1065results about How to "Dissipate quickly" patented technology

A bulb comprises a seat; a plurality of metal heat sink each having two fixing surfaces, one fixing surface being fixed with an light emitting chip; and one end of each metal heat sink being placed into an insulated frame and then being fixed to a supporting surface of a heat conductive base; the metal heat sinks having an effect of absorbing heat energy and then transferring heat to the seat so as to dissipate heat; the metal heat sinks being integrally formed with the bulb base and then being combined to the seat; the heat conductive base having an inclined surface which is advantageous to reflect light from a light emitting diode so as to increase the illumination of the light emitting chip; and a metal adhesive layer being assembled to the supporting surface of the heat conductive base and the fixing surfaces of the metal heat sinks.

A light conversion device and high-intensity, solid-state light source utilize wavelength conversion elements with a thermal conductivity greater than 1 watt per meter per degree Kelvin (W / m-K). Exemplary materials that have high thermal conductivity include monocrystalline solids, polycrystalline solids, substantially densified ceramic solids, amorphous solids or composite solids. The light conversion device and high-intensity, solid-state light source have at least one heat sink that is in direct thermal contact with the wavelength conversion element. The heat sink quickly dissipates heat generated within the wavelength conversion element in order to prevent the wavelength conversion element from overheating and undergoing thermal quenching of the wavelength conversion and light emission.

A heat-dissipating structure for a LED lamp includes a heat-dissipating base, a heat-dissipating body and a plurality of heat pipes. The heat-dissipating body has an outer cylinder formed into a hollow cylinder. The inside surface of the outer cylinder is provided with a plurality of accommodating grooves. The condensed ends of the plurality of heat pipes are inserted into the accommodating grooves. The end to be heated of the heat pipe is adhered to the heat-dissipating base. Further, the inside surface and the outside surface of the outer cylinder are formed with a plurality of heat-dissipating fins made by aluminum extrusion, so that the heat pipes are encircled by the heat-dissipating fins. In this way, the heat can be conducted by the plurality of heat pipes so as to increase the total contacting area. Thus, the heat can be rapidly conducted to the outer cylinder. Further, the heat can be rapidly dissipated to the outside by the heat-dissipating fins, thereby to substantially increase the efficiency in the heat dissipation.

Apparatuses and methods for treating wounds are disclosed. An apparatus for treating wounds is disclosed comprising an instrument for generating a low temperature, atmospheric pressure plasma, a means of flowing gas through the instrument, and a means of contacting the wound with the reactive gases flowing out of the instrument. A method for treating wounds using reactive gases is disclosed. The use of atmospheric pressure plasmas for treating wounds is also disclosed.

A power supply to provide electrical power to one or more loads. The power supply may include a resonant air core transformer to provide an adjustable and adaptable source of power to electronic devices. The power supply may include isolated primary-side circuitry and secondary-side circuitry. The primary-side circuitry may include control circuitry that, among other things, provides drive waveforms for the primary-side switching circuitry. In embodiments configured to produce AC output, the secondary-side circuitry may also include switching circuitry. The primary-side control circuitry may provide drive waveforms for the secondary-side switching circuitry. The secondary-side circuitry may include measurement circuitry that measures the current and / or voltage of the output and provides those measurements to the control circuitry through isolation circuitry. The control circuitry may adjust the drive waveforms for the primary-side and / or secondary-side switching circuitry as a function of the measured values.

A blackbody radiation device (110) includes a planar filament emission element (102) and a planar detector (104) for respectively producing and detecting radiation having width dl / 1 less than about 0.1 to test a sample gas, where 1 is the wavelength of the radiation; a reflector (108); a window (W); an electrical control (118); and a data output element (116).

An isothermal heat sink use operational principles of heat pipes and includes a plate-like body including a housing, an interior partition and a wick. The housing has an inner chamber under a vacuum. The interior partition divides the inner chamber into an upper and lower half chamber and has a central through hole and multiple air passages. The wick containing a working fluid is held in the central through hole and has a lower evaporating section and an upper condensing section that are held respectively in the lower and the upper half chambers. Therefore, the working fluid in the evaporating section evaporates and produces a vapor that enters the upper half chamber from the lower half chamber through the air passages. The vapor condenses into liquid that enters the condensing section and returns to the evaporating section to improve cooling efficiency of the heat sink.

