830results about "Microstructural devices" patented technology

The invention relates to the technical field of semiconductor manufacturing, and discloses an edge breakage defect prediction and compensation method in a wafer cutting process, and the method comprises the steps: obtaining a wafer cutting initial scheme and historical cutting data, extracting edge breakage key parameters, defining an edge vulnerability function, and building a high-risk region space mapping model; according to the real-time cutting position, multi-dimensional data are collected through a three-level monitoring mode, the abnormal deviation state of the track is judged, and an edge breakage risk assessment model is constructed and early warning is carried out; a compensation scheme is formulated after early warning is triggered, cutting is implemented, and the effect is verified; according to the method, multi-dimensional data are fused, the risk area is dynamically delimited, self-adaptive adjustment of the cutting parameters is achieved, and the wafer cutting yield is remarkably improved.

The invention relates to an MEMS mode wafer, an MEMS probe card detection method, an MEMS probe card detection device and a storage medium. The detection method is applied to MEMS wafer detection equipment, and comprises the following steps: loading test configuration parameters of an MEMS probe card to be detected; fixing the MEMS probe card to be tested on a probe seat of test equipment; placing an MEMS mode wafer matched with the to-be-tested MEMS probe card at a preset target position on a test platform of test equipment; the MEMS mode wafer comprises a test point array which is the same as a to-be-tested MEMS wafer corresponding to the to-be-tested MEMS probe card; starting a visual alignment system, and aligning the MEMS probe card to be tested with the MEMS mode wafer; the MEMS probe card to be tested is calibrated; and executing the test task of the MEMS wafer to be tested, and detecting the MEMS probe card to be tested. The test task is automatically executed by using the MEMS mode wafer, and the efficient test of the MEMS probe card is realized.

A method of operating a microelectromechanical system (MEMS) includes, in a first operational mode, converting an analog output of the MEMS into a first internal data stream and a first external data stream having a first sampling rate; transitioning from the first operational mode to a second operation mode without restarting the MEMS; and in the second operational mode, converting the analog output of the MEMS into a second internal data stream having a second sampling rate different from the first sampling rate, and performing a sampling rate conversion of the second internal data stream to generate a second external data stream.

The invention provides a micro-nano impact press-in tester operation monitoring system based on digital twinning, and is suitable for the field of precise instrument maintenance. The system realizes multi-physical field coupling modeling in a micro-nano press-in test through a digital twinning technology, and can monitor the state of an instrument in real time with high precision, predict faults and perform dynamic optimization. The system is integrated with a high-precision sensor, data such as micro force, extremely high temperature and nanoscale displacement are collected in real time, a digital twin model is constructed, and the operation state of an instrument is mapped. Historical and real-time data are analyzed by means of a machine learning algorithm, potential faults can be accurately predicted, maintenance suggestions can be provided, and the precision retentivity and the test stability of the instrument under the material service working condition are ensured. The interaction center provides a visual interface, supports real-time monitoring, dynamic adjustment and early warning functions, and remarkably improves the intelligent maintenance level of the instrument. The invention is suitable for the fields of material science, micro-nano mechanical test and the like, and provides an innovative precise instrument intelligent management scheme.

The present invention provides a display device and a method for manufacturing the display device. A metal layer is formed on a highly light-transmissive substrate; a resist mask having an opening pattern is formed on the metal layer; exposed portions of the metal layer is etched away in this state to form openings; then the resist mask is removed; and a surface of the metal layer and an inner side wall of each of the openings are oxidized to form a metal oxide layer. Thus, a front surface and a rear surface of the aperture plate are caused to have different reflectances. The oxide layer is formed at the same time as when the resist mask is ashed to remove resist.

Aspects relate to a compact and low-cost gas analyzer that can be used for different types of gas analysis, such as air quality analysis. The gas analyzer can include a light source, a gas cell configured to receive a sample (e.g., a gas under test), a spectral sensor including a spectrometer and a detector, and an artificial intelligence (AI) engine. Light can enter the gas cell and interact with the sample to produce output light that may be measured by the spectral sensor. The resulting spectrum produced by the spectral sensor may be analyzed by the AI engine to produce a result. The gas analyzer further includes a self-calibration component configured to enable calibration of the sample spectrum to compensate for spectral drift of the spectral sensor.

