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48 results about "Bond line" patented technology

Composition, hot melt adhesive and optical cable

PendingCN122445299AMeth-Ethyl group
The present disclosure discloses a composition, a hot melt adhesive and an optical cable, and belongs to the technical field of optical cables. The composition comprises the following components in mass percentage: ethylene-vinyl acetate copolymer 5-60%, ethylene-acrylic acid copolymer 1-20%, styrene-ethylene-butylene-styrene block copolymer 1-50%, tackifier 5-40%, softening oil 5-30%, and hypophosphite flame retardant 5-30%. The hypophosphite flame retardant is selected from at least one of aluminum hypophosphite, zinc hypophosphite, iron hypophosphite, aluminum diethyl hypophosphite, aluminum methyl hypophosphite and aluminum propyl hypophosphite. The hot melt adhesive prepared from the composition can be used as a bonding layer of a concealed optical cable, ensuring that the bonding layer of the concealed optical cable has good transparency, flame retardance and yellowing resistance in addition to reliable bonding force.
Owner:HUAWEI TECH CO LTD

A chip packaging device and method

The application discloses a kind of encapsulation device and method of chip, encapsulation device includes: lead frame, plastic package, multiple chips, circuit board and tin paste;Lead frame is used to carry each chip;Plastic package is used to the plastic package of lead frame and each chip, lead frame includes base island, pin and pin dimple, base island corresponding two sides are equipped with multiple pins and the pin dimple corresponding with pin, multiple chips are pasted on base island by adhesive, multiple chips are connected pin and base island by bonding line respectively, the lower end of lead frame is connected circuit board by tin paste and forms sealed cavity, lead frame and circuit board are all equipped with through air hole, external air nozzle is communicated with sealed cavity by air hole.The three different chips of the present application are integrated in a standard DFN package, through the structure design of plastic package+base island+air hole, each chip is effectively protected, through the connection of base island and circuit board, through air nozzle to realize air tightness, the performance and stability of product are greatly improved.
Owner:PINGJIE ELECTRONIC TECHNOLOGY (JIANGSU) CO LTD

Current collectors and methods of making current collectors

This application discloses a current collector and a method for preparing a current collector. The method includes: metallizing a conductive layer on the surface of a release substrate to obtain a first structure; depositing an adhesive layer on the surface of a polymer substrate layer; attaching the conductive layer of the first structure to the surface of the adhesive layer away from the polymer substrate layer to obtain a second structure; and peeling off the release substrate of the second structure to obtain the current collector. The current collector and the method for preparing the current collector according to this application can improve the processing efficiency and reliability of the current collector.
Owner:CONTEMPORARY AMPEREX TECHNOLOGY CO LTD

Coated Sand Manufacturing Method

PendingJP2026090796AFoundry mouldsFoundry coresMetasilicatePhysical chemistry
To provide a method for producing dry coated sand that can manufacture molds with excellent mold strength and surface strength. [Solution] A method for producing dry coated sand, comprising the step (1) of mixing water with refractory aggregate A having an inorganic binder layer formed on its surface containing an inorganic binder containing a metasilicate hydrate, A method for producing coated sand, wherein the mass ratio of the inorganic binder water (a component of the inorganic binder other than water) to the water in the coated sand (mass of water in the coated sand / mass of the inorganic binder water) is 1.00 to 1.60.
Owner:KAO CORP

Semiconductor device assemblies with bond lines including aluminum nitride gap fill material and methods of forming the same

PCT designated stageWO2026136177A1Device materialEngineering physics
A semiconductor device assembly is provided. The assembly includes a first semiconductor device having an upper surface, a second semiconductor device carried by the first semiconductor device and having a lower surface facing the upper surface of the first semiconductor device, a plurality of interconnects extending from the upper surface to the lower surface and across a bond line having a thickness, and an aluminum nitride material disposed between the upper surface and the lower surface and surrounding each of the plurality of interconnects.
Owner:MICRON TECHNOLOGY INC

Adhesive material and electrochemical apparatus containing same

ActiveUS12668719B2Polymeric surfacePolymer science
An adhesive material includes an adhesive film, where the adhesive film includes a bonding layer and a first functional layer. The first functional layer includes a styrene-isoprene-styrene rubber and an additive, where the additive includes a wax or a polymer surfactant. With the first functional layer having the styrene-isoprene-styrene rubber and the additive provided, the adhesive material is capable of adjusting bonding strengths on both surfaces of the adhesive film through heat treatment and / or pressure treatment, and avoiding permeation and / or shifting between layers in the adhesive film, thereby improving the safety performance of the electrochemical apparatus.
Owner:NINGDE AMPEREX TECHNOLOGY LTD