Electro-Static Discharge (ESD) protection using at least one ring-shape diode is disclosed. The ring-shape diode can be constructed from polysilicon, active region body on insulated substrate, or junction diode on silicon substrate. The diodes can have a first type of implant in an outer ring and a second type of implant in an inner ring to serve as two terminals of a diode coupled through contacts, vias, or metals. The two types of implant ring regions are separated with an isolation structure. The isolation can be LOCOS, STI, dummy gate, or silicide block layer (SBL). The ESD structure has at least a ring-shape diode with a first terminal coupled to an I / O pad and the second terminal coupled to a first supply voltage. The contours of the ring-shape diode can be circles, polygons, or other shapes. The ring-shape ESD structures can be multiple and be constructed in concentric manner.

A power supply to provide electrical power to one or more loads. The power supply may include a resonant air core transformer to provide an adjustable and adaptable source of power to electronic devices. The power supply may include isolated primary-side circuitry and secondary-side circuitry. The primary-side circuitry may include control circuitry that, among other things, provides drive waveforms for the primary-side switching circuitry. In embodiments configured to produce AC output, the secondary-side circuitry may also include switching circuitry. The primary-side control circuitry may provide drive waveforms for the secondary-side switching circuitry. The secondary-side circuitry may include measurement circuitry that measures the current and / or voltage of the output and provides those measurements to the control circuitry through isolation circuitry. The control circuitry may adjust the drive waveforms for the primary-side and / or secondary-side switching circuitry as a function of the measured values.

A method for treating body tissue using acoustic energy includes identifying a target focal zone of tissue to be treated, delivering a first pulse of acoustic energy from a transducer to generate bubbles in a tissue region located distally, relative to the transducer, of a focal center of the target focal zone, and delivering a second pulse of acoustic energy from the transducer in the presence of the bubbles generated by the first pulse, the second pulse focused at the focal center to generate thermal ablation energy. In a further embodiment, a method of treating body tissue using ultrasound energy includes identifying a target focal zone to be treated and delivering a plurality of pulses of acoustic ablation energy to locations distributed symmetrically in or proximate a focal plane about the focal center of the target focal zone.

A hydrogen-oxygen gas generator comprises an electrolytic bath (10A), a pair of electrodes composed of an anode member (2x) and cathode member (2y) both disposed in the bath, a power supply (34) for applying voltage between the anode and cathode members, vibratory mixing means (16) for vibratively mixing the electrolyte (14) in the bath, and gas collecting means for collecting the hydrogen-oxygen gas generated by the electrolysis using the electrolyte. The gas collecting means includes a lid member (10B) annexed to the electrolytic bath (10A) and a hydrogen-oxygen gas collecting pipe (10B″) connected to the hydrogen-oxygen gas output port (10B′). The vibratory mixing means (16) includes a vibrating motor (16d) vibrating at 10 Hz to 500 Hz and vibrating blades (16f) attached to a vibrating rod (16e) not rotatably but vibrating in the electrolytic bath interlockingly with the vibrating motor. The vibrating blades of the vibratory mixing member (16) are so arranged as to oppose the surfaces of the anode and cathode members (2x, 2y).

A package structure of light-emitting diode with an electrostatic protective diode is disclosed. The structure has a light-emitting diode, an electrostatic protective diode, an electrical & heat conductive pad, and an electrical & heat conductive base substrate. The light-emitting diode is flipped and with its p-electrode and n-electrode, respectively, mounted on the n-electrode of the electrostatic protective diode and the electrical & heat conductive pad by conductive bumps. The latter two are separated themselves by a gap or an insulation layer and both of them are mounted on and electrically connected to the electrical & heat conductive base substrate. The structure is then through a bonding wire bonding to a bonding pad and the electrical & heat conductive base structure, respectively, connected to a positive and a negative terminal of a DC power to implement the electrical connection. The foregoing bonding pad is located on the exposed portion of n-electrode of the electrostatic protective diode.

A heat pipe heat sink with a holeless fin module is disclosed in the present invention. Because of the holeless arrangement the heat pipe heat sink is much more convenient for manufacturing. The heat generated by an electrical component can quickly be transferred into the heat pipe and uniformly distributed to each of the heat dissipating fins. The heat pipe heat sink includes a heat dissipating fin module, a heat conducting member, one or more heat pipes installed on the heat conducting member, and a heat conducting plate which is thermally connected to the heat conducting member and the electrical component. The end surface of the heat conducting member with the heat pipe installed thereon is convenient for application of an adhesive because the end surface and the pipe wall of the heat pipe are exposed outside of the heat dissipating fin module before any combination takes place. The top of the heat conducting plate is attached to the bottom surface of the heat conducting member, while the bottom of the heat conducting plate is thermally connected to the top surface of an electrical component. Via the heat conducting plate, a uniform heat connection end surface is formed below the heat conducting member.