A chamber, e.g. in a heat exchanger or flowing electrolytic half-cell, for through flow of a fluid which is capable of elastic turbulence has an internal structure with obstructions to compel flow to undergo successive changes of direction thereby applying stress to the flow of fluid through the chamber. The internal structure comprises an upstream portion in which the applied stress induces elastic turbulence to begin and a downstream portion which applies less stress per unit length and sustains the elastic turbulence while providing economy of pressure to propel the fluid. Configuration of the upstream portion may be planned with computer modeling so as to avoid formation of stagnant zones.

The invention discloses a piezoelectric air cooling device based on a piezoelectric film PZT technology, and relates to the technical field of MEMS. The device adopts a two-layer packaging structure of a piezoelectric cantilever beam MEMS chip and a PCB (Printed Circuit Board) with a vent hole. A cantilever beam of the MEMS chip is integrated with an SOI top silicon layer and an ultrathin PZT driving stack, low rigidity and high driving force are achieved, and the surface of the cantilever beam is covered with a PDMS flexible sealing layer to achieve dynamic sealing. When the device works, the cantilever beam is driven to resonate in an ultrasonic frequency band, and efficient synthetic jet is generated at the vent hole by periodically changing the volume of the pump cavity. The technical bottleneck that miniaturization and high performance are difficult to consider at the same time is broken through, and the device has the advantages of being compact in structure, mute and efficient and is suitable for precise heat dissipation of miniature electronic equipment.

According to the chip platemaking method based on the superposition process provided by the invention, the ASIC top aluminum layer located at the lower part in the integrated chip is merged into the MEMS bottom aluminum layer located at the upper part, so that the ASIC top passivation perforated layer used for connecting the ASIC topmost layer and the MEMS bottommost layer can be synchronously deleted; the size-adjusted top layer through hole connects the combined MEMS bottom layer aluminum layer with the ASIC secondary aluminum layer, and the original function of the integrated chip can also be realized; based on the method, two platemaking layers can be reduced from the original layout layers, the process steps are optimized, the process flow period is shortened, and the manufacturing cost of the chip is also reduced.

The invention discloses a shape memory alloy-based chip self-adaptive heat dissipation device and a preparation method, relates to the technical field of chip heat dissipation, and solves the problem that the heat dissipation effect of an existing heat dissipation device on local hot spots randomly appearing on a chip is poor. A substrate is arranged at the lower end of a shell to form a micro box body structure, and a honeycomb liquid separation plate is arranged in the micro box body structure; the honeycomb liquid separation plate is of a double-layer structure and is provided with a plurality of honeycomb liquid separation inlets penetrating up and down; a honeycomb liquid separation outlet formed in the lower surface of the honeycomb liquid separation plate is communicated with a cavity in the honeycomb liquid separation plate, and the cavity is communicated with a liquid outlet in the side face of the shell; a liquid inlet is formed in the upper end of the shell; a shape memory alloy layer and needle-shaped ribs are arranged on the substrate. According to the invention, martensite phase transformation of the shape memory alloy is triggered in a local high-temperature area of the chip, so that the surface of the radiator forms a bulge at a high-temperature part, thereby increasing the heat exchange area of contact between a flowing working medium and the radiator, providing more nucleation sites in two-phase cooling, and remarkably improving the heat exchange efficiency.

The utility model discloses an MEMS sensor and an electronic atomization device. The MEMS sensor comprises a substrate, a passivation layer, a base plate, a first force application element, a second force application element and a conductive contact. The first surface of the substrate is provided with a groove, and the second surface is provided with a Wheatstone bridge circuit; the passivation layer covers the second surface of the substrate; the substrate covers the groove so as to form a sealed cavity with the substrate; at least part of the first force application element is arranged on the side, away from the substrate, of the passivation layer; at least part of the second force application element is arranged on the bottom wall of the groove; the conductive contacts are arranged on the substrate and / or the base plate; the first force application element and the second force application element are both configured to apply acting force close to or away from the substrate to the bottom wall of the groove under the power-on condition. Through the mode, the substrate can be always in a flat initial state, so that the problem that deformation of the substrate does not have ideal linear change with pressure is well improved, and the detection precision of the MEMS sensor is improved.

