1931results about "Automatic grinding control" patented technology

The invention discloses a metal grinding machine tool grinding wheel wear compensation type intelligent control system, and relates to the technical field of mechanical manufacturing automation, and the system comprises a contact type reference detection module which is used for obtaining the initial contour and reference wear loss of a grinding wheel through discrete point measurement in a non-machining state; the multi-parameter non-contact real-time detection module is used for collecting acoustic emission, vibration and spindle current signals in the grinding process through three types of sensors; the grinding environment sensing module collects the temperature of a grinding area and the cutting fluid concentration; the intelligent control unit receives reference data and an environment signal, performs deep learning on a wear loss prediction model after multi-source data fusion, performs periodic reference calibration, analyzes the dynamic wear loss, and synchronously transmits the data to the data storage and tracing module; the executing mechanism adjusts grinding wheel feed amount compensation according to the dynamic abrasion loss; and the data storage and tracing module stores full-process data in real time. According to the system, high-precision and real-time wear compensation is achieved, the machining precision and consistency are improved, and high-end manufacturing requirements are met.

The invention relates to the technical field of optical manufacturing and processing control, in particular to an intelligent control system of lens processing equipment, which comprises a process relationship pre-storage module, a pressure distribution acquisition module, a surface shape error prediction module, a pressure compensation decision module, an actuator control module and a processing effect verification module. Wherein the process relation pre-storage module is used for establishing a pressure-removal rate relation mapping table; the pressure distribution acquisition module is used for acquiring pressure distribution data; the surface shape error prediction module is used for predicting surface shape error data generated by the lens; the pressure compensation decision module is used for generating a regionalized pressure compensation amount; and the actuator control module is used for dynamically adjusting the pressure applied to different areas of the lens by the polishing head. According to the method, by constructing the pressure-removal rate mapping and closed-loop self-calibration mechanism, intelligent pressure regulation and control and surface shape error dynamic correction in the lens polishing process are achieved, and the machining precision and stability are remarkably improved.

The invention particularly relates to a grinding force closed-loop control and flutter suppression system for crankshaft variable stiffness machining, and aims to solve the problems of unstable grinding force, flutter and surface defects caused by time-varying stiffness characteristics of a crankshaft due to a multi-crank throw and cantilever supporting structure. The system comprises a grinding force detection module, a control module and an execution module. The grinding force detection module is arranged in a grinding wheel and crankshaft contact area and collects grinding force signals in real time. The control module receives an actual grinding force signal, compares the actual grinding force signal with a target value, and outputs a compensation instruction and a suppression instruction; the compensation instruction is generated by adopting a self-adaptive PID or fuzzy PID algorithm based on force deviation, and the grinding wheel feeding speed or the main shaft rotating speed is dynamically adjusted to stabilize the grinding force; and extracting a high-frequency component of the force signal as a flutter feature, identifying a flutter bud through time-frequency analysis, and generating an anti-phase displacement instruction to suppress flutter. The execution module adjusts feeding or rotating speed according to the compensation instruction and adjusts radial displacement of the crankshaft or the grinding wheel according to the suppression instruction.

The invention belongs to the field of robot polishing and metal material processing and manufacturing, and discloses a steel plate surface defect detection and self-adaptive polishing system and method, and the system comprises a surface defect detection system, a three-dimensional contour detection system, a roller bed control system, a robot polishing system and a server; the surface defect detection system is used for acquiring types and position information of defects; the three-dimensional contour detection system is used for accurately measuring depth information of the defect; the roller bed control system is used for controlling the movement of the roller bed to transfer the steel plate; the server is used for data interaction and storage among the surface defect detection system, the three-dimensional contour detection system, the roller bed control system and the robot grinding system; and the robot polishing system accurately polishes the surface defects of the steel plate according to the defect position and depth data in the server. The full-process intelligent operation of steel plate surface defect detection, defect three-dimensional contour scanning and robot self-adaptive grinding is achieved, and the automation level and the production efficiency of a production line are effectively improved.

The invention provides a wafer thinning equipment control method and device, electronic equipment and a storage medium, and relates to the technical field of wafer thinning. The method comprises the following steps: monitoring spreading and thinning behaviors of a spin-coating liquid film in real time and generating a residual layer distribution diagram; according to an area indicated by the residual layer distribution map, obtaining local thickness information by analyzing a fluorescence signal received from the area; after a laser beam is used for scanning the surface of the wafer, micro-vibration signals are recognized and extracted by analyzing reflected light signals; dividing the surface of the wafer into a plurality of grid areas; and the risk of generating cracks in each grid area is evaluated, and a wafer surface risk thermodynamic diagram used for controlling the grinding head and the grinding fluid is generated. The method aims at solving a series of problems caused by a microcosmic residual layer on the surface of the wafer or surface energy difference in the wafer thinning process, early and accurate sensing of microcosmic abnormity on the surface of the wafer is achieved, and a control system is guided to conduct regional and self-adaptive grinding parameter adjustment.