Elastic wave device and method for manufacturing same

PendingCN122073465AImpedence networksMechanical engineeringBond line
The present invention relates to an elastic wave device and a method for manufacturing the same, and the elastic wave device according to one embodiment of the present invention comprises: a support substrate having a first surface; a piezoelectric substrate having a second surface and a third surface, the second surface being adjacent to or in contact with the first surface of the support substrate to form a cavity defined as a space, and the third surface facing the second surface; a first adhesive layer provided between the support substrate and the piezoelectric substrate and forming a bonding interface to bond the first surface of the support substrate and the second surface of the piezoelectric substrate; a second adhesive layer formed on at least one of the first surface of the support substrate and the second surface of the piezoelectric substrate on which the bonding interface is not formed, and exposed in the cavity; and the interdigital transducer electrode is formed on the third surface of the piezoelectric substrate, and the thickness of the first bonding layer is larger than that of the second bonding layer.
Owner:TIANJIN WISOL ELECTRONICS CO LTD

Disposable collapsible chemical funnel

ActiveCN224336235ULarge containersFunnelsAdhesive glueBond line
The utility model provides a disposable foldable chemical paper funnel, including folding body, folding body includes a plurality of spondylium unit and the connecting strip of at least one side location connected in proper order, it adopts the integrative cutting of showering membrane paper, is provided with the adhesive layer on the connecting strip, a plurality of spondylium unit head -to -tail folding link and adopt the adhesive layer bonding fixed formation upper end big lower end small rhombic spondylium funnel. The utility model adopts the integrative cutting of showering membrane paper to be folded body with a plurality of spondylium unit and the connecting strip of at least one side location, and its whole is the flat plate structure, and the space is small, and it is convenient to package and carry, when using, can form upper end big lower end small rhombic spondylium funnel according to need with the folding body head -to -tail folding link and adopt the adhesive layer bonding fixed, is used for the steel wire rope joint pouring glue, can effectively overcome the problem of poor balance and easy to drip material when pouring, simple operation, flexible and convenient to use.
Owner:HUBEI HAIXING RUIXIN MATERIAL TECH CO LTD

An epoxy tack coat composition for steel bridge deck bonding and a method of making the same

This invention discloses an epoxy resin adhesive layer composition for steel bridge deck bonding and its preparation method, belonging to the technical field of road engineering materials. To address the problems of high temperature sensitivity, high low-temperature brittleness, and poor workability of existing steel bridge deck bonding materials, the composition provided by this invention is made of bisphenol A type epoxy resin, polyamide PA650 as a composite curing agent, tung oil anhydride and polyetheramine T403, tertiary amine accelerators, and epoxy silane coupling agents. By compounding rigid and flexible curing agents, an interpenetrating network structure with both rigidity and flexibility is formed. The preparation method of this invention includes preheating the raw materials, sequentially mixing the components, and performing a two-stage temperature-curing process. Through synergistic design, this invention resolves the contradiction between high-temperature stability and low-temperature toughness, resulting in a cured product with high bonding strength, high toughness, and excellent temperature stability, suitable for preparing the bonding layer of steel bridge deck pavement, and significantly improving the durability of the pavement system.
Owner:SHAANXI EXPRESSWAY MECHANIZATION ENG CO LTD +1

A suede composite fabric and a preparation method thereof

ActiveCN122143458BPolymer scienceChamois leather
The application discloses a suede composite fabric and a preparation method thereof, and belongs to the technical field of fabrics. The fabric has a gradient sandwich structure and comprises a multifunctional nano-particle modified suede layer, a nano-particle enhanced water-based PU adhesive layer and a high-strength base cloth layer. The multifunctional nano-particle is prepared by using hexachlorocyclotriphosphazene as a core skeleton and grafting organosilicon prepolymer, long fluorocarbon chain silane and silane coupling agent; the modified suede layer endows the fabric with multifunctionality, the adhesive layer strengthens the interface bonding, and the base cloth layer improves the mechanical strength. The application is prepared by using a one-pot in-situ grafting process, the fabric has excellent flame-retardant, hydrophobic and wear-resistant properties, has strong washing resistance, meanwhile, retains the delicate touch and the simulated leather texture of the suede, and the process is environmentally friendly and simple, and is suitable for application in multiple scenes.
Owner:KEYI FUJIAN MICROFIBER CO LTD

