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Large-diameter crystal wafer chamfering tool and chamfering method thereof

A crystal wafer and large-diameter technology, applied in the field of large-diameter crystal wafer chamfering tooling and chamfering, can solve the problems of difficult quality control, unsatisfactory quality, uneven size of chamfering, etc., to solve the problem of chamfering and edge collapse problem, easy cost control, low manufacturing cost effect

Inactive Publication Date: 2011-02-16
北京石晶光电科技股份有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] High-quality ¢62 round polished crystal is a product used in the field of aviation testing. Its processing requirements are very high. At present, there has not been a good manufacturing process for its chamfering control. The main factors are its relatively large diameter and thickness. It is very thin, only 0.4 mm, so it is very difficult to process, difficult to control the quality, and the scrap rate is high. Because the diameter is too large, it is difficult to fix the center of the circle, so the size of the chamfer is very uneven, the problem of edge chipping is serious, and the quality cannot meet the requirements;

Method used

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  • Large-diameter crystal wafer chamfering tool and chamfering method thereof
  • Large-diameter crystal wafer chamfering tool and chamfering method thereof

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Embodiment Construction

[0015] The technical solutions of the present invention will be described in further detail below through specific implementation methods.

[0016] Such as figure 1 As shown, a large-diameter crystal wafer chamfering tool, which includes a four-axis grinder 6, a bowl-shaped chamfering tool and a crystal wafer vacuum sticky hook 2;

[0017] Wherein, the bowl-shaped chamfering tool includes a bowl 1 with a spherical concave surface 4 and a connecting body 5 arranged at the bottom of the bowl 1. A layer of abrasive sand is provided on the spherical concave surface 4 of the bowl 1. The bowl-shaped The connecting body 5 of the chamfering tool is installed on the transmission shaft of the four-axis grinder 6 , and the center of the crystal wafer vacuum hook 2 is set corresponding to the center of the spherical concave surface 4 .

[0018] Based on the above, the top of the crystal wafer vacuum hook 2 is provided with a handle.

[0019] A chamfering method of a large-diameter cryst...

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Abstract

The invention provides a large-diameter crystal wafer chamfering tool and a chamfering method thereof. The chamfering tool comprises a four-shaft grinding machine, a bowl-shaped chamfering tool and a crystal wafer vacuum sticky hook, wherein the bowl-shaped chamfering tool comprises a bowel body with a spherical concave surface and a connector installed at the lower part of the bowl body, a grinding sand layer is arranged on the spherical concave surface of the bowel body, and the connector of the bowl-shaped chamfering tool is installed on a transmission shaft of the four-shaft grinding machine; the center of the crystal wafer vacuum sticky hook is corresponding to the center of the spherical concave surface. The chamfering method comprises the following steps of: starting the four-shaft grinding machine, and adjusting the rotating speed; absorbing the crystal wafer by using the crystal wafer vacuum sticky hook; and leading the crystal wafer to be in contact with the spherical concave surface, and chamfering the edge of the crystal wafer by rotating the spherical concave surface. The chamfering tool has the advantages of high working efficiency and low manufacturing cost and is easy to operate; the chamfering method has the advantages of simple process, ideal grinding effect, reliable chamfering quality and no broken edge.

Description

technical field [0001] The invention relates to a wafer chamfering equipment used in the crystal processing industry, in particular to a large-diameter crystal wafer chamfering tool and a chamfering method thereof. Background technique [0002] The existing wafer chamfering machine is a kind of chamfering equipment widely used in glass, crystal processing and other industries. The traditional operation is to chamfer the crystal wafer on the wafer chamfering machine, but only for diameter ≤¢20 The chamfering effect of the wafer is better. If it is a large-diameter crystal wafer, the diameter is 62 mm and the thickness is only 0.4 mm, the chamfering effect is very poor; [0003] High-quality ¢62 round polished crystal is a product used in the field of aviation testing. Its processing requirements are very high. At present, there has not been a good manufacturing process for its chamfering control. The main factors are its relatively large diameter and thickness. It is very th...

Claims

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Application Information

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IPC IPC(8): B24B37/00B24B9/06
Inventor 宋红杰许建峰
Owner 北京石晶光电科技股份有限公司
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