This invention belongs to the field of
semiconductor technology, and particularly relates to a fine
sintering process for OP rings used in
semiconductor epitaxy, comprising the following steps: S1: Front-end pretreatment section, which sequentially includes OP material receiving, unloading,
water jet cutting,
surface grinding, MC fine
machining, dewaxing and cleaning, boiling and cleaning, and front-end process inspection; S2: Fire
processing core section, which sequentially includes fire
processing cleaning, fine
sintering, annealing, and final inspection. The fire
processing cleaning process first uses a neutral strong
degreasing agent for cleaning, and then uses a mixture of
nitric acid and
hydrofluoric acid for cleaning. The fine
sintering process uses a fine sintering
machine to generate a
flame through the
combustion of high-purity
hydrogen and
oxygen to perform a one-time continuous
flame polishing and fine sintering of the OP ring; S3: Post-processing purification and packaging section, where the OP rings completed in S2 are cleaned and packaged. The product surface of this invention is free of impurities, improving the uniformity of fine sintering, enhancing the smoothness, flatness,
surface roughness and uniformity of the product surface, and increasing the yield.