White light LED area lighting source module package method

A technology of LED surface light source and packaging method, which is applied in the direction of planar light source, electroluminescent light source, light source, etc., can solve the problems of reduced glare point intensity, increased process difficulty, and complicated structural design, and achieves the reduction of heat dissipation requirements. Production technology, the effect of reducing production costs
CN101137255AActive Publication Date: 2008-03-05SHIJIAZHUANG EMPOLDER SHENTONG MACHINE ELECTRIC EMPOLDER
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
SHIJIAZHUANG EMPOLDER SHENTONG MACHINE ELECTRIC EMPOLDER
Publication Date
2008-03-05

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Abstract

The invention discloses a packaging method for white light LED surface light source module, which insists of processing steps such as making circuit boards, fixing crystal, bonding, packaging basic bond line and so on. The invention adopts steps: distributing multiparticulate miniwatt LED chips on a circuit board and packaging integrally to form a high power LED light source, dispersing the heat source, reducing heat productivity on a unit area, reducing heat dispersion requirement standard. Adopting white colloid as solid crystal glue can improve more than 70% of back face emergent light utilance. The basic bond line packaging makes microcosmic light source points distribute uniformly on a bigger area, reduce luminous intensity on a unit area. The light flux on a unit area of traditional LED light source is more than 100 lm / cm<2> generally, while light flux on a unit area of the invention is less than 51 lm / cm<2> generally, thereby glaring is overcame.
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Description

technical field

[0001] The invention relates to an LED packaging method, in particular to a packaging method for a white LED surface light source module. Background technique

[0002] The application potential of LED light source in the field of white light lighting is very huge. The usual manufacturing method of white LEDs is to install blue LED chips in a bowl-shaped reflective cavity, covered with a thin layer of resin mixed with YAG:Ce phosphor powder that can produce yellow light, about 200-500nm. Part of the blue light emitted by the LED chip is absorbed by the phosphor, and the other part of the blue light is mixed with the yellow light emitted by the phosphor to obtain white light.

[0003] At present, the packaging of low-power white light LEDs is mainly Φ3, Φ5, Φ10 or straw hat type and piranha. The packaging of high-power white light LEDs is mainly to package single or multiple high-power chips such as 1W and 3W on ceramic shells or aluminum substrate shells. T...

Claims

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