A method for manufacturing electroplating diamond wire saw
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- QINGDAO UNIV OF SCI & TECH
- Publication Date
- 2009-09-16
- Estimated Expiration
- Not applicable · inactive patent
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Abstract
Description
technical field
[0001] The invention relates to a manufacturing method of an electroplated diamond wire saw. Specifically, it relates to a technique for making electroplated diamond saw wire by sanding on a ring-shaped wool belt. Background technique
[0002] Due to the high hardness and brittleness of hard and brittle materials such as silicon crystals and ceramics, they are prone to breakage and damage during the cutting process, causing damage to the material and reducing the yield. Therefore, these materials are difficult to cut by common processing methods. Traditional semiconductor material cutting usually adopts diamond inner and outer circle cutting technology. With the development of the semiconductor industry, especially the gradual increase in the diameter of silicon crystal blocks, since the advent of integrated circuits, the diameter of silicon rods that can be made has grown from 2 inches and 4 inches to the current mainstream 12 inches. Due to the influence...