The invention provides a large-mirror-surface MEMS two-dimensional scanning micromirror which comprises a fast scanning shaft, a slow scanning shaft, a balance frame with multiple turns of coils, a micromirror surface and reinforcing ribs on the back face of the micromirror, the fast scanning shaft extends in the first direction, one end of the fast scanning shaft is connected with the micromirror surface, the slow scanning shaft extends in the second direction, and the other end of the fast scanning shaft is connected with the micromirror surface. The other end is connected with a balance frame with a plurality of turns of coils; the slow scanning shaft extends in a second direction perpendicular to the first direction, one end of the slow scanning shaft is connected with the balance frame with the multi-turn coil, and the other end of the slow scanning shaft is used for being connected with an external substrate; the balance frame with a plurality of turns of coils is of a hollow structure and is arranged around the mirror surface of the micro-mirror; the reinforcing ribs on the back face of the micro-mirror are of an oval hollow structure and are fixedly arranged on the lower surface of the mirror face of the micro-mirror, and the reinforcing ribs are connected in the first direction and the second direction to form a supporting structure. According to the structure, the rigidity of the mirror surface is greatly improved, and the capability of resisting external force interference is remarkably enhanced.

A camera module includes a movable substrate comprising a first main surface and a second main surface arranged opposite to the first main surface; an image sensor mechanically coupled to the first main surface and configured to capture image data; a piezoelectric-actuated micro-electrical-mechanical systems (MEMS) platform mechanically coupled to the second main surface such that the movable substrate and the piezoelectric-actuated MEMS platform are configured to move in unison; at least one piezoelectric actuator coupled to the piezoelectric-actuated MEMS platform; and an actuation circuit configured to receive a motion sensor signal corresponding to a movement, generate at least one actuation signal based on the motion sensor signal, and provide the at least one actuation signal to the at least one piezoelectric actuator to produce a counter mechanical response at the piezoelectric-actuated MEMS platform in response to the movement indicated by the motion sensor signal.

The invention relates to aluminum borosilicate glass with low dielectric constant and low dielectric loss and a preparation method and application thereof, and relates to the field of aluminum borosilicate glass manufacturing, the aluminum borosilicate glass comprises the following main components by molar percentage: 60%-85% of SiO2, 0-10% of Al2O3, 2%-30% of B2O3, 0-20% of alkaline earth oxide, 0-10% of alkali metal oxide, 0-10% of ZnO, 0-1% of P2O5 and 0-2% of TiO2 and / or ZrO2; during preparation, the raw materials are melted, clarified and homogenized according to the corresponding dosage, and then are annealed for 3-8 hours at the temperature of 600-650 DEG C. The obtained aluminum borosilicate glass can reduce transmission loss during high-frequency signal transmission, has dielectric constant stability which does not exceed + / -0.5 change under a 1-30 GHz signal test, and can be applied to preparation of integrated antennas, electronic packaging and micro electro mechanical system packaging.

The utility model discloses an MEMS sensor and an electronic atomization device. The MEMS sensor comprises a substrate, a base plate, a first polar plate, a second polar plate and a conductive contact. The first surface of the substrate is provided with a groove, the second surface of the substrate is provided with a Wheatstone bridge circuit, and a bridge arm of the Wheatstone bridge circuit comprises a piezoresistor; the substrate covers the groove to form a sealed cavity; the first polar plate is arranged on the bottom wall of the groove; the second polar plate is arranged on the substrate and is spaced from the first polar plate; the conductive contact is arranged on the substrate and / or the base plate and is electrically connected with at least one of the first polar plate and the second polar plate; the first pole plate and the second pole plate are configured to be capable of repelling or attracting each other under the power-on condition. Through the mode, the deflection of the strain film is always small, so that the problem that the deformation of the substrate does not have ideal linear change with the pressure is well improved, and the detection precision of the MEMS sensor is improved.

The invention belongs to the technical field of power equipment monitoring, and discloses a quantum sensing and MEMS sensing integrated partial discharge detection device and method. Partial discharge signals are collected through the quantum sensor and the electric field sensor; the data acquisition card transmits data to the microprocessor, the microprocessor judges the discharge type by using a wavelet transform method, extracts characteristic parameters, transmits the data to the computer, analyzes and determines calculation weights of different sensors according to the characteristic parameters to perform data fusion, and calculates and displays the partial discharge electric field intensity. According to the method, data fusion of the quantum sensor and the MEMS sensor is realized, more comprehensive and accurate information is provided, the source and characteristics of partial discharge can be better identified, the diagnosis accuracy and the reliability of a detection system are improved, false alarm and missing alarm are reduced, and reliable data are provided for the operation state, fault diagnosis and maintenance of power equipment.

