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642 results about "Bond line" patented technology
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Insulating microwave interactive packaging
InactiveUS7019271B2Improve cooking resultsImprove the heating effectDomestic cooling apparatusLighting and heating apparatusMicrowave ovenEngineering
Owner:GRAPHIC PACKAGING INT +1
Turbine blades made from multiple single crystal cast superalloy segments
InactiveUS6331217B1Improve bindingQuality improvementPropellersFrom frozen solutionsTurbine bladeSingle crystal
Large gas turbine blades made from separate cast segments of superalloys are disclosed. The turbine blade is designed such that bond lines between adjacent segments are placed in low stress regions of the blade. The cast superalloy segments of the blades are aligned and fitted together with specified tolerances. The turbine blade segments are then joined by transient liquid phase bonding, followed by a controlled heat treatment which produces the desired microstructure in the bond region. The method allows for the production of large, high quality turbine blades by joining small, high quality cast superalloy sections, in comparison with prior attempts to cast large turbine blades as single pieces which have produced very low yields and high individual component costs.
Owner:SIEMENS ENERGY INC
Cleaning product and production process therefor
A cleaning product comprises a base sheet and at least one layer of filaments or split yarns oriented in one direction, the base sheet and the layer are stacked and bonded together at a plurality of bonding lines extending in a direction intersecting with the one direction, and the base sheet is cut together with the layer intermittently in the intersecting direction between adjacent bonding lines to form cutting portions, thereby forming brushing portions with the layer. The cleaning product can be produced simply and conveniently at small cost. Further, it also has an excellent dust collecting effect.
Owner:UNI CHARM CORP
Cleaning product and production process therefor
Owner:UNI CHARM CORP
Wiping sheet
InactiveUS6013349AImprove bending resistancePromote recoveryCleaning machinesCleaning equipmentPolymer scienceNonwoven fabric
An absorbent core 4 composed of a nonwoven fabric containing an absorbent fiber at 20% by weight or more to 80% by weight or less and a hydrophobic fiber at 20% by weight or more to 80% by weight or less is interposed between a top sheet 3 and a bottom sheet 5, both the sheets being composed of a nonwoven fabric containing an absorbent fiber, such as rayon, at 30% by weight or more to 70% by weight or less and a hydrophobic fiber at 30% by weight or more to 70% by weight or less. Then, the top sheet 3, the absorbent core 4 and the bottom sheet 5 are bonded together on bonding lines 2. These individual layers are water retentive because of the absorbent fiber therein, and the resulting sheet has good slip properties because of the hydrophobic fiber contained therein. The absorbent core 4 works to enhance the bending resistance.
Owner:UNI CHARM CORP
Composites joined with z-pin reinforcement
InactiveUS6436507B1Easy to manufactureLasting shelf-lifeFuselage framesLayered productsEngineeringBond line
Prefabricated composite detail parts use precured strips that include Z-pin reinforcement along the bond line. Each strip has Z-pin stubble protruding from opposed faces so that the pins are embedded into the detail parts when the joint forms.
Owner:THE BOEING CO
Moisture barrier coatings for organic light emitting diode devices
A barrier assembly having a flexible or rigid substrate, an organic electronic device, and one or more layers of diamond-like film. The diamond-like film layers can be used to mount, cover, encapsulate or form composite assemblies for protection of moisture or oxygen sensitive articles such as organic light emitting diode devices, photovoltaic devices, organic transistors, and inorganic thin film transistors. The diamond-like film layers can also provide for edge sealing of adhesive bond lines in the assemblies.
Owner:3M INNOVATIVE PROPERTIES CO
Bond line forming method
ActiveUS20080075603A1Easy to controlReduce the amount of adhesionPropellersEngine manufactureEngineeringMechanical engineering
Owner:GENERAL ELECTRIC CO
Wiping sheet and production thereof
InactiveUS6054202AHigh tensile strengthImproving surface frictional strengthCarpet cleanersFloor cleanersSingle fiberEngineering
Disclosed herein is a wiping sheet composed of two pieces of spunlace nonwoven fabrics containing heat-shrinkable fiber which are fusion-bonded together with fusion-bonding lines which extend in the cross direction perpendicular to the machine direction. The fusion-bonding lines are formed such that their pitch in the machine direction is shorter than one half of the fiber length so that each fusion-bonding line intersects a single fiber at 3 or more points. This structure prevents surface fluffing and imparts a high surface frictional strength and a high bending resistance for comfortable wiping work.
