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Processing method of aluminum-silicon shell

A processing method and shell technology, applied in the direction of metal processing equipment, workpieces, manufacturing tools, etc., can solve the problems that restrict the promotion and application of the packaging shell field, prone to chipping, high brittleness, etc., and achieve the improvement of the subsequent coating layer Quality, avoiding edge collapse, and improving quality

Active Publication Date: 2015-09-23
NO 43 INST OF CHINA ELECTRONICS TECH GRP CETC
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  • Application Information

AI Technical Summary

Problems solved by technology

The silicon content of aluminum-silicon composite materials is generally between 22% and 50%, and it is brittle. If it is processed by traditional machining technology, it is prone to defects such as edge chipping, cracks, and corner dropouts, which restricts its large-scale application in the field of packaging shells. Area Promotion and Application

Method used

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  • Processing method of aluminum-silicon shell
  • Processing method of aluminum-silicon shell
  • Processing method of aluminum-silicon shell

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Embodiment Construction

[0019] A preferred embodiment of the present invention will be described in detail below with reference to the accompanying drawings.

[0020] like figure 1 As shown, the aluminum-silicon housing has an inner cavity 5 with an upward opening for placing electronic components, a first boss 1 is provided on the left side of the housing, and a second boss 2 is provided on the right side of the housing. A rectangular stepped hole 3 for communicating with the inner cavity is opened on the first boss, and a plurality of circular stepped holes 4 are successively opened on the second boss along its length direction.

[0021] The concrete steps of aluminum-silicon shell processing method of the present invention comprise as follows:

[0022] Step 1: Use a φ6 or φ8 alloy coated end mill, set the speed within the range of 3500-4500 RPM, set the feed within the range of 450-550 mm / min, and mill the shell shape, the shape includes The top surface, the bottom surface and the surrounding ar...

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Abstract

The invention provides a processing method of an aluminum-silicon shell. The method includes the steps of (1) milling surfaces; (2) milling a rectangular stepped hole; (3) milling circular stepped holes; (4) milling an inner chamber. According to the method, the use of alloy-coating end mills which are of high hardness and good abrasive resistance allows blades to keep sharp for a long time and effectively avoids defects such as edge breakage and cracks during machining process of aluminum-silicon composites; dry cutting is utilized, pollution to the shell by cutting fluid and coolant is removed, and the quality of the back-end coating of the shell is improved; the use of the method for processing the aluminum-silicon shell has the advantages of high efficiency, good operability and good quality consistency of processed products.

Description

technical field [0001] The invention relates to the field of packaging of electronic components, in particular to a processing method for an aluminum-silicon shell. Background technique [0002] Electronic devices, especially high-end devices, are developing in the direction of miniaturization, light weight, high power density, multi-function and high reliability. The requirements are also getting higher and higher. As a new type of composite material, aluminum-silicon has the following advantages: 1) The thermal expansion coefficient is adjustable within the range of 6-17, which can meet the matching requirements of the thermal expansion coefficient of ceramic substrates and chips inside the shell; 2) The density is 2.3 -2.7g / cm 3 Between, light weight; 3) thermal conductivity ≥ 120w / m·K, fast heat dissipation, is an ideal packaging shell matrix material, widely favored by the packaging shell industry. The silicon content of aluminum-silicon composite materials is ...

Claims

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Application Information

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IPC IPC(8): B23C3/00B23C5/16
CPCB23C3/00B23C5/16B23C2220/28B23C2220/605B23C2222/04
Inventor 赵飞黄志刚朱小军
Owner NO 43 INST OF CHINA ELECTRONICS TECH GRP CETC
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