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1039 results about "Borane" patented technology

Borane, also called borine, is an inorganic compound with the chemical formula BH 3. It is a colourless gas that only persists at elevated temperatures or in dilution. Borane is the simplest member of the boranes.

Amine organoborane complex initiated polymerizable compositions containing siloxane polymerizable components

In one embodiment the invention is a polymerizable composition comprising a) an organoborane amine complex; b) one or more of monomers, oligomers or polymers having olefinic unsaturation which is capable of polymerization by free radical polymerization; c) one or more compounds, oligomers or prepolymers having a siloxane backbone and reactive moieties capable of polymerization; and d) a catalyst for the polymerization of the one or more compounds, oligomers or prepolymers having a siloxane backbone and reactive moieties capable of polymerization. This composition may further comprise a compound which causes the organoborane amine complex to disassociate. In a preferred embodiment, the two part composition further comprises a compound which is reactive with both the b) one or more of monomers, oligomers or polymers having olefinic unsaturation which is capable of polymerization by free radical polymerization; and the c) one or more compounds, oligomers or prepolymers having a siloxane backbone and reactive moieties capable of polymerization. This composition can be polymerized by contacting the two parts of the composition. In another embodiment the invention is an organoborane amine complex comprising an alkyl borane having ligands which are alkyl, cycloalkyl or both and an amino siloxane.
Owner:DOW GLOBAL TECH LLC

Catalyst for hydrogen production by catalyzing and hydrolyzing borohydride and preparation method thereof

The invention relates to hydrogen production and hydrogen storage technologies and materials, in particular to a catalyst for catalytic hydrolysis of borane for the hydrogen production and a preparation method thereof, thereby solving the problems that the direct application of powder catalyst in a catalytic hydrolysis solid-liquid reaction system can cause the loss of the catalyst, the catalytic hydrolysis reaction is difficult to control and the hydrolysis by-products are difficult to be recovered, etc. The catalyst is composed of an active component and a carrier; the active component is a binary, ternary or multinary alloy or a single precious metal or the combination thereof which is composed of one or more transition metals, rare earth metals or precious metals and metalloids; the active component is deposited on the carrier through the improved chemical plating technology, the surface thereof is rough and porous, and the structure of the prepared catalyst is the amorphous or the nanocrystalline structure. The preparation method has simple preparation process, high preparation efficiency and convenient large-scale preparation; the sources of the used raw materials are rich; the catalytic activity of the prepared supported catalyst is high, the real-time control of the catalytic hydrolysis reaction of the borane can be realized, the catalytic performance is stable, and the catalyst can be repeatedly used for a plurality of times.
Owner:INST OF METAL RESEARCH - CHINESE ACAD OF SCI

Selective self-initiating electroless capping of copper with cobalt-containing alloys

Embodiments of the invention generally provide compositions of plating solutions, methods to mix plating solutions and methods to deposit capping layers with plating solutions. The plating solutions described herein may be used as electroless deposition solutions to deposit capping layers on conductive features. The plating solutions are rather dilute and contain strong reductants to self-initiate on the conductive features. The plating solutions may provide in-situ cleaning processes for the conductive layer while depositing capping layers free of particles. In one embodiment, a method for forming an electroless deposition solution is provided which includes forming a conditioning buffer solution with a first pH value and comprising a first complexing agent, forming a cobalt-containing solution with a second pH value and comprising a cobalt source, a tungsten source and a second complexing agent, forming a buffered reducing solution with a third pH value and comprising a hypophosphite source and a borane reductant, combining the conditioning buffer solution, the cobalt-containing solution and the buffered reducing solution to form the electroless deposition solution. The electroless deposition solution includes the cobalt source in a concentration range from about 1 mM to about 30 mM, the tungsten source in a concentration range from about 0.1 mM to about 5 mM, the hypophosphite source in a concentration range from about 5 mM to about 50 mM, the borane reductant in a concentration range from about 5 mM to about 50 mM, and has a total pH value in a range from about 8 to about 10.
Owner:APPLIED MATERIALS INC

Selective self-initiating electroless capping of copper with cobalt-containing alloys

Embodiments of the invention generally provide compositions of plating solutions, methods to mix plating solutions and methods to deposit capping layers with plating solutions. The plating solutions described herein may be used as electroless deposition solutions to deposit capping layers on conductive features. The plating solutions are rather dilute and contain strong reductants to self-initiate on the conductive features. The plating solutions may provide in-situ cleaning processes for the conductive layer while depositing capping layers free of particles. In one embodiment, a method for forming an electroless deposition solution is provided which includes forming a conditioning buffer solution with a first pH value and comprising a first complexing agent, forming a cobalt-containing solution with a second pH value and comprising a cobalt source, a tungsten source and a second complexing agent, forming a buffered reducing solution with a third pH value and comprising a hypophosphite source and a borane reductant, combining the conditioning buffer solution, the cobalt-containing solution and the buffered reducing solution to form the electroless deposition solution. The electroless deposition solution includes the cobalt source in a concentration range from about 1 mM to about 30 mM, the tungsten source in a concentration range from about 0.1 mM to about 5 mM, the hypophosphite source in a concentration range from about 5 mM to about 50 mM, the borane reductant in a concentration range from about 5 mM to about 50 mM, and has a total pH value in a range from about 8 to about 10.
Owner:APPLIED MATERIALS INC
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