1261 results about "Diamond grinding" patented technology

The invention discloses a method for preparing an ultra-fine diamond grinding wheel of a vitrified bond, belongs to the technical field of ultra-precision machining of hard brittle and soft brittle photoelectric crystals, and in particular relates to the method for preparing an ultra-fine diamond grinding wheel of photoelectric semiconductor hard brittle and soft brittle photoelectric crystals. The method is characterized by comprising the following steps of: taking ultra-fine diamond powder which has a particle size of a fixed valve from #10,000 to #300,000 as an ultra-fine diamond grinding material; taking three or four ultra-fine non-oxide ceramics as bonding agents, taking one or two of chlorides or nitrates of potassium, calcium, sodium and magnesium as a dispersant and a refiner; taking one or two of dextrine, carbonates and hydrocarbonates as a foaming agent; pressing and molding by a cold-press molding method; uniformly heating to the temperature of between 480 and 530 DEG C from a room temperature; keeping the temperature for 30 to 60 minutes; uniformly heating to the temperature of between 580 and 610 DEG C; keeping the temperature for 40 to 60 minutes; uniformly heating to the temperature of between 640 and 680 DEG C; keeping the temperature for 100 to 150 minutes; and naturally cooling to the room temperature so as to sinter and mold the ultra-fine diamond grinding wheel. The method has the effects and the advantages of high-efficiency ultra-smooth low-damage grinding and high-efficiency ultra-precision grinding machining effect.

The invention discloses a diamond grinding tool of a ceramic-metallic bond and a preparation method of the grinding tool. The preparation method comprises the following steps of: firstly, preparing the ceramic-metallic bond by ball milling the following components in percentage by weight: 40 to 50 percent of silicon dioxide (SiO2), 8 to 15 percent of aluminium oxide (Al2O3), 12 to 20 percent of diboron trioxide (B2O3), 3 to 6 percent of lithium oxide (Li2O), 6 to 12 percent of sodium oxide (Na2O), 3 to 6 percent of potassium oxide (K2O), 2 to 8 percent of zinc oxide (ZnO), 1 to 10 percent of titanium (Ti) and 1 to 5 percent of aluminium (Al); secondly, mixing the ceramic-metallic bond with a diamond abrasive to obtain a mixed material, and then adding 3 to 5 mass percent of wetting agent into the mixed material to obtain a raw material of the grinding tool; and finally, carrying out hot-forming and cooling de-moulding on the raw material of the grinding tool respectively to obtain the diamond grinding tool of the ceramic-metallic bond. The diamond grinding tool of the ceramic-metallic bond provided by the invention has the advantages of the diamond grinding tool of a metallic bond and the grinding tool of a ceramic bond.