Owner:UNI CHARM CORP
Modularly constructed rotorblade and method for construction
Disclosed is a modularly constructed rotorblade including a leading and a trailing edge, including a plurality of rotorblade sections in bonded association, and at least one bonding line disposed away from continuous contact with the leading edge and the trailing edge.
Owner:GENERAL ELECTRIC CO
Thin bond-line silicone adhesive composition and method for preparing the same
InactiveUS20050049350A1Low viscosityImprove wettabilitySemiconductor/solid-state device detailsSolid-state devicesPolymer scienceBond line
Thermal interface compositions contain filler particles possessing a maximum particle size less than 25 microns in diameter blended with a polymer matrix. Such compositions enable lower attainable bond line thickness, which decreases in-situ thermal resistances that exist between thermal interface materials and the corresponding mating surfaces.
Owner:GENERAL ELECTRIC CO
Integrated heat spreader package for heat transfer and for bond line thickness control and process of making
A system includes a thermal interface material (TIM) to transfer heat from a die to a heat spreader. The system includes a heat transfer subsystem disposed on the backside surface of the die. In one embodiment, the heat transfer subsystem comprises a first heat transfer material and a second heat transfer material discretely disposed within the first heat transfer material. A method of bonding a die to a heat spreader uses a die-referenced process as opposed to a substrate-referenced process.
Owner:INTEL CORP
Method of room temperature covalent bonding
InactiveUS20040235266A1High densityLow densityLayered productsDecorative surface effectsChemical physicsPhysical chemistry
A method of bonding includes using a bonding layer having a fluorinated oxide. Fluorine may be introduced into the bonding layer by exposure to a fluorine-containing solution, vapor or gas or by implantation. The bonding layer may also be formed using a method where fluorine is introduced into the layer during its formation. The surface of the bonding layer is terminated with a desired species, preferably an NH2 species. This may be accomplished by exposing the bonding layer to an NH4OH solution. High bonding strength is obtained at room temperature. The method may also include bonding two bonding layers together and creating a fluorine distribution having a peak in the vicinity of the interface between the bonding layers. One of the bonding layers may include two oxide layers formed on each other. The fluorine concentration may also have a second peak at the interface between the two oxide layers.
Owner:INVENSAS BONDING TECH INC
Tie-layer adhesive compositions for styrene polymers and articles
Tie-layer adhesives for styrene polymer resins are provided. The adhesive compositions suitable for use in multi-layer film and sheet constructions are blends comprising ethylene-butene-1 LLDPE resins, styrene-isoprene-styrene triblock copolymers, graft-modified polyethylene and, optionally, ethylene-propylene elastomers.
Owner:EQUSR CHEM LP
Joining of bipolar plates in proton exchange membrane fuel cell stacks
InactiveUS6887610B2Reduce material costsAvoid contactFuel cells groupingElectrode carriers/collectorsEngineeringProton exchange membrane fuel cell
A bipolar plate assembly for a proton exchange membrane fuel cell stack advantageously connects electrically conductive plate surfaces, without the requirement to weld or braze the plate pairs. Each plate has alternating coolant channels and lands formed on an inside facing surface. An electrically conductive layer is deposited over at least the coolant channels and lands. Pairs of plates are aligned having facing electrically conductive layers. A fluid seal is disposed between the inside facing surfaces about a perimeter of the coolant channels. Each plate pair is compressed to form a plurality of electrical bond lines between adjacent lands within the perimeter seal. The perimeter seal prevents stack reactant gas oxygen from contacting and oxidizing the electrically conductive layer. A dielectric coolant is also used to reduce oxidation of the electrically conductive layer.
Owner:GM GLOBAL TECH OPERATIONS LLC
Insulating microwave interactive packaging
InactiveUS20050173425A1Improve cooking resultsPromote browningDomestic cooling apparatusLighting and heating apparatusMicrowave ovenEngineering
The combination of insulating material with microwave interactive food packaging for enhanced cooking properties is disclosed. An insulating microwave packaging material (200) and a method of making the same are also disclosed. In one embodiment, the insulating microwave packaging material (200) is formed by bonding a microwave interactive material substrate (205) that creates sensible heat upon exposure to microwave energy to a second substrate (210) along bond lines (212) arranged in a pattern to form closed cells (214). Upon impingement of the insulating microwave packaging material (200) by microwave energy in a microwave oven, the closed cells (214) expand to form insulating pockets (216). One side of the insulating pocket (216) bulges and lofts above the opposite side. When a food product is situated on the insulating microwave packaging material (200), the insulating pockets (216) insulate the food product from the microwave oven environment.
