The invention forms an
epitaxial silicon-containing layer on a
silicon germanium, patterned
strained silicon, or patterned thin
silicon-on-insulator surface and avoids creating a
rough surface upon which the
epitaxial silicon-containing layer is grown. In order to avoid creating the
rough surface, the invention first performs a
hydrofluoric acid etching process on the
silicon germanium, patterned
strained silicon, or patterned thin silicon-on-insulator surface. This
etching process removes most of
oxide from the surface, and leaves only a sub-
monolayer of
oxygen (typically 1×1013-1×1015 / cm2 of
oxygen) at the
silicon germanium, patterned
strained silicon, or patterned thin silicon-on-insulator surface. The invention then performs a
hydrogen pre-bake process in a
chlorine containing environment which heats the
silicon germanium, strained silicon, or thin silicon-on-insulator surface sufficiently to remove the remaining
oxygen from the surface. By introducing a small amount of
chlorine containing gases, the heating processes avoid changing the roughness of the
silicon germanium, patterned strained silicon, or patterned thin silicon-on-insulator surface. Then the process of epitaxially growing the
epitaxial silicon-containing layer on the silicon
germanium, patterned strained silicon, or patterned silicon-on-insulator surface is performed.