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1021 results about "Cl element" patented technology

Chlorine is a chemical element with symbol Cl and atomic number 17. The second-lightest of the halogens, it appears between fluorine and bromine in the periodic table and its properties are mostly intermediate between them. Chlorine is a yellow-green gas at room temperature.

Method of preventing surface roughening during hydrogen pre-bake of SiGe substrates using chlorine containing gases

The invention forms an epitaxial silicon-containing layer on a silicon germanium, patterned strained silicon, or patterned thin silicon-on-insulator surface and avoids creating a rough surface upon which the epitaxial silicon-containing layer is grown. In order to avoid creating the rough surface, the invention first performs a hydrofluoric acid etching process on the silicon germanium, patterned strained silicon, or patterned thin silicon-on-insulator surface. This etching process removes most of oxide from the surface, and leaves only a sub-monolayer of oxygen (typically 1×1013-1×1015/cm2 of oxygen) at the silicon germanium, patterned strained silicon, or patterned thin silicon-on-insulator surface. The invention then performs a hydrogen pre-bake process in a chlorine containing environment which heats the silicon germanium, strained silicon, or thin silicon-on-insulator surface sufficiently to remove the remaining oxygen from the surface. By introducing a small amount of chlorine containing gases, the heating processes avoid changing the roughness of the silicon germanium, patterned strained silicon, or patterned thin silicon-on-insulator surface. Then the process of epitaxially growing the epitaxial silicon-containing layer on the silicon germanium, patterned strained silicon, or patterned silicon-on-insulator surface is performed.
Owner:IBM CORP

Method for fabricating different gate oxide thicknesses within the same chip

A semiconductor structure having silicon dioxide layers of different thicknesses is fabricated by forming a sacrificial silicon dioxide layer on the surface of a substrate; implanting nitrogen ions through the sacrificial silicon dioxide layer into first areas of the semiconductor substrate; implanting chlorine and/or bromine ions through the sacrificial silicon dioxide layer into second areas of the semiconductor substrate where silicon dioxide having the highest thickness is to be formed; removing the sacrificial silicon dioxide layer; and then growing a layer of silicon dioxide on the surface of the semiconductor substrate. The growth rate of the silicon dioxide will be faster in the areas containing the chlorine and/or bromine ions and therefore the silicon dioxide layer will be thicker in those regions as compared to the silicon dioxide layer in the regions not containing the chlorine and/or bromine ions. The growth rate of the silicon dioxide will be slower in the areas containing the nitrogen ions and therefore the silicon dioxide layer will be thinner in those regions as compared to the silicon dioxide layer in the regions not containing the nitrogen ions. Also provided are structures obtained by the above process.
Owner:GLOBALFOUNDRIES INC

Deep clean cycle

A dishwasher includes a housing, a wash chamber in the housing that receives kitchenware therein, a detergent dispenser for introducing a detergent into the wash chamber, and a heater for raising temperature in the wash chamber. The dishwasher further includes a controller for selectively controlling water supply to and from the dish chamber. The controller establishes a temperature of the wash fluid circulating in the wash chamber during the first period in a range from about 115° F. (46° C.) to about 135° F. (58° C.) to enhance the wash performance of enzyme-based detergents and establishes a temperature of the wash fluid during a second period in the range from about 150° F. (65° C.) to about 160° F. (72° C.) to enhance wash performance of a chlorine-based detergent. A method of washing kitchenware contained in the dishwasher comprises (i) removing loose soil on the kitchenware in at least one pre-wash cycle, (ii) washing the kitchenware in a main wash cycle, and (iii) rinsing the kitchenware in at least one rinse cycle. The main wash cycle comprises the actions of (i) washing the kitchenware in a first temperature range for enzyme-based detergent for a first period and (ii) washing the kitchenware in a second temperature range for chlorine-based detergent for a second period.
Owner:GENERAL ELECTRIC CO
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