109results about How to "No chipping" patented technology

A surface-coated cutting tool which has excellent chipping resistance and wearing resistance in high-speed cutting processing such as high-speed gear cutting processing, high-speed milling processing,and high-speed drilling processing. The surface-coated cutting tool comprises a tool base, e.g., a cemented carbide base, cermet base, or high-speed tool steel base, and at least a hard coating layerformed on a surface of the tool base and having a multilayer structure composed of a thin layer (A) and a thin layer (B) alternating therewith. The thin layer (A) is constituted of an (Al,Cr,Si)N layer satisfying the empirical formula ¢AlXCrYSiZ!N (wherein 0.2 <= X <= 0.45, 0.4 <= Y <= 0.75, 0.01 <=Z <= 0.2, and X+Y+Z=1 in terms of atomic ratio), and the thin layer (B) is constituted of an (Al,Ti,Si)N layer satisfying the empirical formula ¢AlUTiVSiW!N (wherein 0.05 <= U <= 0.75, 0.15 <= V <= 0.94, 0.01 <= W <= 0.1, and U+V+W=1 in terms of atomic ratio).

The invention relates to an electrode movement guide mechanism for the electric spark processing of micro inverted taper holes and belongs to the technical field of the special micro machining. The mechanism adopts an external cylindrical surface of a rotating shaft to position the movement guidance of the micro electrode wires which are restricted and positioned into a rectangular guide groove which consists of a left cushion block and a right cushion block under the rotating shaft; the thickness of the cushion blocks is adjusted so as to cause the left cushion block and the rectangular guide groove to incline; the micro electrode wires incline to the axis of the rotating shaft for certain angle and the intersection point of the micro electrode wires and the axis is positioned at the upper surface of a work piece. When in processing, the micro electrode wires perform servo feed under the action of an automatic compensation mechanism for the micro electrode loss and at the same time move along a set conical surface driven by the electrode movement guide mechanism of the invention, thus processing the inverted taper holes on the work pieces. The electrode movement guide mechanism is arranged below a normal-closed screw clamping mechanism and forms an electric spark processing device for micro inverted taper holes with a micro electrode servo driving mechanism and the automatic compensation mechanism for the micro electrode loss to be used in the processing of micro inverted jet orifices of oil injection nozzles.

The invention relates to an intelligent wood floor cutting production line. The intelligent wood floor cutting production line comprises a feeding mechanism, a wood floor cutting machine and a discharging mechanism which are arranged in sequence. The intelligent wood floor cutting production line has the beneficial effects that the surface plate and the backing plate of a medium plate cut from a large plate are consistent in smooth finish, no cutting surface is damage, and the rejection rate is remarkably lowered; the loss is low, the outturn percentage is high, the width of a finished product is increased, and the size precision of wood floor cutting is high; the manpower is saved, the labor intensity is reduced, and the machining efficiency is improved; and the intelligent wood floor cutting production line is suitable for a wood floor cutting process, that is, the intelligent wood floor cutting production line can be used for cutting the large plate into the medium plate.

The invention relates to the improvement of mortice structure of wood floor and fiber glued floor, and the improvement of assembly method of wood floor and fiber glued floor, in particular to floor plastic fastener which is convenient for connecting and positioning. The improvement of the invention includes that plastic frame is arranged at the periphery of wood floor or fiber glued floor; the lower part of the external side of the plastic frame is respectively provided with a step guide which is capable of drawing back; the step guides are respectively and evenly provided with a plastic slide block, the external side of which extends out of the guide surface, and the plastic slide block, the external side of which extends out of the guide surface, matches with the step guide surface corresponding to the frame of the assembly floor; while assembling, the plastic slide block sliding along guide surface causes the plastic slide block and the plastic slide block to match with each other and to be located. The mortice structure of the invention changes the fastener structure and assembly method of the existing floor, causing no squeezing of the surface decoration layer of floor edge and no edge collapsing of the decoration layer while assembling, being able to adjust the size of the clearance between floors; the fastener of the floor need not differentiate with left and right, and thus free assembly in any end can be done while disassembling, which is convenient for production and assembly; in addition, the plastic fastener has high intensity, saves material and has low cost.