A silicone iridescent reflective heat pack

ActiveCN224450577UStrong three-dimensional senseGood weather resistancePolymer scienceFirming agent
This utility model discloses a silicone iridescent reflective heat-sensitive adhesive, comprising: a reflective layer, an adhesive layer, and a protective layer, wherein the adhesive layer bonds the reflective layer and the protective layer. In this utility model, the reflective layer serves as the top film, and the protective layer as the bottom film. The adhesive layer, consisting of a coating of adhesive material and a silicone adhesive layer, is coated onto the protective layer and bonded to the reflective layer. After calendering and drying, it achieves a strong three-dimensional effect, high weather resistance, long service life, and is not easily worn or aged. It is a solvent-free composite adhesive, formed by one-step mixing of liquid silicone, curing agent, color paste, and other materials to create the coating adhesive layer. This results in strong adsorption and high anti-sublimation properties. No volatile organic compounds, wastewater, or waste liquid are generated during each processing unit, effectively improving production efficiency and reducing production costs.
Owner:HANGZHOU CHINASTARS REFLECTIVE MATERIAL

A suede composite fabric and a preparation method thereof

The application discloses a suede composite fabric and a preparation method thereof, and belongs to the technical field of fabrics. The fabric has a gradient sandwich structure and comprises a multifunctional nano-particle modified suede layer, a nano-particle enhanced water-based PU adhesive layer and a high-strength base cloth layer. The multifunctional nano-particle is prepared by using hexachlorocyclotriphosphazene as a core skeleton and grafting organosilicon prepolymer, long fluorocarbon chain silane and silane coupling agent; the modified suede layer endows the fabric with multifunctionality, the adhesive layer strengthens the interface bonding, and the base cloth layer improves the mechanical strength. The application is prepared by using a one-pot in-situ grafting process, the fabric has excellent flame-retardant, hydrophobic and wear-resistant properties, has strong washing resistance, meanwhile, retains the delicate touch and the simulated leather texture of the suede, and the process is environmentally friendly and simple, and is suitable for application in multiple scenes.
Owner:KEYI FUJIAN MICROFIBER CO LTD

Membrane and concealed switch structure comprising the same

The present invention relates to a film including a base layer formed of a transparent material, a first adhesive layer laminated by applying an adhesive to the base layer, a masking layer laminated and bonded to the first adhesive layer, an icon formed by laser processing after applying an opaque paint, a second adhesive layer laminated by applying an adhesive to the masking layer, and a sheet layer laminated to the second adhesive layer and formed of a solid wood in a thin film form, and a hidden switch structure including the same. The hidden switch structure of the present invention can increase design freedom and improve aesthetic appearance.
Owner:SEOYON E HWA CO LTD +1

A printing method of 3D printing continuous fibers and a powder-in-silk co-extrusion system

The present application relates to the technical field of 3D printing, and discloses a 3D printing continuous fiber printing method and a filament-powder co-extrusion system, which comprises the following steps: after being heated by a printing head, a filament is downwardly conveyed to a printing area to form an interlayer structure, while a bonding raw material is blown to a position below the printing head and close to the printing head, and is changed into a molten state and wets the filament after being heated by the printing head; the bonding raw material is conveyed to the printing area together with the filament and is extruded into the gap of the interlayer structure to bond the interlayer structure. The bonding raw material is heated into a molten state by the printing head, and can fully wet the filament; the filament and the bonding raw material are conveyed to the printing area together and are extruded into the gap of the interlayer structure, which can bond the interlayer structure, thereby improving the interlayer bonding property of the 3D printing continuous fiber.
Owner:SUN YAT SEN UNIV

A eutectic high-entropy alloy material, a preparation method and application thereof

The application belongs to the technical field of adhesive layer materials, and particularly relates to a eutectic high-entropy alloy material and a preparation method and application thereof. The eutectic high-entropy alloy material provided by the application is specifically a NiCoCrAlTiTaZr alloy, which comprises the following elements with atomic percentage: 2-8 at.% Zr, 2-8 at.% Ta, 2-8 at.% Ti, 10-20 at.% Al, 10-20 at.% Cr, 10-20 at.% Co, and the balance of Ni. The high content of Al and Cr in the NiCoCrAlTiTaZr alloy helps to improve the oxidation resistance, the high content of Ti, Ta and Zr is innovatively introduced to improve the formation ability of the eutectic structure, the phase size is refined, and the thermal corrosion resistance can be greatly improved. The uniform distribution of the ultra-fine eutectic structure of the alloy ensures the uniform distribution of each element, and is also beneficial to fully exert the thermal corrosion resistance characteristics of the elements.
Owner:CHINA UNITED GAS TURBINE TECH CO LTD +1