The invention provides an MEMS air-cooled heat dissipation device and a use method thereof.The MEMS air-cooled heat dissipation device comprises a shell, a micro-valve assembly and a motion execution assembly, the micro-valve assembly comprises a cantilever beam, a first partition plate and an air chamber, an actuator is attached to the cantilever beam to generate driving force in the normal direction on the cantilever beam, and therefore a through hole is selectively opened or closed through the cantilever beam; the motion executing assembly comprises a second partition plate, the second partition plate is attached to the shell to separate the first fluid chamber and the second fluid chamber, the second partition plate comprises an opening, and the vibrating diaphragm and the piezoelectric actuator are arranged on the opening in a crossing mode. The actuator and the cantilever beam are used for constructing the active one-way micro-valve assembly, the active one-way micro-valve assembly is matched with the motion execution assembly, cooling gas is guided to the fluid chamber adjacent to the hot end of the electronic equipment in a one-way mode, then heated air is exhausted, the heat dissipation effect is achieved, ultrasonic waves generated by high working frequency and vibration of the piezoelectric film layer are inaudible, and the heat dissipation effect is good. The system has the advantages of no noise and low power consumption.

The invention relates to the technical field of optical devices, and particularly discloses a preparation method of an electrostatic drive MEMS Fabry-Perot filter, an SOI wafer is used as a first substrate, top silicon of the SOI wafer is used as a drive structure of the MEMS Fabry-Perot filter, the thickness and mechanical characteristics of a cantilever can be accurately adjusted, and the MEMS Fabry-Perot filter can be manufactured. And meanwhile, the silicon dioxide insulating layer of the SOI wafer can also be used as an etching stopping layer, so that the condition of excessive etching is avoided, and the manufacturing yield of the filter is further improved. When the bonding layer and the silicon dioxide insulating layer of the SOI wafer are etched, an etching method combining advanced oxide etching and reactive ion etching is adopted, isotropy and anisotropy are integrated, and the limitation of a single process is overcome. A certain dislocation amount of linear offset is reserved during patterning of bonding metal, gold-tin eutectic bonding is adopted, the problem of leading-out of top and bottom electrodes is solved, and the machining cost and uncertainty are reduced.

The invention discloses a combined sensor and electronic equipment, and relates to the technical field of sensors, the combined sensor comprises a packaging shell, an MEMS chip and an ASIC chip which are in signal connection, a waterproof breathable film and a water residue detection assembly, the packaging shell forms a containing cavity and is provided with a breathable hole communicating the containing cavity with the external environment, the MEMS chip is arranged in the containing cavity, and the ASIC chip is arranged in the waterproof breathable film. The ASIC chip is arranged in the accommodating cavity or embedded in the packaging shell; the waterproof breathable film covers the breathable hole, the water residue detection assembly is arranged on the packaging shell and corresponds to the waterproof breathable film, and the water residue detection assembly is in signal connection with the ASIC chip; the water residue detection assembly is used for detecting whether water residues exist at the waterproof breathable film or not, and the ASIC chip is used for starting heating to remove the water residues when detecting that the water residues exist. According to the technical scheme, the waterproof requirement can be met, and meanwhile the measurement precision of the acoustic signal and the air pressure signal is improved.

The utility model relates to the field of optical device packaging, and provides a packaging structure comprising an optical device SIP, which comprises a packaging carrier plate on which an optical device and devices required by a peripheral circuit are attached; the first mold assembly used for plastic packaging comprises a transparent plastic packaging material special mold and a black plastic packaging mold, the transparent plastic packaging material special mold is only used for injection molding of a specific light-transmitting area, and the black plastic packaging mold is used for injection molding of areas outside the specific light-transmitting area; and the second mold assembly for plastic packaging comprises a transparent plastic packaging mold and a black plastic packaging material special mold, the black plastic packaging material special mold is used for reserving one or more cavities of a transparent plastic packaging area, and the transparent plastic packaging mold is used for plastic packaging of the cavities.

The invention provides an angle detection device and a laser radar scanning system, and relates to the field of optical detection, the device is used for detecting the inclination angle of an MEMS micromirror based on a first rotating shaft and a second rotating shaft, and the device comprises a light source; the photoelectric detector matrix comprises N photoelectric detector arrays, the photoelectric detector matrix and the light source are located on the same plane, N is larger than or equal to 4, and the light source is located in the center of the photoelectric detector matrix. Based on the device, angle detection of the MEMS micromirror based on biaxial inclination can be realized, light spot distribution of reflected laser is detected through a detection array formed by a plurality of photoelectric detectors, the response time of a sensor can be shortened so as to realize real-time detection of angle change of the MEMS micromirror, and the photoelectric detectors are arranged in a matrix form, so that the detection accuracy is improved. The MEMS micro-mirror angle detection device is compact in overall structure arrangement and small in occupied space, so that the device can be arranged in a laser radar scanning system more easily, and angle detection can be directly carried out on the MEMS micro-mirror.