The invention relates to a method for a MEMS wafer. The cutting method comprises the following steps of pasting a membrane on the front surface of the wafer to protect an MEMS structure; focusing a laser on the inner part of the wafer, irradiating to form a modified layer at a position from the front surface of the wafer to the inner part of the wafer; irradiating the laser to the back surface of the wafer at a position corresponding to that of the modified layer so as to form a mark groove on the back surface of the wafer; performing water jet cutting on the back surface of the wafer along the position of the mark groove but do not reach the bottom so as to form a water jet cutting groove from the back surface of the wafer to the inner part of the wafer, wherein one end far away from the back surface of the wafer of the water jet cutting groove is connected with the modified layer; and extending splits along the modified layer till to all the MEMS structures are separated completely from each other. The method for the MEMS wafer combines the advantages of laser irradiation and water jet cutting, and realizes the edge breakage-free and low-contamination cutting for the MEMS wafer.

The invention relates to a synthetic polyisoprene rubber plug for an injection and a preparation method thereof. The synthetic polyisoprene rubber plug for the injection comprises the flowing components in percentage by weight: 61.24-76.22 percent of isoprene rubber, 15.24-24.49 percent of pottery clay, 0.30-0.55 percent of stearic acid, 6.1-7.35 percent of white carbon black, 1.52-5.42 percent of titanium dioxide, 0.15-0.24 percent of carbon black and 0.46-0.61 percent of peroxide vulcanizing agent. According to the synthetic polyisoprene rubber plug disclosed by the invention, due to the adoption of a peroxide vulcanizing system, an isoprene rubber product is prepared from a raw material without sulfur; the final rubber plug product cannot generate a sulfur-containing substance; and the produced isoprene rubber product can be directly contacted with medicines for use and has the advantages of stable performance, puncture resistance, no falling scraps, favorable elasticity, no needle extracting leaked liquid, favorable sealing property and the like.

The invention provides a surface processing method of a strip laser medium. According to the method, high surface figure accuracy and excellent surface smoothness can be obtained by the strip laser medium at the same time. The surface processing method of the strip laser medium comprises the following steps of: bonding and hanging the cut strip laser medium by a binder; respectively grinding and pre-polishing two large surfaces on a plane grinder; hanging the pre-polished strip laser medium in an elastic adsorption manner, and precisely polishing the strip laser medium after being hung in the elastic adsorption manner on the plane grinder by a synthesis polishing plate. By adopting the surface processing method of the strip laser medium provided by the invention, hanging in the elastic adsorption manner is adopted by precisely finishing; the operation is simple and convenient; a problem of surface deformation after a element is taken off is not caused; glass or crystal for tripping does not need to be adhered around the work-piece, and a risk of edge breakage or angle breakage of the element in a processing process is avoided.

The invention discloses a diamond grinding wheel and a manufacturing method thereof. The diamond grinding wheel comprises a grinding wheel base body and an abrasive layer attached to the grinding wheel base body. The abrasive layer is composed of, by volume percent, 20-30% of diamond abrasive, 40-50% of phenolic resin, 5-15% of carbonyl iron, 5-15% of cryolite and 10-20% of graphite. Due to the fact that diamond, a bonding agent and functional filler are reasonably selected and all components are scientifically proportioned, a grinding wheel block conducts grinding sharply, and when the grinding wheel block is used for grinding silicon carbide ceramic materials, the high grinding efficiency is achieved; and when the grinding wheel block is applied to machining of chamfers of silicon carbide sealing rings, the surface smoothness of the chamfers can reach Ra 0.1, and the chamfers R are smaller than or equal to 0.05 mm. The grinding wheel of a specific conical structure is adopted and can be installed on a common grinding machine to directly conduct grinding and forming machining on the chamfers of the silicon carbide sealing rings, the machining efficiency is high, the angle of the grinding machine does not need to be adjusted, and consistency of the machined chamfers is good.

