High-reliability fast curing underfill adhesive and preparation method thereof

An underfill and rapid curing technology, which is applied in chemical instruments and methods, adhesives, epoxy resin glue, etc., can solve the problems of large underfill curing shrinkage, high CTE, and low CTE, and achieve high reliability. And temperature resistance, fast flow speed, low cost effect

Inactive Publication Date: 2009-11-18
YANTAI DARBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The present invention mainly solves the problems of the existing underfill adhesive such as high curing shrinkage rate, high CTE, too low Tg, and affecting its quality when applied to electronic products. Glue with low rate and low CTE

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] Example 1, weigh 13.2g of epoxy resin 828EL, 39.2g of epoxy resin 830S, 10g of 2021P alicyclic epoxy resin, 0.5g of carbon black T4, 25g of curing agent Ajinomoto PN23, and 25g of curing accelerator PN -H (Ajinomoto) 5g, coupling agent KH560 0.56g, epoxy diluent AGE (shellH8) 20g, special treatment silicon micropowder FEB450D (Japan Toyota Tsusho) 20g; Bake overnight at ℃, then mix the colorant with resin and cycloaliphatic epoxy resin evenly, time 30min, temperature 25℃, then add special treated silicon micropowder, add in three times, mix evenly with a three-roller machine, then add curing agent , Curing accelerator, temperature 25°C, mixed under cooling and drying conditions, cold water controlled at 15°C, mixed three times, after mixing evenly, add to the reaction kettle under full vacuum for 15min, when the resin and curing agent are evenly mixed, add coupling agent, Epoxy diluents were mixed and vacuumed for 30 minutes to obtain the product. It was measured that t...

Embodiment 2

[0025] Embodiment 2, take by weighing phenolic modified epoxy resin 45g, 15 grams of 2021P cycloaliphatic epoxy resin, pigment carbon black T4 0.5g, curing agent 1020 20g, curing accelerator PN-H (Ajinomoto) 1g, Coupling agent KH550 0.1g, epoxy diluent AGE (shellH8) 15g, special treatment silicon micropowder FEB450D (Japan Toyota Tsusho) 22g; first bake the phenolic modified epoxy resin at 70-75°C for one night, and then Mix the colorant with resin and cycloaliphatic epoxy resin evenly, time 20min, temperature 30°C, then add special treated silica powder, add in three times, mix evenly with a three-roller machine, then add curing agent and curing accelerator, temperature 20°C , mixed under cooling and drying conditions, cold water controlled at 15°C, mixed three times, mixed evenly, added to the reactor and filled with vacuum for 15 minutes, when the resin and curing agent were mixed evenly, added coupling agent, epoxy diluent and mixed, filled with vacuum 30min, get the produ...

Embodiment 3

[0026]Example 3, take and weigh 30g of epoxy resin 828EL, 45g of epoxy resin 830S, 15 grams of 2021P alicyclic epoxy resin, 0.5g of carbon black T4, curing agent Ajinomoto PN23 and 2,4 dimethyl Gimidazole 25g, curing accelerator PN-H (Ajinomoto) 6g, coupling agent KH550 and KH570 3g, epoxy thinner AGE (shellH8) 25g, special treatment silicon micropowder FEB450D (Japan Toyota Tsusho) 25 grams; The solid epoxy resin is baked at 70-75°C for one night, and then the coloring material is mixed with epoxy resin and alicyclic epoxy resin evenly for 40 minutes at a temperature of 20°C, and then special treated silica powder is added in three times. Mix evenly with a three-roller machine, then add curing agent and curing accelerator at a temperature of 30°C, mix under cooling and drying conditions, control the cold water at 15°C, mix three times, mix evenly and add to the reaction kettle under full vacuum for 15 minutes, when the resin and After the curing agent is mixed evenly, add a c...

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PUM

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Abstract

The invention discloses a high-reliability fast curing underfill adhesive, which is characterized by comprising the following raw materials by weight portion: 45 to 75 portions of resin, 20 to 25 portions of specially processed silicon powder, 0.5 portion of colorant, 20 to 25 portions of curing agent, 1 to 6 portions of curing accelerant, 0.1 to 3 portions of coupler, 10 to 15 portions of cycloaliphatic epoxy resin and 15 to 25 portions of epoxy active diluents. The preparation method of the high-reliability fast curing underfill adhesive comprises the following process steps: a, pretreatment, in which the resin is roasted for one night at 70 to 75 DEG C; and b, mixing, in which the resin, the cycloaliphatic epoxy resin and the coolant are first uniformly mixed and then added with by three times the specially processed silicon powder followed by the curing agent and the curing accelerant, the uniformly mixed materials are added into a reaction kettle, the reaction kettle is completely vacuumized for 15 minutes, the coupler and the epoxy active diluents are added after the resin and the curing agent are mixed uniformly, the reaction kettle is completely vacuumized for 30 minutes, and the product is obtained. The product has the advantages of low curing temperature, high curing speed, high flowing speed, excellent storage stability, simple, easy and environmentally-friendly preparation process, low cost and wide application range.

Description

Technical field: [0001] The invention relates to a bottom filling glue and a preparation method thereof, in particular to a preparation method of a high-reliability, fast-curing bottom filling glue, which has good storage stability and fast flow speed. Background technique: [0002] CSP is Chip Scale Package, which further reduces the package size on the basis of BGA. CSP can provide the performance and small advantages of bare chip and flip chip, and can be designed as a package that is 1.2 to 1.5 times larger than the die area or circumference of the chip. And provide solder balls and pins that are metallurgically compatible with circuit printed board pads for reflow soldering assembly processes. [0003] Compared with QFP and BGA, CSP provides shorter interconnection, improves electrical performance and thermal performance, and improves reliability. Since 1997, it has entered the primary stage of practical application, and will gradually become a high I / O terminal count ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/02C09J163/04C09J11/06C09J11/04C09J9/00C09K3/10
Inventor 周建忠王建斌解海华
Owner YANTAI DARBOND TECH
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