Special ceramic bond diamond grinding wheel for grinding diamond

A ceramic bond and diamond grinding wheel technology, applied in the field of diamond grinding wheels, can solve the problems of high temperature resistance of resin bond, falling off of abrasive grains, loss of diamonds, etc., and achieve good thermal conductivity and heat resistance, high strength and grinding speed. , the effect of improving comprehensive benefits

Inactive Publication Date: 2011-11-02
SUZHOU SAILI PRECISION TOOLS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Diamond is the hardest substance in the world. Grinding diamond requires strong grinding, which cannot be done by ordinary corundum and silicon carbide abrasives
The most traditional method is to fix two natural diamonds and rotate them in opposite directions, this method is not efficient and wastes diamonds
[0003] Along with the p

Method used

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  • Special ceramic bond diamond grinding wheel for grinding diamond
  • Special ceramic bond diamond grinding wheel for grinding diamond
  • Special ceramic bond diamond grinding wheel for grinding diamond

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0050] Embodiment one: see figure 1 As shown, the method for preparing vitrified bonded diamond grinding wheel includes: preparing the grinding wheel substrate, preparing the grinding layer, bonding the grinding layer to the grinding wheel substrate, and then processing it to the shape and size required by the drawing, and passing the inspection according to the national standard of diamond grinding wheel After storage.

[0051] (1) Prepare the grinding wheel base: use Norton (Norton) high-strength ceramic white corundum grinding wheel as the grinding wheel base, and then obtain a qualified grinding wheel base after rough machining, finishing, tolerance verification, and testing dynamic balance; the tensile strength of the grinding wheel base The strength is 45MPa-70MPa, and the expansion coefficient is 8.3×10 -6 ~9.0×10 -6 .

[0052] Prepare the grinding layer:

[0053] (a) Preparation of vitrified bond: mix the raw materials according to the following proportions to obta...

Embodiment 2

[0067] Embodiment two: see figure 1 As shown, the method for preparing a vitrified bonded diamond grinding wheel includes: preparing a grinding wheel base, preparing a grinding layer, bonding the grinding layer to the grinding wheel base, and then processing it to the shape and size required by the drawing, and putting it into storage after passing the inspection.

[0068] (1) Preparation of grinding wheel substrate: adopt white dove white corundum grinding wheel as the grinding wheel substrate, and then obtain a qualified grinding wheel substrate after rough machining, finishing, tolerance verification, and test dynamic balance; the tensile strength of the grinding wheel substrate is 40MPa- 80MPa, the expansion coefficient is 7.9×10 -6 ~9.8×10 -6 .

[0069] Prepare the grinding layer:

[0070] (a) Preparation of vitrified bond: mix the raw materials according to the following proportions to obtain the mixture:

[0071] Silica 41%;

[0072] Borax 16%;

[0073] Lithium hy...

Embodiment 3

[0084] Embodiment 3: A method for preparing a vitrified bond diamond grinding wheel, comprising: preparing a grinding wheel substrate, preparing a grinding layer, bonding the grinding layer to the grinding wheel substrate, and then processing to the shape and size required by the drawing, after passing the inspection storage.

[0085] (1) Preparation of grinding wheel substrate: adopt white dove white corundum grinding wheel as the grinding wheel substrate, and then obtain a qualified grinding wheel substrate after rough machining, finishing, tolerance verification, and test dynamic balance; the tensile strength of the grinding wheel substrate is 40MPa- 80MPa, the expansion coefficient is 7.9×10 -6 ~9.8×10 -6 .

[0086] Prepare the grinding layer:

[0087] (a) Preparation of vitrified bond: mix the raw materials according to the following proportions to obtain the mixture:

[0088] Silica 41%;

[0089] Borax 16%;

[0090] Lithium hydroxide 23%;

[0091] Zinc oxide 12%; ...

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Abstract

The invention belongs to the field of diamond grinding wheels, and particularly relates to a ceramic bond and a method for manufacturing a ceramic bond diamond grinding wheel for grinding a diamond by adopting the ceramic bond. The ceramic bond is prepared from the following raw materials in percentage by weight: silicon dioxide, borax, lithium hydroxide, zinc oxide, calcium oxide and aluminum oxide; and the ceramic bond is obtained through the steps of: mixing the raw materials, then smelting at the high temperature of 1300+/-5 DEG C, cooling, then performing ball milling to prepare ceramic powder, and sieving through a standard sieve of 180 meshes. The ceramic bond provided by the invention has high intensity and a low coefficient of expansion, so that the ceramic bond can be perfectly matched with the adopted ceramic grinding wheel basal body. The diamond grinding wheel manufactured by adopting the ceramic bond has good heat conductivity and heat resistance; and compared with the traditional resin bond diamond grinding wheel, the ceramic bond diamond grinding wheel not only ensures that the diamond is excellently sintered at the temperature of not being carbonized, but also ensures that grinding grains are always at an excellent holding state without falling off when grinding is carried out. The special ceramic bond diamond grinding wheel has the grinding efficiency and service life far higher/longer than that of the traditional grinding wheel, and has a comprehensive benefit which is increased by over 50%.

Description

technical field [0001] The invention belongs to the field of diamond grinding wheels, and in particular relates to a vitrified bond and a method for preparing a vitrified bond diamond grinding wheel for grinding diamonds by using the vitrified bond. Background technique [0002] Diamond is the hardest substance in the world. Grinding diamond requires strong grinding, which cannot be done by ordinary corundum and silicon carbide abrasives. The most traditional method is to fix two natural diamonds and rotate them in opposite directions. This method is not efficient and wastes diamonds. [0003] Along with the production of industrial diamonds, the diamond processing industry has introduced resin bonded diamond grinding wheels and metal bonded diamond grinding wheels into natural diamond processing. Grind well. The metal bond cannot achieve the desired grinding efficiency because the abrasive grains are too wrapped and difficult to trim. [0004] The vitrified bond diamond ...

Claims

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Application Information

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IPC IPC(8): B24D3/14B24D18/00
Inventor 韩云冉隆光王凯平王照
Owner SUZHOU SAILI PRECISION TOOLS
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