Foamed metal composite support lightweight structure and high-strength adhesive assembly method thereof

The application relates to the field of lightweight composite structure forming, in particular to a foam metal composite support lightweight structure and a high-strength adhesive assembly method thereof. The foam metal composite support lightweight structure comprises foam metal layers, a transition layer and a composite support layer arranged in sequence; the transition layer comprises a first adhesive-infiltrated carbon fiber cloth; a bonding layer is arranged between the transition layer and the composite support layer; and the structure form of the composite support layer is a grid shape or a honeycomb shape. A transition layer of adhesive-infiltrated carbon fiber cloth is arranged between the metal foam and the composite support structure. The transition layer can increase the effective bonding area of the adhesive interface, promote the formation of adhesive tumors to improve the mechanical properties, effectively prevent the disorderly infiltration of adhesive into the foam, and avoid the problems of additional quality and residual stress caused by the out-of-control distribution of the adhesive.
Owner:NANJING UNIV OF AERONAUTICS & ASTRONAUTICS +1

Masterless grid cell string and method of making same, photovoltaic module

The application relates to a busbar-free cell string and a preparation method thereof and a photovoltaic module. The busbar-free cell string comprises a plurality of busbar-free cell pieces, a solder strip and a bonding layer for connecting the plurality of busbar-free cell pieces and the solder strip; wherein, according to mass percentage, the preparation raw material of the adhesive layer comprises 47-60% of epoxy resin, 20-30% of a curing agent, 10-20% of a filler and 1-5% of a coupling agent; the epoxy resin comprises one or more of bisphenol A type epoxy resin and alicyclic epoxy resin; and the curing agent comprises one or more of an acid anhydride curing agent and a latent curing agent. The busbar-free cell string can improve the connection strength and weather resistance of the busbar-free cell piece and the solder strip, thereby improving the stability and service life of the photovoltaic module.
Owner:通威太阳能(盐城)有限公司

A prefabricated terrazzo floor structure

This utility model discloses a prefabricated terrazzo floor structure, comprising an original reinforced concrete floor slab, a bonding agent layer sprayed onto the surface of the original reinforced concrete floor slab, a cement mortar leveling layer laid on top of the bonding agent layer, a special adhesive layer laid on top of the cement mortar leveling layer, and a terrazzo layer laid on top of the special adhesive layer. The terrazzo layer comprises multiple spliced ​​terrazzo units, and the splicing ends of the terrazzo units are provided with interlocking plugs and slots to complete the splicing. This utility model facilitates improved paving flatness and ensures the waterproofness of the overall structure under specific environments.
Owner:JIANGSU TIANMAO CONSTR CO LTD +1

A second-order epoxy waterproof bonding layer material for road and bridge surfaces, a preparation method and applications thereof

PendingCN122326150APolymer scienceBridge deck
This invention relates to the field of waterproof adhesive materials, specifically to a second-stage epoxy waterproof adhesive layer material for road and bridge decks, its preparation method, and its application. The second-stage epoxy waterproof adhesive layer material includes epoxy resin and a curing agent. The preparation method involves pouring epoxy resin and curing agent into a mixing container at a mass ratio of (4-7):(3-6) and stirring for 30 seconds. The curing agent includes a latent dicyandiamide curing agent, an imidazole accelerator, and polyamide resin, with a mass ratio of (6-10):(1-3):(25-35). It is applied to the bonding of interlayer interfaces on steel bridge decks. This technical solution balances pre-curing at room temperature to achieve walking strength and remelting at high temperatures to achieve efficient waterproofing and high-strength bonding, resulting in stronger overall structural integrity and a significantly improved service life.
Owner:CHONGQING SPECIAL ENG TECH

A high moisture resistant scratch protective film base film for a polarizing sheet

This invention relates to a high moisture-barrier and scratch-resistant protective film base for polarizers. The base film, from bottom to top, comprises a functional bonding layer: intercalated modified montmorillonite, graphene nanosheets, an antistatic agent, and optical-grade PET; an adhesive layer; and an outer wear-resistant layer: wear-resistant modified PET, functional nanofillers, UV absorbers, and optical-grade PET. The functional bonding layer of this invention contacts the pressure-sensitive adhesive of the polarizer. The unique intercalated modified montmorillonite combined with graphene nanosheets enhances the film's moisture barrier properties, providing long-term protection for the polarizer's core layer. Simultaneously, the introduction of an antistatic agent ensures no risk of electrostatic discharge damage during protective film peeling. The outer wear-resistant layer, through the synergistic effect of modified PET containing silicon and naphthalene rings and functional nanofillers, improves the film's hardness and scratch resistance. The intermediate adhesive layer effectively solves the compatibility problem between the functional bonding layer and the outer surface layer, ensuring the stability and strength of the multilayer co-extruded structure.
Owner:扬州博恒新能源材料科技有限公司

