Cutting method for MEMS wafer

A cutting method, wafer technology, applied in the fields of technology for producing decorative surface effects, decorative arts, gaseous chemical plating, etc.
CN102897708AActive Publication Date: 2013-01-30MEMSIC SEMICON WUXI
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Patent Information

Authority / Receiving Office
CN Β· China
Patent Type
Applications(China)
Current Assignee / Owner
MEMSIC SEMICON WUXI
Publication Date
2013-01-30

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Abstract

The invention relates to a method for a MEMS wafer. The cutting method comprises the following steps of pasting a membrane on the front surface of the wafer to protect an MEMS structure; focusing a laser on the inner part of the wafer, irradiating to form a modified layer at a position from the front surface of the wafer to the inner part of the wafer; irradiating the laser to the back surface of the wafer at a position corresponding to that of the modified layer so as to form a mark groove on the back surface of the wafer; performing water jet cutting on the back surface of the wafer along the position of the mark groove but do not reach the bottom so as to form a water jet cutting groove from the back surface of the wafer to the inner part of the wafer, wherein one end far away from the back surface of the wafer of the water jet cutting groove is connected with the modified layer; and extending splits along the modified layer till to all the MEMS structures are separated completely from each other. The method for the MEMS wafer combines the advantages of laser irradiation and water jet cutting, and realizes the edge breakage-free and low-contamination cutting for the MEMS wafer.
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Description

technical field

[0001] The present invention relates to a cutting method of a semiconductor wafer, in particular to a cutting method of a MEMS (Micro-Electro-Mechanical Systems, Micro-Electro-Mechanical Systems) wafer. Background technique

[0002] At present, the cutting methods of MEMS wafers mainly include backside water jet half-cutting and splitting process, and laser process. As we all know, MEMS devices are extremely sensitive to particles, and the particles generated in the cutting process will affect the reliability of the device, and even cause device failure in severe cases. As far as the backside waterjet half-cutting and splitting process is concerned, although it can protect MEMS devices from being contaminated by cutting water containing silicon powder during the cutting process, the subsequent splitting process will produce uneven split profiles and uneven cracks. On the positive side, in severe cases, it will cause damage to the inside of the chip; at the s...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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