Sapphire dome grinding method

A grinding and sapphire technology, applied in metal processing equipment, grinding/polishing equipment, grinding machines, etc., can solve the problems of broken, sapphire chipping, fracture, etc., and achieve the effect of high surface quality and smooth surface

Inactive Publication Date: 2018-11-16
DALIAN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, traditional grinding processing methods easily lead to processing defects such as edge chipping, chipping, and fracture of sapphire. Therefore, realizing high-quality and efficient processing of sapphire domes is a major demand of the country, and it is also a research hotspot and difficulty in the field of international advanced manufacturing.

Method used

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Embodiment

[0023] The Φ140×65mm single crystal sapphire is clamped on the CNC machine tool with a three-jaw chuck. First, the end face of the workpiece is ground with a cylindrical diamond grinding head to remove the uneven surface. Then grind the outer circle of the workpiece, and the grinding thickness is 0.3mm. Replace the diamond spherical grinding head to grind the inner spherical surface of the sapphire. The spherical grinding head with a particle size of #100 and #200 is used successively to perform rough grinding and semi-finish grinding on the inner spherical surface of the workpiece. The diameter of the grinding head is 28mm, the bonding agent is bronze, and it is made by electroplating. The grinding speed is 2000rpm, and the workpiece rotation speed is 60-70rpm. The feed rate during coarse grinding is 4mm / min, and the cutting amount is 0.5mm. During semi-fine grinding, the feed rate is 2mm / min, and the cutting amount is 10μm. Circular feeding, continuous expansion of the gr...

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PUM

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Abstract

The invention discloses a sapphire dome grinding method. A combination of metal bond diamond grinding heads of different particle sizes and shapes are adopted for machining. The method includes adopting a cylindrical diamond grinding head to grind the end face and the outer circle of a sapphire, and adopting diamond spherical grinding heads of different particle sizes to grind the inner sphericalsurface; adopting a turning method to machine a tool with one end as the hemispherical surface concentric with the grinding inner spherical surface and the other end as an optical axis; milling 6-8 grooves in the hemispherical surface by milling; bonding the workpiece to the tool coaxially by high-strength glue, and injecting the high-strength glue from the grooves; adopting cup-shaped diamond grinding heads of different particle sizes when grinding the outer spherical surface with the coarse grinding particle size of #100-#180 and the fine grinding particle size of #240-#320. According to thesapphire dome grinding method, a ground sapphire dome is smooth in surface without chipping, crushing and fracture processing defects, and the surface roughness Ra is less than 1 Mum.

Description

technical field [0001] The invention provides a grinding method for a sapphire ball cover, which belongs to the technical field of grinding of hard and brittle materials. Background technique [0002] Sapphire has excellent optical, mechanical, thermal, electrical and other properties, so it is widely used in semiconductors, aerospace, military and other fields. For example, gallium nitride-based LED substrates, shipboard, airborne, satellite infrared window materials, sapphire lasers, sapphire fairings, etc. Sapphire has unique properties such as wide-band high optical transmittance, high strength, thermal shock resistance and corrosion resistance, so it becomes the most ideal material for infrared dome. Sapphire (α-Al 2 o 3 ) Mohs hardness is 9, second only to diamond (Mohs hardness is 10), with high hardness and high brittleness, it is a typical difficult-to-machine material. Due to the difficulty in processing sapphire and the high processing cost, its wide applicati...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B1/00B24B27/00
Inventor 张振宇王绍臣王新泽许超刘冬冬
Owner DALIAN UNIV OF TECH
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