The invention discloses a micro-nano structure machining and detecting integrated device for a micro-spherical surface and a centering method. The device comprises an AFM, a high-precision air floating main shaft, a centering mechanism, an XZ-direction two-dimensional manual displacement table and a Y-direction one-dimensional manual displacement table, and the centering mechanism comprises a clamp, a clamp adapter and an XY-direction two-dimensional manual displacement table; the clamp is fixed on the clamp adapter; the clamp adapter is fixed on the XY-direction two-dimensional manual displacement table; the XY-direction two-dimensional manual displacement table is fixed on the rotary table; the rotary table is fixed on the Y-direction one-dimensional manual displacement table; and the AFM is fixed on the XZ-direction two-dimensional manual displacement table. According to the invention, the AFM is combined with the high-precision air floating main shaft and other devices, so that the integration of processing and detection on the surface of the microsphere is realized, and high-precision aligning is realized. The center adjusting operation is simple, machining and detection of the spherical surface can be achieved, the machined structure is stable, the consistency is good, mass copying can be achieved, the detection performance is stable, and the data repeatability is high.

The invention discloses a method and device for measuring structural parameters of an MEMS cantilever beam, and the method comprises the steps: placing the MEMS cantilever beam on an objective table of a nanoprobe station, and guaranteeing that the thickness direction of the MEMS cantilever beam is perpendicular to a horizontal plane; measuring the length l and the width b of the MEMS cantilever beam by using a microscope; controlling a micro probe of the nano probe station to descend until the micro probe is in contact with the surface of the MEMS cantilever beam; continuously controlling the micro-probe to descend, and recording the displacement X and the loading stress F of the micro-probe at the same time; carrying out linear fitting by utilizing a preset calculation device displacement X and the loading stress F to obtain the deformation rigidity K of the MEMS cantilever beam; and calculating the thickness h of the MEMS cantilever beam based on the deformation stiffness K, the length l, the width b and the Young modulus E. The measuring method is wide in application range and low in testing cost.

A chamber, e.g. in a heat exchanger or flowing electrolytic half-cell, for through flow of a fluid which is capable of elastic turbulence has an internal structure with obstructions to compel flow to undergo successive changes of direction thereby applying stress to the flow of fluid through the chamber. The internal structure comprises an upstream portion in which the applied stress induces elastic turbulence to begin and a downstream portion which applies less stress per unit length and sustains the elastic turbulence while providing economy of pressure to propel the fluid. Configuration of the upstream portion may be planned with computer modeling so as to avoid formation of stagnant zones.

The invention relates to an airflow sensor testing structure and a packaging method and packaging structure thereof, each chip unit of an airflow sensor wafer is composed of a substrate (1), a vibrating diaphragm (2) and a back plate which are stacked, the substrate (1) is provided with a back cavity (42) penetrating in the thickness direction of the substrate (1), a slot (10) is formed in the bottom of the substrate (1), and the vibrating diaphragm (2) is arranged in the slot (10). The open groove (10) penetrates through the substrate (1) and the back cavity (42), and the open groove (10) is used for establishing a continuous air flow path in a space outside the back cavity (42) and the air flow sensor. During packaging, the airflow sensor chip is fixed on the packaging substrate through silica gel, a packaging shell is installed outside the airflow sensor chip, the open groove (10) is filled with the silica gel, and blocking and sealing of the open groove (10) are achieved. According to the invention, the requirement of each tube core on the test wafer can be met, the production cost is not increased, and the risk of wafer fragmentation can be effectively avoided.

The invention discloses an outdoor static measurement MEMS sensor sensitivity calibration method, and relates to the technical field of sensor calibration, and the method comprises the specific steps: firstly constructing dual references including a factory reference and a field relation; synchronously collecting multi-source data according to a set period, and preprocessing to obtain an effective sequence; then double check chain fitting key indexes are started in parallel; if a collaborative judgment result is conflicted, high-grade diagnosis is triggered; after diagnosis, the acquisition period of sensitivity drift is prolonged, and parameters are recalculated; and finally, if the conditions are met, solidifying calibration parameters, installing a fault output alarm, and uploading whole-process data records to the cloud. According to the method, the sensitivity calibration of the sensor is guaranteed by constructing double references, multi-source data are synchronously acquired, and the performance is evaluated through double check chains. The efficiency is improved through round-robin scheduling of time slices, effective data are reserved through data preprocessing, differential processing is carried out after fault diagnosis, whole-process data recording and uploading are carried out, calibration parameters are solidified, it is guaranteed that the result is effective, and the application range is widened.