The present invention relates to Fc-IL-15 hybrids, which may or may not include peptide linkers between the IL-15 and the Fc portion, for methods of treatment of tumors and viral infections. The IL-15 hybrids can be Fc-IL-15 or IL-15-Fc hybrids. The Fc-IL-15 hybrids include variants, including the IL-15 and Fc variants. The hybrids preferably (but not necessarily) include peptide linkers between the IL-15 and the Fc portion. These linkers are preferably composed of a T cell inert sequence, or any non-immunogenic sequence.

A lighting fixture utilizing LED light sources for illumination of commercial, outdoor and other large area applications incorporates efficient heat dissipation and improved convective air flow. An integrated heat transfer assembly is disclosed that is configured to enhance heat dissipation by providing an efficient thermal conductive pathway for radiation of heat to an external environment. The lighting fixture body is configured with a lens body and heat sink having a chimney tube with internally facing finned heat sink arrangement for providing enhanced convective air flow through the light fixture body. When the heat sink transfers heat from the LED light sources during operation so as to create heated air surrounding the heat sink, ambient air is drawn through the chimney and the heated air is exhausted through air gaps so as to create a conductive air current with the environment. The heat sink fins are configured to enhance the natural air draw through the chimney by tapering the surface areas of the fins.

An LED lamp includes a monolithic housing made of metal extrusion and comprising a heat sink and a receiving portion integrally extending from a bottom of the heat sink, a plurality of LED modules attached to the heat sink, a cover covering the LED modules and a supporting bracket mounted on the housing. The heat sink includes a planar base and a plurality of fins extending from a top face of the base. The receiving portion includes a frame defining a window at a center thereof and two sidewalls interconnecting the frame and the base. The frame, the sidewalls and the base cooperatively define a receiving chamber for accommodating the LED modules therein. The LED modules are attached to the base and located corresponding to the window of the frame. The cover is mounted on a bottom of the frame and correspondingly covers the window.

In a process for the thermal cracking of hydrocarbons in the presence of steam, the charge mixture is passed through externally heated tubes with helical inner fins, and to make the temperature in the tube wall and over the tube cross section more uniform, as well as to reduce the deposition of pyrolysis coke on the tube inner wall, a swirling flow is generated in the gas mixture and is gradually merged into a core zone with a predominantly axial flow at increasing radial distance from the fins.

An injection device is disclosed which comprises a housing (140, 240, 440, 740) for a plurality of cartridges (110,310,410,810) each containing a medicament to be administered to a patient. A plurality of needles (120, 220, 320, 420, 720, 820) may be provided in communication with the plurality of cartridges. A delivery mechanism is arranged to deliver medicament through the plurality of cartridges via the plurality of needles. An injection device may comprise a drive member (130) having a cam surface (136) configured to engage a surface of a carrier (150) and rotate the carrier about a pivot (152) and at least one plunger (134) arranged to engage a cylinder in the cartridge.

A server and cooler module arrangement includes a server accommodating a stack of an operating system and an electronic device in an accommodation chamber therein at one side and an access device unit in the accommodation chamber at an opposite side, and a cooler module, which comprises a rack mounted in a partition way in the accommodation chamber between the stack of operating system and electronic device and the access device unit and a plurality of fans respectively adjustably mounted in respective open frames at different elevations and adapted for drawing air or sending air toward different heat sources in the operating system, the electronic device and the access device unit for quick dissipation of waste heat.

A fragrance sampling system for use in a store comprises a piezoelectrically vibrated orifice plate atomizer mounted to extend from a support structure in the store, such as a shelf and operated to emit puffs of very small droplets of the liquid fragrance and eject them upwardly into the atmosphere such that they become fully evaporated before contacting any supporting surface. The atomizer is controlled by electrical circuits which limit the times during which atomization occurs.

A wafer stacked semiconductor package (WSP) having a vertical heat emission path and a method of fabricating the same are provided. The WSP comprises a substrate on which semiconductor chips are mounted; a plurality of semiconductor chips stacked vertically on the substrate; a cooling through-hole formed vertically in the plurality of semiconductor chips, and sealed; micro holes formed on the circumference of the cooling through-hole; and a coolant filling the inside of the cooling through-hole. Accordingly, the WSP reduces a temperature difference between the semiconductor chips and quickly dissipates the heat generated by the stacked semiconductor chips.