905nm high-power laser with optical lens and packaging process

Abstract

The invention discloses a 905nm high-power laser with an optical lens and a packaging process, and relates to the technical field of laser packaging. The laser comprises a tube socket, a heat sink cushion block, a laser chip, a first pin, a second pin and a tube cap shell. A boss is arranged on the upper plane of the tube base, and the heat sink cushion block is fixed on a side wall of the boss. The laser chip is welded to the heat sink cushion block through eutectic fusion, and electric connection points are arranged on the laser chip and the heat sink cushion block. The first pin and the second pin are both arranged below the tube base, and an electric connection point on the laser chip is electrically connected with the first pin through a gold wire. An electric connection point on theheat sink cushion block is electrically connected with an electric connection point on the side wall of the boss through a gold wire, and the second pin is electrically connected with the boss. The beneficial effects of the invention are that the angle of the laser chip is easier to control, and the concentricity of the laser chip and the tube cap can be effectively controlled.

Description

technical field [0001] The invention relates to the technical field of packaging of lasers, more specifically, the invention relates to a 905nm high-power laser with an optical lens and a packaging process. Background technique [0002] TO packaging technology refers to Transistor Outline, that is, fully enclosed packaging technology. Compared with other packaging technologies, TO packaging has the advantages of relatively small parasitic parameters, low cost, relatively simple process, and flexible and convenient use. Packaging is often used in the packaging of semiconductor lasers, LEDs, and light-receiving devices and components. [0003] The current semiconductor lasers are generally packaged with TO tube sockets. The traditional TO tube sockets are composed of tube shells, nozzles, and pins. The chip is bonded on the tongue, or the laser chip is welded to the heat sink structure, and the heat sink structure is welded to the tube base, and then the sealing cap is packag...

AI Technical Summary

Problems solved by technology

This manufacturing process can realize the use of lasers, but due to the existence of glue curing, the size of the chip and the spacer are small, it is easy to cause a large change in the light emitting angle of the chip, and it is difficult to control the coaxiality of the product. The consistency of the overall product The performance and yield are relatively low, and the production cost is relatively high

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