatability is high.

The invention discloses a method and device for measuring structural parameters of an MEMS cantilever beam, and the method comprises the steps: placing the MEMS cantilever beam on an objective table of a nanoprobe station, and guaranteeing that the thickness direction of the MEMS cantilever beam is perpendicular to a horizontal plane; measuring the length l and the width b of the MEMS cantilever beam by using a microscope; controlling a micro probe of the nano probe station to descend until the micro probe is in contact with the surface of the MEMS cantilever beam; continuously controlling the micro-probe to descend, and recording the displacement X and the loading stress F of the micro-probe at the same time; carrying out linear fitting by utilizing a preset calculation device displacement X and the loading stress F to obtain the deformation rigidity K of the MEMS cantilever beam; and calculating the thickness h of the MEMS cantilever beam based on the deformation stiffness K, the length l, the width b and the Young modulus E. The measuring method is wide in application range and low in testing cost.

A chamber, e.g. in a heat exchanger or flowing electrolytic half-cell, for through flow of a fluid which is capable of elastic turbulence has an internal structure with obstructions to compel flow to undergo successive changes of direction thereby applying stress to the flow of fluid through the chamber. The internal structure comprises an upstream portion in which the applied stress induces elastic turbulence to begin and a downstream portion which applies less stress per unit length and sustains the elastic turbulence while providing economy of pressure to propel the fluid. Configuration of the upstream portion may be planned with computer modeling so as to avoid formation of stagnant zones.

The invention relates to an airflow sensor testing structure and a packaging method and packaging structure thereof, each chip unit of an airflow sensor wafer is composed of a substrate (1), a vibrating diaphragm (2) and a back plate which are stacked, the substrate (1) is provided with a back cavity (42) penetrating in the thickness direction of the substrate (1), a slot (10) is formed in the bottom of the substrate (1), and the vibrating diaphragm (2) is arranged in the slot (10). The open groove (10) penetrates through the substrate (1) and the back cavity (42), and the open groove (10) is used for establishing a continuous air flow path in a space outside the back cavity (42) and the air flow sensor. During packaging, the airflow sensor chip is fixed on the packaging substrate through silica gel, a packaging shell is installed outside the airflow sensor chip, the open groove (10) is filled with the silica gel, and blocking and sealing of the open groove (10) are achieved. According to the invention, the requirement of each tube core on the test wafer can be met, the production cost is not increased, and the risk of wafer fragmentation can be effectively avoided.

The invention discloses an outdoor static measurement MEMS sensor sensitivity calibration method, and relates to the technical field of sensor calibration, and the method comprises the specific steps: firstly constructing dual references including a factory reference and a field relation; synchronously collecting multi-source data according to a set period, and preprocessing to obtain an effective sequence; then double check chain fitting key indexes are started in parallel; if a collaborative judgment result is conflicted, high-grade diagnosis is triggered; after diagnosis, the acquisition period of sensitivity drift is prolonged, and parameters are recalculated; and finally, if the conditions are met, solidifying calibration parameters, installing a fault output alarm, and uploading whole-process data records to the cloud. According to the method, the sensitivity calibration of the sensor is guaranteed by constructing double references, multi-source data are synchronously acquired, and the performance is evaluated through double check chains. The efficiency is improved through round-robin scheduling of time slices, effective data are reserved through data preprocessing, differential processing is carried out after fault diagnosis, whole-process data recording and uploading are carried out, calibration parameters are solidified, it is guaranteed that the result is effective, and the application range is widened.

The invention provides a micro-mirror chip, a micro-mirror device and an optical device, and belongs to the technical field of micro electro mechanical systems. The micro-mirror chip comprises a substrate, a micro-mirror array, an electrode, a light window and a fixing ring. The micromirror array is located on the first surface of the substrate, the electrode is located on the second surface of the substrate, and the first surface and the second surface are opposite in position in the thickness direction of the substrate; the fixing ring is fixed on the first surface of the substrate, the micro-mirror array is located in an in-ring space of the fixing ring, and the light window is fixed on the fixing ring and covers the micro-mirror array. In the packaging of the micro-mirror chip, the micro-mirror array is sealed in the sealed space formed by the substrate, the fixing ring and the light window, so that small particles do not fall into the environment where the micro-mirror array is located in the subsequent packaging process, the qualified rate of the packaged micro-mirror device can be improved, and the yield of the packaged micro-mirror device can be improved. Therefore, the yield of the packaged micro-mirror device is improved.

