Provided herein are topical formulations containing
copper ions and methods of treating inflammatory, microbial, and arthritic conditions in various areas of the body using such formulations. Methods of treating
osteoarthritis using topical
copper ion treatments are provided. Methods of treating and preventing microbial infections using
copper ion treatments are further provided, including methods of preventing
biofilm. A
topical treatment in its basic form comprises a biocompatible copper
ion solution or suspension obtained by leaching of the copper ions from
copper metal. The copper ion solution or suspension is combined with various carriers to form the copper ion treatment including creams, gels, lotions, foams, pastes, tampons, solutions, suppositories, body wipes, wound dressings,
skin patches, and suture material. Methods of making the copper ion solution or suspension from
solid copper metal in a biocompatible solution are also provided.