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Machining method for drilling sapphire glass

A technology of sapphire glass and processing methods, which is applied in metal processing equipment, manufacturing tools, and machine tools designed for grinding the rotating surface of workpieces, etc., can solve the problems of cost increase, easy cracking and fragmentation of glass sheets, and achieve waste reduction and Material cost, reduction of possibility of glass chipping or chipping, effect of improving utilization rate

Inactive Publication Date: 2015-06-10
肖衍盛 +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The disadvantages of the laser drilling method are as follows: the equipment for laser drilling is usually expensive, which makes the equipment investment larger and the cost increases, and the glass sheet is easy to crack during the drilling process; Drilling, the force of drilling is concentrated on one surface of the glass, but sapphire glass has high brittleness and low impact resistance. If the force is too large, it will easily chip or break during processing, resulting in poor production. The rate is not high, and the material utilization rate is not high, which limits its promotion and use

Method used

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  • Machining method for drilling sapphire glass

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Effect test

Embodiment 1

[0022] The shape of the hole drilled in this embodiment is a circular hole with a diameter of 1cm, and the thickness of the sapphire glass is 0.2mm. figure 1 , including the following steps:

[0023] (a) Provide clean sapphire glass, and apply protective glue on its two surfaces, the protective glue is UV glue, the thickness is 0.03mm, and the UV glue is cured;

[0024] (b) mark a circular hole with a diameter of 1 cm on the sapphire glass coated with protective glue in step (a);

[0025] (c) Place the sapphire glass coated with protective glue in step (b) on the fixture of the CNC milling machine, the hole shape of the round hole corresponds to the position of the grinding head, and the grinding head is an emery grinding head;

[0026] (d) carry out regional rough machining to one of the sides of the round hole shape described in step (c), the emery grinding head grinds back and forth along multiple diameters in the round hole shape ring, and the grinding thickness is 1% of ...

Embodiment 2

[0030] The hole shape of the drilled hole in this embodiment is an oval hole with a major axis of 2 cm and a minor axis of 1.5 cm, and the thickness of the sapphire glass is 0.4 mm for reference figure 1 , including the following steps:

[0031] (a) Provide clean sapphire glass, and apply protective glue on its two surfaces. The protective glue is UV glue with a thickness of 0.04mm, and the UV glue is cured;

[0032] (b) On the sapphire glass coated with protective glue in step (a), mark the oval hole shape with a major axis of 2 cm and a minor axis of 1.5 cm;

[0033] (c) Place the sapphire glass coated with protective glue in step (b) on the fixture of the CNC milling machine, the shape of the oval hole corresponds to the position of the grinding head, and the grinding head is an emery grinding head;

[0034] (d) one of the sides of the round hole shape described in step (c) is rough-machined in the area, and the emery grinding head is ground along the edge of the hole shap...

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Abstract

The invention discloses a machining method for drilling sapphire glass. The machining method for drilling sapphire glass comprise the following steps of coating protection glue on the surface on to-be-machined sapphire glass, identifying a shape of a to-be-machined hole, respectively performing rough machining on bilateral sides of the hole, obtaining rough holes, finishing the tough holes to achieve drilling procedures. According to the machining method for drilling the sapphire glass, rough machining is performed on bilateral sides of the sapphire glass hole, the acting force cannot be concentrated on one lateral side, the machining acting force on the sapphire glass surface is scattered, the protection glue coats on the sapphire glass surface, the protection glue is dirty proof, rust preventing, acid and alkali resistant and scratch resistant and plays a role in buffering, hedging of the machining acting force and the sapphire glass stress is reduced, and accordingly possibilities of glass edge breakage or fragment are reduced, the yield can be improved to 99%, the use ratio of materials is greatly improved, and waste and material costs are reduced.

Description

technical field [0001] The invention belongs to a processing method for opening holes on sapphire glass. Background technique [0002] Sapphire has attracted widespread attention because of its advantages such as high hardness, high melting point, good light transmission, and stable chemical properties, and has been partially used in high-tech fields such as machinery, optics, and information. Artificially grown sapphire has good wear resistance and high hardness. At the same time, the compactness of sapphire makes it have a large surface tension, which is very suitable for electronic touch panels such as mobile phones. Such sapphire glass profiles have at least one outer contour radius or at least one hole. Outer contour fillets and holes include but are not limited to semi-circular arcs and circular holes, and can also be curved arcs, square holes, elliptical holes or irregular holes. There are two common processing methods for drilling sapphire glass: laser drilling and...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B5/48
CPCB24B5/48
Inventor 肖衍盛
Owner 肖衍盛
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