The invention provides a micro-mirror chip, a micro-mirror device and an optical device, and belongs to the technical field of micro electro mechanical systems. The micro-mirror chip comprises a substrate, a micro-mirror array, an electrode, a light window and a fixing ring. The micromirror array is located on the first surface of the substrate, the electrode is located on the second surface of the substrate, and the first surface and the second surface are opposite in position in the thickness direction of the substrate; the fixing ring is fixed on the first surface of the substrate, the micro-mirror array is located in an in-ring space of the fixing ring, and the light window is fixed on the fixing ring and covers the micro-mirror array. In the packaging of the micro-mirror chip, the micro-mirror array is sealed in the sealed space formed by the substrate, the fixing ring and the light window, so that small particles do not fall into the environment where the micro-mirror array is located in the subsequent packaging process, the qualified rate of the packaged micro-mirror device can be improved, and the yield of the packaged micro-mirror device can be improved. Therefore, the yield of the packaged micro-mirror device is improved.

The invention provides an MEMS chip packaging assembly and an MEMS variable optical attenuator. The MEMS chip packaging assembly comprises a mounting seat, a first chip, a second chip, a third chip and a fourth chip, the tube seat is fixedly connected with the mounting seat; the first pin penetrates through the mounting seat and the tube seat and is flush with the surface of one side, opposite to the mounting seat, of the tube seat; the second pin is fixedly connected with the mounting seat; the insulating carrier is provided with a first surface and a second surface which are opposite to each other, the first surface is provided with a first conducting layer, the second surface is provided with a second conducting layer, the side edge of the insulating carrier is provided with a third conducting layer connected with the two conducting layers, and a placing groove penetrating through the first surface and the second surface is formed and penetrates through the side edge of the insulating carrier; one part of the first pin is contacted with the first conductive layer, and the other part is exposed out of the placing groove; the protective resistor is inserted into the placing groove, one part is connected with the first pin, and the other part is connected with the tube socket; the positive electrode of the MEMS chip is connected with the second surface of the insulating carrier and is in contact with the second conductive layer, and the negative electrode is connected with the tube socket; and the pipe cap covers the MEMS chip and is connected with the mounting seat.

The invention discloses an MEMS (Micro Electro Mechanical System) accelerometer and an application thereof. The MEMS accelerometer comprises a substrate; the units are arranged on the substrate; the unit comprises a mass block which is spaced from the plane where the substrate is located and is configured to be capable of moving in the first direction parallel to the substrate under the action of a first acceleration; the lever structure is connected to the base plate and is located on the plane parallel to the base plate, and the lever structure is connected with the mass block; the fixed electrode fingers are connected with the substrate and arranged on the first side of the mass block in the second direction, and the fixed electrode fingers extend in the second direction; the movable electrodes are arranged on the first side, in the second direction, of the mass block and connected with the lever structure, and each movable electrode comprises a plurality of movable electrode fingers. According to the invention, only two times of single-side etching are needed; a lever structure is introduced, so that the measurement sensitivity can be greatly improved, and the measuring range of the accelerometer is not influenced; and multi-axis monolithic integration is easy to carry out.

The utility model discloses a Kovar frame and a sensor packaging structure, which are applied to the technical field of semiconductor device packaging and comprise a bottom frame, a solder area is arranged on the surface of one side of the bottom frame, a retaining wall is arranged on one side, facing the center of the Kovar frame, of the solder area, and a protruding part is arranged on one side, facing the solder area, of the retaining wall. A gap is formed between the protrusion and the bottom surface of the solder region. The blocking wall can prevent welding flux arranged in the welding flux area from splashing towards the center of the kovar frame, and therefore the situation that the welding flux splashes to the pixel area in the eutectic welding process is reduced. And the protruding part is used for increasing a solder climbing path when the solder climbs towards the top end of the retaining wall, preventing the solder from infiltrating towards a position close to the chip, further reducing the sputtering risk, and ensuring the yield of the device.