5 results about "Natural diamonds" patented technology

The invention discloses a mixed drill bit for well drilling in a hard formation with strong abrasiveness, which is used for prolonging the service life of the drill bit and improving the well drilling efficiency. The drill bit comprises a drill bit body and a plurality of blades. The plurality of blades are arranged on the crown part of the drill bit main body, a chip groove is formed between every two adjacent blades, and a fan-shaped water channel is arranged on each chip groove; cutting areas are arranged on the blades, natural diamonds are arranged on the faces, right facing the rock stratum, of the cutting areas, and the natural diamonds are embedded in the blades in a preset tooth arrangement mode; an internally-embedded granulation diamond is impregnated in the part, below the natural diamond, of the interior of the cutter wing; the central area of the crown part is provided with a cone inner cone structure which is concave inwards, an inner water channel is arranged on the cone inner cone structure, and a triangular polycrystalline Balas is embedded on the conical surface of the cone inner cone structure.

The utility model discloses an annular PCD groove milling cutter for machining oxygen-free copper, and belongs to the field of machining. The annular PCD groove milling cutter comprises a cutter handle, a pipe body is fixed to the bottom of the cutter handle, a cutting notch is formed in the bottom of the pipe body, a PCD groove milling cutter body is fixedly installed on the inner wall of the cutting notch, and a through groove is formed in the inner wall of the cutter handle and the inner wall of the pipe body in a communicating mode; the PCD groove milling cutter body has extremely high hardness and abrasion resistance which is only second to natural diamond, cutting abrasion of oxygen-free copper materials can be effectively resisted, the service life of the PCD groove milling cutter body is remarkably prolonged, meanwhile, the PCD groove milling cutter body is good in heat conductivity, cutting heat can be quickly conducted out in the cutting process, the temperature of a cutting area is reduced, and the service life of the PCD groove milling cutter body is prolonged. And thermal deformation of the oxygen-free copper material is reduced, so that the machining precision and the surface quality are guaranteed, and frequent replacement is not needed.

This invention relates to a p-type doped CVD diamond Schottky radiation detector and its fabrication method. The detector comprises a metal electrode layer, an intrinsic diamond layer, a p-type doped diamond layer, and an HPHT diamond substrate. These layers are stacked in a layered structure from top to bottom. The metal electrode layer serves as the top electrode, forming a Schottky contact with the intrinsic diamond layer. The intrinsic diamond layer, serving as the core functional region for radiation detection, is grown using a homoepitaxial CVD process. The p-type doped diamond layer, serving as the back contact layer, is grown on the surface of the HPHT diamond substrate using an epitaxial CVD process. The fabrication method disclosed in this invention uses a commercially available HPHT diamond substrate instead of natural diamond, combined with mature CVD epitaxial technology, offering advantages such as high product consistency, stable performance, controllable cost, and no need for an external power supply, making it suitable for mass production.

The synthesis of sub-five-nanometer nanodiamonds with high uniformity and purity. Inspired by the formation of natural diamond, iron carbide nanoparticles embedded in iron oxide matrices as the carbon source were used. High-pressure-high-temperature treatment of the precursor yields nanodiamonds with tunable diameters down to 2.13 nm and 0.22-nm standard deviation. The disclosed synthesis procedures also include a method for forming fluorescent nanodiamonds.

The invention provides a diamond loop wire for wafer cutting and a preparation method of the diamond loop wire. The diamond loop wire for wafer dicing includes a linear base material and a plurality of dicing portions. The linear base material is formed by twisting a plurality of alloy wires. The multiple cutting parts are arranged on the outer surface of the linear base material at intervals in the axial direction of the linear base material, and each cutting part comprises abrasive materials at least containing natural diamonds and artificial diamonds. The preparation method comprises the following steps: S1, coaxially twisting a plurality of alloy wires into a linear base material; s2, the linear base material is subjected to nickel pre-plating treatment, and a nickel pre-plating layer is formed in at least part of the area of the surface of the linear base material; and S3, an abrasive material at least containing artificial diamond and natural diamond is provided, and the abrasive material is fixed to the peripheral face of the linear base material through a composite electroplating technology. The diamond loop wire for wafer cutting provided by the invention has the advantages of wear resistance, high cutting efficiency and high cutting precision.