The utility model discloses a Kovar frame and a sensor packaging structure, which are applied to the technical field of semiconductor device packaging and comprise a bottom frame, a solder area is arranged on the surface of one side of the bottom frame, a retaining wall is arranged on one side, facing the center of the Kovar frame, of the solder area, and a protruding part is arranged on one side, facing the solder area, of the retaining wall. A gap is formed between the protrusion and the bottom surface of the solder region. The blocking wall can prevent welding flux arranged in the welding flux area from splashing towards the center of the kovar frame, and therefore the situation that the welding flux splashes to the pixel area in the eutectic welding process is reduced. And the protruding part is used for increasing a solder climbing path when the solder climbs towards the top end of the retaining wall, preventing the solder from infiltrating towards a position close to the chip, further reducing the sputtering risk, and ensuring the yield of the device.

The invention discloses a sensing unit structure of a piezoelectric-piezoresistive coupling type electric field sensor and application, the sensing unit structure comprises a substrate, the substrate is provided with a cantilever beam structure, a piezoelectric crystal block is bonded between the lower surface of the cantilever beam structure and the upper surface of the substrate, and the upper surface of the cantilever beam structure is provided with a Wheatstone full-bridge structure; when the piezoelectric crystal block is subjected to the action of an electric field, the piezoelectric crystal block deforms in the Z-axis direction under the action of an inverse piezoelectric effect, so that the cantilever beam structure deforms; in the Wheatstone full-bridge structure, the resistors arranged at the position with the maximum stress difference value are stressed to deform, the stress directions of the resistors are opposite, and the resistance values of the resistors are changed oppositely; compared with the sensing unit structures of electro-optical and mechanical electric field sensors commonly used at present, the sensing unit structure has the advantages of larger measuring range, smaller volume, lower power consumption and easiness in mass production.

The invention relates to the technical field of heat dissipation devices, in particular to an annular beam heat dissipation device based on an MEMS device, and the device comprises an air inlet grid port which is located at the uppermost end of the heat dissipation device and is used for enabling external air to enter the heat dissipation device and filtering impurities in the air at the same time; the piezoelectric vibrator is used for driving airflow and providing a reliable power source for each structure at the same time; the flexible FPC is used for providing stable electric energy supply and signal transmission for the piezoelectric vibrator; and the impact platform is used for receiving the heat of the equipment needing to be cooled, taking away the heat through air beam heat exchange and discharging the air flow after heat exchange at the same time. Air flow driving force is formed through vibration of the piezoelectric ceramic piece in an electric field, external cold air is driven into the heat dissipation device, efficient heat dissipation is achieved, and the heat dissipation problem that the performance of a CPU is limited in a narrow space is solved.

The invention discloses an MEMS sensor, a microphone module and electronic equipment, and relates to the technical field of electronic equipment, the MEMS sensor comprises a substrate and at least one capacitor system arranged on the substrate, the capacitor system comprises a backboard, a first vibrating diaphragm and a second vibrating diaphragm, and the first vibrating diaphragm and the second vibrating diaphragm are arranged on the two sides of the backboard; a connecting column is arranged between the first vibrating diaphragm and the second vibrating diaphragm, and under the connection of the connecting column, the connecting rigidity between the first vibrating diaphragm and the second vibrating diaphragm is greater than the vibrating diaphragm bending rigidity of the first vibrating diaphragm and the second vibrating diaphragm; and / or, the distance between the back plate and the first vibrating diaphragm is a first polar plate distance, the distance between the back plate and the second vibrating diaphragm is a second polar plate distance, the first polar plate distance is in negative correlation with the vibrating diaphragm bending rigidity of the first vibrating diaphragm, and the second polar plate distance is in negative correlation with the vibrating diaphragm bending rigidity of the second vibrating diaphragm. The invention provides an MEMS sensor. The MEMS sensor solves the technical problem that the sensitivity of vibrating diaphragms of an existing MEMS sensor is inconsistent.

A microelectromechanical sensor component. The component includes: a substrate; a movable sensor structure connected to the substrate and having a seismic mass portion and a deflection electrode arranged thereon; and at least one evaluation electrode arranged on the substrate. The deflection electrode is arranged so as to be movable relative to the evaluation electrode. The evaluation electrode is configured for capacitive detection of a deflection of the deflection electrode. The deflection electrode and the evaluation electrode form a comb structure. The deflection electrode has a plurality of deflection electrode fingers extending from a deflection electrode bar in the direction of the evaluation electrode. The evaluation electrode has a plurality of evaluation electrode fingers extending, parallel at least in portions to the deflection electrode fingers, from an evaluation electrode bar in the direction of the deflection electrode.

