The invention discloses an
etching method of a DTC
dielectric layer, which comprises the following steps: providing a
wafer, forming a first insulating layer on the
wafer, forming a deep groove in the first insulating layer, forming a DTC multilayer
film structure on the first insulating layer and the deep groove, forming a second insulating layer on the DTC multilayer
film structure, filling the deep groove with the second insulating layer, the DTC multilayer
film structure comprises a
metal layer and a
dielectric layer which are overlapped in sequence; covering the second insulating layer with a
photoresist, and removing the
photoresist in the target region through
exposure and development in sequence to
expose the second insulating layer in the target region;
etching for the first time to remove the second insulating layer in the target area; second-time
etching is carried out, etching is carried out to the preset depth in the top
metal layer, and gas introduced in the second-time etching process comprises
chlorine and
boron trichloride; and third etching is carried out until the
dielectric layer below the top
metal layer is exposed, the content of
boron trichloride is reduced and
argon is introduced in the third etching process, and the bias power is reduced as much as possible in a range allowed by
process conditions.