Diamond grinding material sequential distributing system and process

A diamond and abrasive technology, which is applied in the field of diamond abrasive orderly arrangement system and arrangement technology, can solve the problems of short research time, high cutting resistance, and inability to ensure uniform distribution of diamond abrasive, achieving high efficiency and high degree of automation Effect

Inactive Publication Date: 2010-08-11
HANGZHOU BODA DIAMOND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The process has the following problems: (1) Mechanical mixing cannot ensure that the diamond abrasive is evenly distributed in the metal bond, resulting in a high concentration of diamond abrasive in some areas, too low in some areas, and no diamond abrasive in some areas; Uneven distribution, the cutting efficiency of the saw blade decreases, the cutting resistance is high in areas with high diamond abrasive concentration, the chips are easy to...

Method used

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  • Diamond grinding material sequential distributing system and process
  • Diamond grinding material sequential distributing system and process

Examples

Experimental program
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Effect test

Embodiment 1

[0028] A new diamond abrasive orderly arrangement system, the system includes a vacuum pumping pipe (1), a vacuum chamber cylinder liner (2), and the lower end surface of the cylinder liner is fixed by screws (5) and pressure plates (6) to fix the orderly arrangement holes of abrasive materials plate (4), 1900 holes (10) are arranged in an orderly manner in the arrangement plate, which can absorb and fix diamond abrasives (7), and a vibrator (3) is fixed above the arrangement plate for vibration and blanking, and the magnetic workbench ( 9) A plurality of cold-pressed thin blanks (8) coated with glue on the surface can be adsorbed and fixed. Wherein, the diameter of the hole (10) on the abrasive arrangement plate (4) is 1 / 3 of the diameter of the diamond abrasive (7).

[0029] The orderly arrangement process of diamond abrasives includes the following steps:

[0030] ①Cold-press the matrix metal powder into a thin billet with a thickness of 0.2mm;

[0031] ②Arrange a plurali...

Embodiment 2

[0037] A new diamond abrasive orderly arrangement system, the system includes a vacuum pumping pipe (1), a vacuum chamber cylinder liner (2), and the lower end surface of the cylinder liner is fixed by screws (5) and pressure plates (6) to fix the orderly arrangement holes of abrasive materials plate (4), 2,500 holes (10) are arranged in an orderly manner in the arrangement plate, which can absorb and fix diamond abrasives (7), and a vibrator (3) is fixed above the arrangement plate for vibration blanking, and the magnetic workbench ( 9) A plurality of cold-pressed thin blanks (8) coated with glue on the surface can be adsorbed and fixed. Wherein, the diameter of the hole (10) on the abrasive arrangement plate (4) is 1 / 3 of the diameter of the diamond abrasive (7).

[0038] The orderly arrangement process of diamond abrasives includes the following steps:

[0039] ①Cold-press the matrix metal powder into a thin billet with a thickness of 1.5mm;

[0040] ②Arrange a plurality ...

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PUM

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Abstract

The invention relates to the field of manufacture of diamond grinding material grinding tools, in particular to diamond grinding material sequential distributing system and process for producing a saw bit cutter head and a thin wall-drilling drill. The diamond grinding material sequential distributing system comprises a vacuum pumping pipe (1) and a vacuum chamber cylinder sleeve (2), wherein a grinding material distributing plate (4) is fixed to the lower end of the vacuum chamber cylinder sleeve (2); a plurality of holes (10) which can adsorb and fix a diamond grinding material (7) are sequentially distributed in the grinding material distributing plate (4); and a magnetic working platform (9) which can adsorb and fix a cold press thin blank (8) is arranged under the grinding material distributing plate (4). The invention provides the diamond grinding material distributing system with highest production efficiency at present and has high automation degree, and the key action of grinding material distribution is completely linked and finished by equipment; and the system has simple structure and low cost and is easy for popularization.

Description

technical field [0001] The invention relates to the field of manufacturing diamond abrasives, in particular to an orderly diamond abrasive arrangement system and arrangement process for producing saw blade heads and thin-walled drill bits. Background technique [0002] Non-metallic brittle materials such as granite, marble, concrete, and asphalt are typical examples of cutting with diamond saw blades or drilling with diamond thin-wall drills. The diamond saw blade has a cutting layer of diamond abrasive on the periphery of the saw blade substrate. A sawing bit usually consists of diamond particles and a metal matrix that holds the diamond. At present, the production process commonly used in diamond saw blades: add a certain concentration of diamond to metal binders (such as iron powder, copper powder, tin powder, nickel powder, cobalt powder, etc.), and use mechanical mixing to combine Diamonds are mixed with a metal bond, loaded into molds for billeting and sintering. Th...

Claims

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Application Information

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IPC IPC(8): B24D18/00B23P5/00
Inventor 胡建根
Owner HANGZHOU BODA DIAMOND
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