The utility model relates to a kind of cavity circuit boards.The cavity circuit board includes first
copper foil, first solidified sheet, second
copper foil,
integrated circuit packaging film, first double-layer
copper-clad plate, second solidified sheet, second double-layer copper-clad plate, third solidified sheet, third
copper foil, fourth solidified sheet and fourth
copper foil in turn laminated, wherein:the first double-layer copper-clad plate and the second double-layer copper-clad plate each include first copper layer,
glass fiber resin composite layer and second copper layer in turn laminated;And the first double-layer copper-clad plate and the second solidified sheet are partially removed to form a cavity inside the cavity circuit board.According to the technical scheme of the utility model, the
integrated circuit (IC) packaging film is used for the manufacture of cavity circuit board, which solves the problem of concave after pressing in the traditional manufacturing method, and avoids the use of
gasket, which is inconvenient to take and difficult to
mass-produce, improves the quality and production efficiency of the circuit board manufacturing, and enhances the stability and reliability of the product.