Insulating film, assembly, and system

PCT designated stageWO2026145221A1Electrical batteryEngineering physics
The present disclosure is applicable to the technical field of photovoltaics, and provides an insulating film, an assembly, and a system. The insulating film comprises: an insulating layer, the insulating layer having a first surface and a second surface disposed opposite to each other; a first adhesive layer disposed on the first surface; and a second adhesive layer disposed on the second surface, wherein a thickness of the first adhesive layer is less than a thickness of the second adhesive layer. The present application reduces the risk of micro-cracking of cells during a photovoltaic module lamination process.
Owner:ZHUHAI FUSHAN AIKO SOLAR ENERGY TECH CO LTD +6

Microelectronic device assemblies, and high-bandwidth memory packages

Disclosed is a microelectronic device assembly comprising a substrate having conductors exposed on a surface thereof. Two or more microelectronic devices are stacked on the substrate and the components are connected with conductive material in preformed holes in dielectric material in the bond lines aligned with TSVs of the devices and the exposed conductors of the substrate. Methods of fabrication are also disclosed.
Owner:LODESTAR LICENSING GROUP LLC

An underwater coating having a bubble trapping and maintaining function and a method for preparing the same

The present application relates to underwater drag reduction technology field, specifically, relate to a kind of underwater coating with bubble trapping and maintaining function and its preparation method.The underwater coating includes polymer adhesive layer, and composite on the adhesive layer fiber composite layer;Fiber composite layer is made of micro-nano fiber and porous material loaded thereon by interlacing, form meso-micro multi-level pore network structure.The present application prepares coating by semi-solid spraying process, so that adhesive layer and fiber composite layer form strong and tough interface of physical interpenetration and chemical bonding combination.The present application actively traps micro-bubbles by capillary effect of inter-fiber channel, uses air-liquid-solid three-phase line locking bubble in porous material inner channel, actively traps and long-acting stable maintenance to micro-bubble are realized, break through the limitation of traditional super-hydrophobic coating to rely on passive air storage, gas film has recoverability, and coating durability is strong, preparation process is simple, applicable to a variety of underwater drag reduction scene.
Owner:CHINA SHIPBUILDING INDUSTRY CORPORATION NO725 RESEARCH INSTITUTE

A micro-atmosphere fresh-keeping packaging cover film applied to cold fresh meat packaging and a preparation method thereof

ActiveCN117719229BControl heat shrinkageSolve the problem of easy delamination between layersFlexible coversWrappersPolymer scienceModified atmosphere
This invention discloses a micro-modified atmosphere packaging cap film for chilled meat packaging and its preparation method. It is made of a multi-layer co-extruded film, with each layer composed of the following thickness ratio: heat-resistant layer (printing layer), support layer, isolation layer, adhesive layer, protective layer, barrier layer, secondary heat-sealing layer, and heat-sealing anti-fogging layer. Compared with existing technologies, this invention has the following advantages: ① It controls the aggregated structure of PA materials, studies the crystallinity, orientation, and intermolecular forces of different aggregated structures, and controls the thermal shrinkage rate of the film; ② Through the interface design and control of the adhesive layer and PA layer under a high blow-up ratio, it solves the problem of interlayer delamination in existing products on the market; ③ By studying the interaction between the anti-fogging system and the lubrication system, the film simultaneously possesses the advantages of high transparency, low friction coefficient, and excellent anti-fogging effect; ④ By studying the layer structure distribution and the combination of inner and outer layer materials, it solves the problem of easy curling in asymmetric structure products on the market.
Owner:SUNRISE PACKAGING MATERIAL (JIANGYIN) CO LTD

Semiconductor device assemblies with bond lines including aluminum nitride gap fill material and methods of forming the same

A semiconductor device assembly is provided. The assembly includes a first semiconductor device having an upper surface, a second semiconductor device carried by the first semiconductor device and having a lower surface facing the upper surface of the first semiconductor device, a plurality of interconnects extending from the upper surface to the lower surface and across a bond line having a thickness, and an aluminum nitride material disposed between the upper surface and the lower surface and surrounding each of the plurality of interconnects.
Owner:MICRON TECHNOLOGY INC