The purpose of the present invention is to provide a coated surface cutting tool that exhibits excellent peeling resistance and chipping resistance under deep cutting conditions of high speed, high cutting depth and high feed rate in which high loads act on the cutting edge. Provided is a coated surface cutting tool in which a hard coating layer obtained from an under layer and an upper layer is formed on the surface of a tool substrate configured from a tungsten carbide-based hard alloy or a titanium carbonitride-based cermet, wherein: said under layer is obtained from a Ti compound layer comprising at least a TiCN layer; and the upper layer is obtained from an Al2O3 layer with an alpha-type crystal structure and when the coincidence boundary distribution graph of the Al2O3 crystal grainsof the upper layer is measured, sulfur is segregated at grain boundaries of at least delta31, the grain boundary length thereof accounts for 20-50% of the total grain boundary length for constituentatom-sharing lattice point forms of at least delta3, and the absolute value of the residual stress of the upper layer on the flank and the cutting face comprising at least the cutting edge ridge is 100 MPa or less.

The embodiment of the invention discloses a laser cutting system. The laser cutting system sequentially comprises a laser unit, a laser receiving unit, a beam expanding unit, a dodging unit, a shielding unit, a light beam conversion unit and a collimating and focusing assembly in the light path direction, wherein the laser unit is used for providing a laser beam; the beam expanding unit is used for expanding the laser beam into an expanded laser beam; the dodging unit is used for modulating the expanded laser beam into a uniform laser beam with uniformly distributed light intensity flat top; the shielding unit is used for shielding the edge part of the uniform laser beam and stray light outside the uniform laser beam; the light beam conversion unit is used for modulating the uniform laserbeam into a hollow annular laser beam and forming a Bessel laser beam along the optical axis direction; and the collimating and focusing assembly is used for collimating and focusing the Bessel laserbeam. According to the laser cutting system, the problems of large taper, poor section uniformity and the like of the section of the cut material caused by Gaussian distribution of light intensity distribution of the existing laser processing system are solved.

The invention relates to a progressive mold and tapping device which is characterized in that a gear box assembled on the upper mold is connected with a transmission box via a transmission gear. The top of the transmission shaft in the transmission box is provided with a tap. A gear rack fixed on the lower mold is coordinated with the gear in the gear box. When the upper mold moves downward, the gear box changes the straight line motion of the punch to the rotating motion, and changes the direction and velocity for enabling the tap on the transmission shaft to rotate and simultaneously move downward to tap the preserved through hole on the belt material, thus the tapping is simultaneously completed during the punching process, thereby changing the traditional production mode of firstly punching and secondly tapping, enabling the production efficiency to be greatly increased, decreasing the cost and increasing the economical effect.

The invention discloses a method and a device for correlative multi-focus laser separation of a fragile transmission material. The method is characterized in that the same technological parameters are adopted, and coaxial laser is utilized to penetrate multi-focus lens groups and to conduct inverse correlation on two sides in the thickness direction of the fragile transmission material to be separated, so that the number of focuses generated in the fragile transmission material is doubled to improve the laser energy absorption uniformity of the fragile transmission material in the thickness direction and to enhance the heating expansion uniformity of the fragile transmission material in the thickness direction. After a laser multi-focus beam leaves, the fragile transmission material is quickly cooled down in the thickness direction to produce tensile stress, so that separation of the thick fragile transmission material is realized by laser. The device comprises two sets of multi-focus laser processing systems and one three-dimensional working platform, wherein each set of the multi-focus laser processing system comprises a laser, light guiding mirrors, a beam expanding mirror and a multi-focus lens group. The method and the device realize high-quality, efficient and high-success-ratio separation of the thick fragile transmission material.

The invention discloses a machining method for punching a small hole on glass, relates to the technical field of glass punching, and aims to solve the technical problems of a current machining method that a low punching yield, a low output yield, hole caving defects and surface heterochrome defects are easily caused. The machining method for punching the small hole on glass comprises the following steps that machining software is started; after a system is reset, a machining interface is entered to select a machining process; the to-be-machined glass is placed on a jig platform of a laser, wherein a BM surface is upward, and an AS surface is downward; the to-be-machined glass clings to a positioning edge of the jig platform, and a negative pressure is adjusted to a preset value, so that the to-be-machined glass is firmly fixed on the jig platform; a small hole negative pressure dust drawing device is started, and a CCD visual system is used for edge grabbing and positioning, so that a green ray is emitted by the laser to perform small hole machining; after the small hole is machined, firstly the small hole is cleaned with clear water, and then a hole wall is cleaned by pointing an air gun at the small hole; and water on the glass is wiped with a dustless dry cloth.

