A
package structure of light-emitting
diode with an electrostatic protective
diode is disclosed. The structure has a light-emitting
diode, an electrostatic protective diode, an electrical & heat conductive pad, and an electrical & heat conductive base substrate. The light-emitting diode is flipped and with its p-
electrode and n-
electrode, respectively, mounted on the n-
electrode of the electrostatic protective diode and the electrical & heat conductive pad by conductive bumps. The latter two are separated themselves by a gap or an
insulation layer and both of them are mounted on and electrically connected to the electrical & heat conductive base substrate. The structure is then through a bonding
wire bonding to a bonding pad and the electrical & heat conductive base structure, respectively, connected to a positive and a negative terminal of a DC power to implement the
electrical connection. The foregoing bonding pad is located on the exposed portion of n-electrode of the electrostatic protective diode.