Gan-based light-emitting diode with nanoscale silicon dioxide grating passivation layer and its processing method
A technology for light-emitting diodes and processing methods, which is applied to semiconductor devices, electrical components, circuits, etc., can solve the problems of external quantum efficiency and shortening of lifespan of light-emitting diodes, so as to improve light extraction efficiency, reduce current concentration, and reduce leakage current. Effect
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[0046] The technical scheme of the present invention will be further explained below in conjunction with the drawings.
[0047] In this embodiment, GaN-based light-emitting diodes such as figure 1 As shown, it includes a patterned sapphire substrate 1, an AlN nucleation layer 2, a GaN buffer layer 3, an n-type GaN layer 4, an InGaN / GaN superlattice layer 5, In 0.16 Ga 0.84 N multiple quantum well layer 6, p-AlGaN / GaN electron blocking layer 7, p-type GaN layer 8, ITO layer 9, SiO 2 Passivation layer 10, P electrode and N electrode.
[0048] Reference to the manufacturing flow chart of the light emitting diode of the present invention figure 2 , The specific implementation steps are as follows:
[0049] (1) Place the cleaned c-plane patterned sapphire substrate 1 on a rotatable substrate;
[0050] (2) Draw the reaction chamber into 2.5×10 -3 Pa’s vacuum chamber, open to H 2 ;
[0051] (3) Under the condition of 1010℃, grow a 25nm thick AlN nucleation layer;
[0052] (4) At a temperature ...
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