The invention relates to the technical field of micro electro mechanical system (MEMS) force sensor calibration, and discloses a multi-dimensional force sensor with a self-calibration function and a self-calibration method thereof, and the multi-dimensional force sensor comprises a sensor body, a loading column, a calibration force loading detection device and a housing. The sensor body is connected with the loading stand column, and the loading stand column extends out of the shell; the sensor body and the calibration force loading detection device are fixed on the inner wall of the shell, the calibration force loading detection device is arranged on one side of the loading stand column, a gap is reserved between the calibration force loading detection device and the loading stand column, and the calibration force loading detection device is used for applying calibration force when contact begins; the calibration force loading detection device comprises an electric heating driving device and a piezoresistive force detection part arranged on the electric heating driving device, and the piezoresistive force detection part begins to be in contact with the loading stand column when being driven by the electric heating driving device. The internal structure of the device does not interfere with each other, the structural size is small, the calibration of the sensor can be completed without disassembly, and the measurement precision and the system reliability of the multi-dimensional force sensor are improved.

A method of operating a microelectromechanical system (MEMS) includes, in a first operational mode, converting an analog output of the MEMS into a first internal data stream and a first external data stream having a first sampling rate; transitioning from the first operational mode to a second operation mode without restarting the MEMS; and in the second operational mode, converting the analog output of the MEMS into a second internal data stream having a second sampling rate different from the first sampling rate, and performing a sampling rate conversion of the second internal data stream to generate a second external data stream.

The invention provides a high-precision subminiature inertial measurement combination based on an MEMS device, and relates to the technical field of MEMS inertial measurement combinations. According to the inertial measurement combination, a three-axis MEMS accelerometer chip and three single-axis MEMS gyroscope chips are respectively arranged on a rigid printed board, and acquired angular velocity information and acceleration information are respectively transmitted to the rigid printed board on which a processor chip is positioned through a flexible printed board; and working software embedded in the processor chip outputs the processed acceleration information and angular velocity information through an external electrical interface according to a system error model. The cable-free information processing circuit is formed in the mode, the system structure miniaturization problem in a limited space and the MEMS chip low-stress orthogonal installation problem can be solved, MEMS devices conduct information interaction, the utilization rate of the limited space of an inertial measurement combination can be effectively increased, cable installation space does not need to be reserved, and the cost is reduced. Therefore, the inertial measurement combination achieves the miniaturization effect.

The invention discloses an intelligent foundation detection and evaluation method and system, and the method comprises the steps: setting a ground penetrating radar and a micro-electromechanical sensor array based on the condition of a foundation and a detected target; data acquisition is carried out based on a ground penetrating radar and a micro-electro-mechanical sensor array, and detection radar data and micro-electro-mechanical sensor data are obtained; analyzing and processing the data of the ground penetrating radar and the data of the micro-electro-mechanical sensor; carrying out weighted fusion on the analyzed ground penetrating radar data and the micro-electromechanical sensor data through a space-time synchronization mechanism, and dynamically adjusting the fusion weight according to the soil texture type; and establishing a dynamic risk assessment model, and inputting the fused multivariate data into the dynamic risk assessment model to obtain a risk assessment level of the foundation to be monitored. According to the method, foundation information is obtained from multiple dimensions, defects such as tiny cracks and cavities can be recognized more accurately, and tiny vibration, pressure and humidity changes of the foundation are monitored accurately.

The invention discloses a field-grinding direct-current modulation and coil induction integrated MEMS electric field sensor, and the sensor comprises a spiral coil induction electrode which is disposed on an SOI substrate, and converts the periodic change of an alternating-current electric field into a first signal; the comb tooth electrode structure is fixedly arranged on the SOI substrate and comprises a piezoelectric driving structure, at least two movable shielding electrodes and at least two fixed induction electrodes, and the piezoelectric driving structure is fixedly connected with the SOI substrate; the movable shielding electrode is elastically connected with the piezoelectric driving structure and generates periodic vertical displacement under the driving of the piezoelectric driving structure; the fixed induction electrode and the movable shielding electrode are correspondingly arranged to form an electrode group, and the low-frequency alternating-current and direct-current electric fields are modulated and converted into second signals. The invention has the beneficial effects that the full-band measurement of direct-current, low-frequency and high-frequency signals is realized, the measurement frequency range of the sensor is widened, the processing difficulty and the manufacturing cost are reduced, and the production efficiency is improved.

This invention discloses a stress-adjustable semiconductor module packaging structure and its stress adjustment method, belonging to the field of semiconductor packaging technology. The semiconductor module packaging structure integrates an electronically controlled variable stiffness support layer into the semiconductor module packaging structure, realizing real-time adaptive compensation of thermo-mechanical stress during the entire operation of the packaging structure. Since the variable stiffness support layer can actively adjust its stiffness according to the real-time detected temperature and stress distribution, the stress concentration phenomenon inside the semiconductor module packaging structure is significantly alleviated. The stress adjustment method continuously iteratively adjusts the stiffness of the support layer through a closed-loop control strategy to achieve steady-state maintenance after stress balance, so that the semiconductor module packaging structure can still maintain good mechanical and thermal stability under complex working conditions such as frequent start-stop and high altitude and low air pressure.