Owner:GRAPHIC PACKAGING INT +1
Pleated and cellular materials
InactiveUS7159634B1Easy to operateUniform appearanceExtensible doors/windowsCurtain accessoriesEngineeringMechanical engineering
A tabbed honeycomb structure or pleated panel is made from a stack of collapsed multi-cellular material. The stack is split at bond lines thereby forming the panels of pleated or honeycomb material having a joint tab on one face. The tabbed, honeycomb material is attached between a headrail and a bottomrail to form a window covering.
Owner:JUDKINS REN
Film adhesives containing maleimide compounds and methods for use thereof
InactiveUS20050107542A1Polyureas/polyurethane adhesivesSolid-state devicesThermoplastic elastomerMacromonomer
In accordance with the present invention, there are provided film adhesive compositions comprising at least one macromonomer having at least one unit of ethylenic unsaturation, at least one thermoplastic elastomer co-curable with the macromonomer, and at least one cure initiator, and methods for use thereof. Invention compositions are useful as adhesives in the microelectronics industry. In particular, invention film adhesives may be used to produce microelectronic assemblies with very thin bond lines without compromising adhesive strength.
Owner:HENKEL CORP
Thin bond-line silicone adhesive composition and method for preparing the same
InactiveUS20050148721A1Thermal resistance minimizationLow viscositySemiconductor/solid-state device detailsSolid-state devicesPolymer scienceSilicone adhesive
Owner:GENERAL ELECTRIC CO
Low compressive force, non-silicone, high thermal conducting formulation for thermal interface material and package
An improved thermal interface material for semiconductor devices is provided. More particularly, low compressive force, non-silicone, high thermal conductivity formulations for thermal interface material is provided. The thermal interface material comprises a composition of non-silicone organics exhibiting thermal conductivity of approximately 5.5 W / mK or greater and a compressed bond-line thickness of approximately 100 microns or less using a compressive force of approximately 100 psi or less.
Owner:IBM CORP
Multilayered structure with water-impermeable substrate
ActiveUS20170028688A1High print qualityHigh durabilityDuplicating/marking methodsPolyureas/polyurethane adhesivesLayered structureWater dispersible
In accordance with the present invention, there is provided a multi-layered structure includes:a) a water-impermeable substrate;b) a first layer on at least one surface of the substrate comprising a water-based tie-layer composition;c) a second layer formed over the first layer, wherein the second layer is a water-based ink-receptive composition includes:i) a multivalent metal salt; andii) a hydrophilic binder polymer;d) a third layer including at least one water-based ink composition deposited in a single pass by an inkjet printing process, wherein the water-based ink composition includes an anionically stabilized, water-dispersible pigment; ande) additional layers deposited over the one or more ink layers and exposed second layer, the additional layers selected from one or more of the following compositions:i) an opaque white layer;ii) a protective layer; andiii) an adhesive layer, further includes a continuous protective plastic or paper layer adhered thereto.
Owner:EASTMAN KODAK CO
Continuous strip of plastic bags, method and apparatus for making same, and novel plastic bag constructions
InactiveUS20030053720A1Conveniently openedFacilitates locating the severance lineEnvelopes/bags making machineryBag making operationsPlastic materialsEngineering
A continuous strip of individually severable plastic bag includes a flattened, hollow, tubular structure of a thin plastic material formed with a plurality of longitudinally-spaced transverse bond lines to define closed bottoms of plastic bags when individually severed from the continuous strip, with a transverse severance line on one side of each transverse bond line to permit severance of an individual plastic bag, and with a pair of finger tabs adjacent each transverse severance line to facilitate opening a plastic bag when severed from the continuous strip. Several preferred embodiments are described wherein the finger tabs are integrally formed with the continuous strip, and wherein they are formed as separate elements bonded to the continuous strip.