The invention provides a cutting tool covered with diamond. The tool substrate composed of tungsten carbide cemented carbide or titanium carbonitride base metallic ceramics is covered with a crystal diamond layer. Nanometer diamond film having average grain diameters of 1 to 50 nm and laminated alternatively at a lamination space of 0.2 to 2.0 micrometers and alternating lamination films of crystal diamond film having average grain diameters of 0.1 to 2 micrometers cover the crystal diamond layer. The shortest distance between the front end of a cutting blade to the crystal diamond layer is determined to be 3 to 15 micrometers. And a non-crystal carbon film having surface roughness less than 0.1 micrometer and thickness of 10 to 200 micrometers is formed on the surface layer of a front blade face of the nanometer diamond layer of the cutting blade.

The invention discloses a method for processing a three-dimensional contour of a transparent material. The whole transparent material is processed according to a preset path through a laser beam, laser processing energy is continuously adjusted according to different processing depths, the Z axis height and a corresponding processing track are changed, and the three-dimensional contour of the transparent material is formed; after the three-dimensional contour of the transparent material is formed, a forming method is used for treatment, and the three-dimensional contour of the transparent material is separated from waste to be formed finally. The laser beam acts in the thickness direction of the whole transparent material, the transparent material is modified through ultra-short pulse width, the transparent material is formed and separated through a special treatment method, a crack-free damage-free workpiece is obtained, generation of small debris is avoided, and the product yield isimproved.

The invention discloses a production process of a new energy solar power generation panel. The production process comprises the steps: putting produced battery pieces into a battery testing machine for testing output parameters of the batteries and classifying the battery pieces, connecting the solar batteries in series in an infrared spot welding manner to form a solar battery string, and puttingthe batteries into the grooves in the corresponding mold plates through a mechanical arm. By adopting the process product produced and molded by the invention, the production efficiency is greatly improved by adopting a full-automatic production mode, and the positive terminal and the negative terminal can be further formed on the back surface of the base material through the electric soldering iron and the soldering tin wire, so that the convenience of the whole solar cell panel in use is greatly improved; the heat conduction coating is excellent in binding power, weather resistance meets the requirement for the service life of 25 years or longer of the solar module, the heat conduction effect is excellent, the light conversion efficiency of the solar backboard is greatly improved, and the process of the product better meets the market requirement.

The invention discloses a device isolation method in semiconductor manufacturing process, including the following steps: a silicon substrate is provided, a pad oxidation layer and a pad silicon nitride layer are deposited on the surface of the silicon substrate; the pad oxidation layer, the pad silicon nitride layer and the silicon substrate are etched, so as to form a trench on the silicon substrate; a lining oxidation layer is formed on the inner wall and bottom surface of the trench; a lining silicon nitride layer is formed on the surface of the lining oxidation layer in the trench; high density plasma chemical vapour deposition method is utilized to deposit a silicon oxide layer on the surface of the silicon substrate; the pad silicon nitride layer and the pad oxidation layer are removed; and etching is carried out on the lining silicon nitride, so that a cavity is formed between an active region and a high density plasma region. The method of the invention can prevent damage of plasma to active region corner as a lining silicon nitride layer is formed on the lining oxidation layer, boron aggregation can be avoided, short corner can be avoided, and stress of high density plasma to the silicon substrate can be reduced.

