Manufacturing process of whole gold-plated panel
A technology of manufacturing process and gold-plated area, which is applied in the field of manufacturing process of full-plate gold-plated plate, and can solve problems such as gold-plated penetration, poor quality of gold-plated, and collapse of gold-plated area
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Example Embodiment
[0032] In order to describe in detail the technical content, structural features, achieved objectives and effects of the present invention, the following is a detailed description in conjunction with the embodiments and accompanying drawings.
[0033] See Figure 1 ~ Figure 7 , The manufacturing process of the full-board gold-plated plate of the present invention includes the following steps:
[0034] a. Make all on-board graphics with gold-plated area 10 and non-gold-plated area 11 on the circuit board at one time;
[0035] b. A metal conductive layer with a thickness of 0.3um~0.8um is deposited on the whole board circuit board with all the patterns in the board; at this time, the gold-plated area becomes the metal conductive layer 13 covered with the metal conductive layer, The non-gold-plated area 11 becomes a metal conductive layer 12 covered with a metal conductive layer;
[0036] c. Paste a protective dry film on the non-gold-plated area coated with the metal conductive layer t...
PUM
Property | Measurement | Unit |
---|---|---|
Thickness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap