Server and cooler moduel arrangement

Abstract

A server and cooler module arrangement includes a server accommodating a stack of an operating system and an electronic device in an accommodation chamber therein at one side and an access device unit in the accommodation chamber at an opposite side, and a cooler module, which comprises a rack mounted in a partition way in the accommodation chamber between the stack of operating system and electronic device and the access device unit and a plurality of fans respectively adjustably mounted in respective open frames at different elevations and adapted for drawing air or sending air toward different heat sources in the operating system, the electronic device and the access device unit for quick dissipation of waste heat.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The present invention relates to server cooling technology and more particularly, to a server and cooler module arrangement, which has fans arranged at different elevations to aim at different heat sources for quick dissipation of waste heat during operation of the server.[0003]2. Description of the Related Art[0004]Following fast development of semiconductor technology, the packaging density of electronic devices is comparatively higher, and the size of electronic devices is comparatively smaller. High-speed electronic devices consume much electric energy, and release much heat energy during operation. If waste heat is not quickly carried away, the problems of electron ionization and thermal stress may occur, lowering system stability and reliability and shortening the lifespan of the electronic components. Therefore, heat dissipation is an important issue to be settled.[0005]Nowadays, computer has been intensively use...

AI Technical Summary

Benefits of technology

This solution enables quick and efficient heat dissipation, preventing waste heat accumulation and ensuring the smooth operation of server components by allowing fans to be adjusted to optimally target heat sources, thereby extending the lifespan of electronic components and improving system reliability.

Problems solved by technology

High-speed electronic devices consume much electric energy, and release much heat energy during operation.

If waste heat is not quickly carried away, the problems of electron ionization and thermal stress may occur, lowering system stability and reliability and shortening the lifespan of the electronic components.

Therefore, heat dissipation is an important issue to be settled.

The life cycle of computer becomes short to meet marketing requirement.

If waste heat from the CPU(s), IC chips, power supply device, CD-ROM and other electronic components of the operating system is not quickly dissipated, it will be accumulated in the computer, affecting normal functioning of the CPU(s), IC chips, power supply device, CD-ROM and electronic components of the operating system.

1. To fit different operation and control requirements, the server A may have new electronic parts and electronic devices A3 installed therein. When new electronic parts and electronic devices A3 are installed in the server A, the cooling fans B1 cannot be adjusted to send cooling air toward the new heat sources, causing accumulation of waste heat in the server A.

2. The circuit board A1 and the power supply device A2 may be respectively equipped with a respective mini fan for cooling. The working directions of the cooling fans B1 may be unable to effectively carry exhaust air of the mini fans of the circuit board A1 and the power supply device A2 away from the internal space of the server A, causing accumulation of waste heat in the server A.

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