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Uncooled array type infrared image sensor

An infrared image and sensor technology, which is applied in the field of infrared image sensing, can solve the problems such as the heat of the device cannot be quickly dissipated, the sensitivity is decreased, the response speed is slow, etc., and the effect of cost effective control, simple assembly and easy coordination can be achieved.

Inactive Publication Date: 2009-07-08
COMMUNICATION UNIVERSITY OF CHINA +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although these uncooled array infrared image sensors are small in size, the heat of the device cannot be dissipated quickly when exposed to infrared radiation. Therefore, the uncooled array infrared image sensor has disadvantages such as decreased sensitivity and slow response speed.

Method used

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  • Uncooled array type infrared image sensor
  • Uncooled array type infrared image sensor
  • Uncooled array type infrared image sensor

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Embodiment Construction

[0025] Below in conjunction with accompanying drawing and specific embodiment the present invention is described in further detail:

[0026] 1. The structure of the infrared image sensor in the cylindrical vacuum package:

[0027] Infrared image sensors are usually multi-line lead-out cylindrical structures, such as figure 1 shown. It includes a sensor chip 3 , a tube cap 1 and a tube base 5 . The invention adopts the base of metal material, which facilitates the heat dissipation of the image sensor chip. The structure of the tube cap is different from the existing integrated circuit shell. It uses a low-infrared-absorbing glass and metal sintered structure, which not only ensures a very low vacuum rate, but also ensures that the infrared reaches the chip to the maximum extent. This packaging form is suitable for resonant, pyroelectric and other infrared image sensor chips that are sampled by electromechanical sensitive structures. Among them, the resonant type of quasi-di...

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Abstract

The present invention discloses a non-refrigeration array type infrared image sensor and belongs to the technical field of infrared image sensor preparation. The sensor comprises a tubular infrared image sensor structure which is vacuum-encapsulated. The tubular infrared image sensor structure comprises a sensor chip, a tube cap and a tube socket. The sensor chip is adhibited on the tube socket. The tube cap and tube socket are integrated through vacuum-encapsulation. The pressure welding wire of sensor chip is leaded-out through the wire lead of tube socket. The tube socket adopts metal material. A semiconductor chilling plate is fixedly connected below the tube socket. The semiconductor chilling plate is inserted in the electrode leading-out printed circuit board which is permanently connected with the tube socket. An insulation film is provided at the joint. The lead wire on the tube socket is connected with the electrode leading-out printed circuit board. The invention uses the semiconductor chilling plate as a cold source and can guarantee the quick dissipation of infrared energy absorbed by the infrared image sensor. The sensitivity of non-refrigeration array type infrared image sensor is increased.

Description

technical field [0001] The invention relates to infrared image sensing technology, in particular to an uncooled array infrared image sensor. Background technique [0002] Infrared image sensors are widely used in military investigation, security defense, fire alarm and so on. According to the working principle of the infrared sensor and the infrared imaging system, it is divided into two categories: cooling and uncooling. The traditional cooling infrared sensor is beneficial to the optoelectronic properties of sensitive materials, and the system sensitivity is relatively high, but there are a series of problems such as volume, power consumption, and cost, which seriously affect its application development. [0003] With the development of infrared sensitive materials, sensor technology, micro-nano processing technology, signal processing technology and integrated circuit technology, uncooled infrared imaging system technology has made great progress, and thermal stress defo...

Claims

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Application Information

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IPC IPC(8): H04N3/15H04N5/335H04N25/00
Inventor 张霞张大成
Owner COMMUNICATION UNIVERSITY OF CHINA
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