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Ultrafast laser processing method and device of transparent material

A technology of transparent materials and processing methods, used in laser welding equipment, metal processing equipment, manufacturing tools, etc., can solve problems such as processing limitations, and achieve the effects of stable laser output, improved removal efficiency, and guaranteed accuracy

Pending Publication Date: 2018-11-13
杭州银湖激光科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] The purpose of the present invention is to provide a processing method for transparent materials, to overcome the problem of limited processing in the prior art, and to improve the accuracy and speed of laser transparent material processing

Method used

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  • Ultrafast laser processing method and device of transparent material
  • Ultrafast laser processing method and device of transparent material
  • Ultrafast laser processing method and device of transparent material

Examples

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Embodiment 1

[0039] Embodiment one: see figure 2 As shown, a transparent material processing device is composed of an ultrafast pulse train laser, a scanning galvanometer, and a focusing lens. See figure 1 , the ultrafast pulse train laser is mainly composed of a pulse train seed laser with an output wavelength between 1020 nm and 1090 nm, a multi-stage or single-stage fiber amplifier, and a collimator, and the output light of the pulse train seed laser passes through the fiber amplifier After amplified, the collimator outputs a laser pulse train after being collimated; the laser pulse train is focused on the position of the transparent material to be processed by the focusing lens after passing through the scanning galvanometer.

[0040] In this embodiment, the scanning galvanometer is a three-dimensional galvanometer, the repetition rate of the laser is 600,000 total pulses per second, the pulse width is 180ps, the number of laser pulses in the pulse train is 2, and each pulse in the pu...

Embodiment 2

[0041] Embodiment two: see attached image 3 As shown, a transparent material processing device is composed of an ultrafast pulse train laser and a focusing lens, see figure 1 , the ultrafast burst laser is mainly composed of an ultrafast burst seed laser with an output wavelength between 1020 nm and 1090 nm, a multi-stage or single-stage fiber amplifier, and a collimator, and the output light of the burst seed laser is passed through After being amplified by the fiber amplifier, the collimator outputs a laser pulse train after being collimated; the laser pulse train is focused on the position of the transparent material to be processed by the focusing lens.

[0042] In this embodiment, the pulse train laser is focused on the transparent material by the lens, the lens is installed on the moving belt, and the linear cutting is realized by moving the lens, the transparent material is arranged on the mechanical moving platform, and the transparent material is relatively relativel...

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Abstract

The invention discloses a processing method and device of a transparent material, and provides an optical fiber laser of which the wave length is 1020 nm to 1090 nm. The processing method is characterized in that laser beams output by a seed laser are subjected to energy amplification through an optical fiber amplifier, laser pulse trains are output, each pulse train comprises at least two laser pulses, pulse width is smaller than 200 ps, peak power of the pulses is larger than 100 kW, the time among the laser pulses in each pulse train is smaller than 90 ns, the interval among the pulse trains is larger than 240 ns, and the total pulse number in each second is larger than 50,000, wherein ultrafast laser beams output by the laser are subjected to energy amplification only through the optical fiber amplifier; and the laser is focused on a to-be-processed position of the transparent material, a focus position is moved, processing is carried out according to a set track, a focus point isgradually risen, and the transparent material is processed from bottom to up. According to the processing method, material removal efficiency can be greatly improved, a heating or etching follow-up procedure is not required, and bevel angles are avoided.

Description

technical field [0001] The invention relates to a transparent material processing method, in particular to an ultrafast laser processing method for transparent materials. Background technique [0002] Glass and sapphire transparent materials have become an indispensable part of people's daily life. With the development of economy, the demand for glass products is increasing day by day. In the glass and sapphire production industry, glass and sapphire processing is a very important link. [0003] Generally speaking, glass and sapphire processing (cold processing) mainly includes polishing, cutting, drilling, engraving, edging, etc. In order to industrialize the above-mentioned glass and sapphire processing purposes, the processing methods used in the prior art mainly include mechanical processing methods, chemical processing methods (mainly used for polishing and etching), high-pressure water jet processing methods (mainly used for cutting and drilling) holes) and laser pro...

Claims

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Application Information

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IPC IPC(8): B23K26/06B23K26/36B23K26/402B23K26/064
CPCB23K26/06B23K26/0648B23K26/36B23K26/402
Inventor 蒋仕彬
Owner 杭州银湖激光科技有限公司
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