The invention discloses a high-reliability fast curing underfill
adhesive, which is characterized by comprising the following raw materials by weight portion: 45 to 75 portions of resin, 20 to 25 portions of specially processed
silicon powder, 0.5 portion of colorant, 20 to 25 portions of curing agent, 1 to 6 portions of curing
accelerant, 0.1 to 3 portions of coupler, 10 to 15 portions of
cycloaliphatic epoxy resin and 15 to 25 portions of
epoxy active diluents. The preparation method of the high-reliability fast curing underfill
adhesive comprises the following process steps: a, pretreatment, in which the resin is roasted for one night at 70 to 75 DEG C; and b, mixing, in which the resin, the
cycloaliphatic epoxy resin and the
coolant are first uniformly mixed and then added with by three times the specially processed
silicon powder followed by the curing agent and the curing
accelerant, the uniformly
mixed materials are added into a reaction kettle, the reaction kettle is completely vacuumized for 15 minutes, the coupler and the
epoxy active diluents are added after the resin and the curing agent are mixed uniformly, the reaction kettle is completely vacuumized for 30 minutes, and the product is obtained. The product has the advantages of low curing temperature, high curing speed, high flowing speed, excellent storage stability, simple, easy and environmentally-friendly preparation process, low cost and wide application range.