Owner:SMITH SOL +1
Fastening system
ActiveUS7895718B2Reduce processPremature failureSnap fastenersLayered productsEngineeringMechanical engineering
Owner:PROCTER & GAMBLE CO
Flip chip package capable of measuring bond line thickness of thermal interface material
ActiveUS7015577B2Easy to observeReduce warpageSemiconductor/solid-state device detailsSolid-state devicesBond lineHeat spreader
A flip chip package includes a substrate, a flip chip, a thermal interface material and a heat sink. The flip chip is mounted on the substrate. The thermal interface material is applied on the back surface of the flip chip. The back surface of the flip chip includes a region uncovered by the thermal interface material. The opening exposes the uncover region of the back surface of the flip chip for measuring the height of the back surface. Also the opening has an inner sidewall above the back surface for fillet bonding of the thermal interface material. Therefore the bond line thickness (BLT) of the thermal interface material can be measured and calculated.
Owner:ADVANCED SEMICON ENG INC
Composite reinforcement of metallic structural elements
A selectively reinforced hybrid metal-composite structural element can include a metal element and a composite material. The composite material can be bonded to the metal element by an adhesive layer including a polymer matrix using a radiation curing process, resulting in insubstantial or negligible residual stresses at the bond line between the metal element and the composite element. The structural element also can include a metal closeout cap to provide a barrier from a corrosive atmosphere, and the adhesive layer can encapsulate the composite element to provide a corrosion-resistant barrier between the composite element and the surrounding metal.
Owner:THE BOEING CO
Barrier heat sealing type biaxial tensile composite thin film and preparation method thereof
InactiveCN102501511ASimple production processLow costSynthetic resin layered productsLinear low-density polyethyleneLow-density polyethylene
The invention discloses a barrier heat sealing type biaxial tensile composite thin film and a preparation method thereof. The thin film comprises two surface layers, and at least a barrier layer, wherein the surface layer and the barrier layer are connected through bonding layers. The thin film is characterized in that the two surface layers comprise the following components, by weight, 90-99% of metallocene linear low density polyethylene resin with a characteristic of bimodal molecular weight distribution, 0-5% of an antistatic agent, 0-5% of an anti-adhering agent, 0-5% of a smoothing agent, and 0-5% of an antioxidant; the barrier layer is a barrier polymer, and the bonding layer is a high strength and high temperature resistance adhesive. The preparation method adopts a multi-layer co-extruding successive biaxial tensile process or a multi-layer co-extruding simultaneous biaxial tensile process. The composite thin film has excellent gas and moisture barrier property, and the mechanical properties of the thin film are further improved. The thin film has characteristics of high tensile strength, low temperature high heat sealing strength, and high puncture resistance strength.
Owner:FSPG HI TECH
Thin bond-line silicone adhesive
InactiveUS20050049357A1Low viscosityImprove wettabilitySemiconductor/solid-state device detailsSolid-state devicesSilica gelSilicone adhesive
Thermal interface compositions contain filler particles possessing a maximum particle size less than 25 microns in diameter blended with a polymer matrix. Such compositions enable lower attainable bond line thickness, which decreases in-situ thermal resistances that exist between thermal interface materials and the corresponding mating surfaces.
Owner:GENERAL ELECTRIC CO
Bonding patterns for construction of a knitted fabric landing zone
A knitted fabric female fastening portion for a mechanical fastener having a knitted fabric, an underlying substrate, a bonding layer, said bonding layer having a first plurality of non-intersecting bond lines and a second plurality of non-intersecting bond lines which are combined to form a pattern of intersecting bond lines that define tessellating pattern elements. Said pattern of intersecting bond lines may have a CD percent coverage standard deviation not equal to 0% and an MD percent coverage standard deviation not equal to 0%.
Owner:THE PROCTER & GAMBLE COMPANY
OBC Based Packaging Adhesive
InactiveUS20120165455A1Improve adhesionIncrease flexibilityFilm/foil adhesivesPolymer sciencePolyolefin
Owner:BOSTIK INC
Asymmetric elastic film nonwoven laminate
An elastic nonwoven laminate comprising an elastic film layer extrusion laminated along at least one face to an asymmetric nonwoven web. The elastic film layer is extrusion laminated along a plurality of cross direction extending bond lines were the asymmetric nonwoven fibers are at least partially embedded into the extruded elastic film. The asymmetric nonwoven webs are preferably bonded to both faces of the elastic film layer where the bond lines are 0.1 to 2.0 mm wide and there are from 0.5 to 10 bond lines / cm.
Owner:3M INNOVATIVE PROPERTIES CO
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