The invention discloses a sapphire dome grinding method. A combination of metal bond diamond grinding heads of different particle sizes and shapes are adopted for machining. The method includes adopting a cylindrical diamond grinding head to grind the end face and the outer circle of a sapphire, and adopting diamond spherical grinding heads of different particle sizes to grind the inner sphericalsurface; adopting a turning method to machine a tool with one end as the hemispherical surface concentric with the grinding inner spherical surface and the other end as an optical axis; milling 6-8 grooves in the hemispherical surface by milling; bonding the workpiece to the tool coaxially by high-strength glue, and injecting the high-strength glue from the grooves; adopting cup-shaped diamond grinding heads of different particle sizes when grinding the outer spherical surface with the coarse grinding particle size of #100-#180 and the fine grinding particle size of #240-#320. According to thesapphire dome grinding method, a ground sapphire dome is smooth in surface without chipping, crushing and fracture processing defects, and the surface roughness Ra is less than 1 Mum.

The invention discloses a pipe fitting internal thread incremental rolling-extruding forming device. The pipe fitting internal thread incremental rolling-extruding forming device comprises an electricspindle box body of a numerically-controlled machine tool, a centring chuck is connected to one side of the electric spindle box body, a clamping jaw is fixed to one side of the centring chuck, a pipe fitting sample is fixed into the clamping jaw, a rolling-extruding forming tool wheel is arranged in the pipe fitting sample, a driving device is connected to one end of the rolling-extruding forming tool wheel, and a numerical control device of the numerically-controlled machine tool is connected to the electric spindle box body. The problem of low quality of an internal thread formed by current milling is solved.

The invention belongs to the technical field of optical imaging and particularly relates to an optical heating window of a camera. The optical heating window structurally comprises a window body, wherein the window body comprises a first surface and a second surface; the first surface comprises a light transmitting zone located in the center and a heating zone surrounding the light transmitting zone, and a conductive film is arranged on the heating zone and connected with a heating circuit. The technical problems that existing optical windows of cameras have poor defrosting and demisting effects and affect camera imaging easily are solved. The annular conductive film is arranged to heat the optical window of the camera, uniform and quick heating can be realized, the heating effect is good,the window transmittance is high, no effects are caused to optical system imaging, and the heating wire shielding problem is avoided. The window cannot produce stray light such as ghost images understrong light and is particularly applicable to cameras or video cameras working in humid and cold environments.

The invention provides a microwave vacuum sintering method of ultra-fine grain hard alloy and hard alloy products and relates to the technical field of hard alloy manufacturing. The ultra-fine grain hard alloy raw material comprises the following components in percentage by mass, including 88-92% of WC powder and 8-12% of Co powder, wherein the Fisher particle size of the WC powder is 0.3-0.6 microns, and the Fisher particle size of the Co powder is 0.6-1.0 microns; and the microwave vacuum sintering comprises four stages of inert gas positive pressure dewaxing, vacuum degassing solid phase sintering, high temperature vacuum liquid phase sintering and cooling. The hard alloy products subjected to the microwave vacuum sintering have the advantages of consistent hardness distribution, finerWC crystal grains, more uniform microstructure, good magnetic property, high density, low porosity, excellent mechanical property and chemical corrosion resistance.

The invention provides a large-diameter crystal wafer chamfering tool and a chamfering method thereof. The chamfering tool comprises a four-shaft grinding machine, a bowl-shaped chamfering tool and a crystal wafer vacuum sticky hook, wherein the bowl-shaped chamfering tool comprises a bowel body with a spherical concave surface and a connector installed at the lower part of the bowl body, a grinding sand layer is arranged on the spherical concave surface of the bowel body, and the connector of the bowl-shaped chamfering tool is installed on a transmission shaft of the four-shaft grinding machine; the center of the crystal wafer vacuum sticky hook is corresponding to the center of the spherical concave surface. The chamfering method comprises the following steps of: starting the four-shaft grinding machine, and adjusting the rotating speed; absorbing the crystal wafer by using the crystal wafer vacuum sticky hook; and leading the crystal wafer to be in contact with the spherical concave surface, and chamfering the edge of the crystal wafer by rotating the spherical concave surface. The chamfering tool has the advantages of high working efficiency and low manufacturing cost and is easy to operate; the chamfering method has the advantages of simple process, ideal grinding effect, reliable chamfering quality and no broken edge.