The invention belongs to the technical field of metallurgical engineering, and relates to an intelligent guide grinding system and method for the surface of a casting blank. By arranging the parameter initialization module, the parameter compensation module and the deviation correction module, the problem of unstable grinding quality caused by grinding force fluctuation, temperature change and material difference in the casting blank surface grinding process is solved. The method specifically comprises the steps that the feeding speed is dynamically adjusted by collecting grinding force data in real time, thermal deformation compensation is conducted according to the casting blank temperature and the steel grade characteristics, the upper limit value is determined based on quantitative analysis of surface state parameters and historical standard samples, and adaptive adjustment of the next round of coping parameters is achieved. According to the method, the consistency of the grinding depth is effectively improved, the over-grinding risk in the high-temperature casting blank grinding process is prevented, closed-loop optimization and continuous improvement of the grinding process are achieved, the stability and reliability of the casting blank surface grinding quality are improved, and it is ensured that the product quality cannot be affected by surface defects in the subsequent rolling process of the casting blank.

The invention discloses a part polishing track generation method and device, electronic equipment and a storage medium. The method comprises the steps that contour features corresponding to a first contour presented by a to-be-polished part under a first visual angle are determined; matching in a template library based on the contour features, and determining a target part template; a plurality of candidate part templates are stored in the template library; different second contours exist between the candidate part templates, and at least part of the second contours in the candidate part templates are used for indicating the edge position information of the part needing to be polished; the second contour is a contour under the first visual angle; and based on the first polishing track associated with the target part template, a second polishing track corresponding to the to-be-polished part under the first visual angle is determined. According to the scheme, the proper part template can be matched based on the contour features of the to-be-polished part, so that the to-be-polished part can be quickly recognized, and the polishing track can be quickly determined.

The invention relates to the technical field of precision machining, discloses a double-shaft DFG grinding machine Z1-Z2 linkage removal amount control and grinding wheel loss optimization method and system, and aims to solve the problems of unreasonable Z1-Z2 removal amount distribution, inaccurate grinding wheel loss control and poor wafer surface damage adaptability of existing DFG grinding. According to the method and system, Z1 rough grinding parameters are determined and adjusted through multi-objective optimization and self-adaptive control by means of the initial morphology and material characteristics of a wafer; in combination with a Z1 result, a deep learning model is utilized to intelligently distribute Z2 accurate grinding removal amount and parameters, and adaptive adjustment and abnormal Air Cut are realized; and meanwhile, the grinding parameters are continuously optimized by adopting the grinding wheel loss prediction model. By adopting the technical scheme, the grinding efficiency and precision can be remarkably improved, the service life of the grinding wheel is prolonged, the cost is reduced, and the problems of removal amount distribution, grinding wheel loss and wafer damage are solved.

The utility model discloses a self-adaptive track sanding device for a complex curved surface. The device comprises a flange seat, a universal cross arranged at the front end of the flange seat, a motor body arranged in the universal cross, a brake ring and a polishing disc, wherein the brake ring and the polishing disc are arranged at the output end of the motor body; the universal cross is of a circular ring structure and is rotationally connected with the front end of the flange base through a first pin shaft, the upper portion of the motor body penetrates through the universal cross, and the motor body and the universal cross are rotationally connected through a second pin shaft. Connecting lines respectively formed by the first pin shaft and the second pin shaft are crossed, and the motor body realizes two-degree-of-freedom rotation through the first pin shaft and the second pin shaft. The motor body rotates through the universal cross to adjust the binding face between the grinding disc and the to-be-ground curved surface to achieve self-adaption to the to-be-ground curved surface, it can be guaranteed that the normal of the grinding disc coincides with the normal of the curved surface without precisely adjusting the posture and the positioning precision of a robot, and therefore the good grinding effect is obtained.

The invention relates to the technical field of material polishing, and discloses a PEEK material composite polishing method and system based on multi-process collaboration.The method comprises the steps that surface detection is conducted on a PEEK material, and crystallinity gradient distribution information is obtained; according to the crystallinity gradient distribution information, process parameter calculation is conducted on the crystalline area and the amorphous area, and a polishing process parameter combination is obtained; inputting the polishing process parameter combination into multi-process collaborative composite polishing equipment, and carrying out gradient interface strengthening polishing on the PEEK material to obtain an interface strengthening polishing semi-finished product; and dynamically adjusting the process parameters of the semi-finished interface strengthening and polishing product to obtain the finished interface strengthening and polishing product, so that accurate division of a crystallization area and an amorphous area of the PEEK material and differential process parameter calculation are realized, and the composite polishing precision of the PEEK material is improved.

The invention is suitable for the technical field of pipe outer circle grinding, and provides a PE pipe outer circle grinding device which comprises a workbench, a grinding mechanism used for grinding a pipe is arranged on the workbench, a supporting frame is horizontally and slidably connected with a moving seat, and the supporting frame is fixedly connected with a second motor. An output shaft of the second motor is in threaded connection with a moving seat, the moving seat is fixedly connected with an electric lifting seat, and the telescopic end of the electric lifting seat is fixedly connected with a guide sleeve; the pipe polishing machine further comprises a feeding speed optimization system which can regulate and control the extension speed of the electric lifting seat by comprehensively evaluating the polishing state of the abrasive belt, the clamping state of the clamping mechanism and the stable state of the pipe, and then the feeding speed during pipe polishing is optimized. The feeding speed self-adaptive adjustment under the interference of multiple factors such as abrasive belt abrasion, pipe temperature change and clamping force fluctuation is achieved.

The invention belongs to the technical field of precision machining and in-situ measurement, and discloses an in-situ measurement and bidirectional tool setting integrated system and method for an internal thread grinding machine. Various system errors and random errors are effectively eliminated through a non-hardware error compensation model and a high-fidelity data processing algorithm, in-situ measurement of the internal thread is completed in a modularized mode, and high-precision and high-efficiency in-situ automatic measurement of key parameters such as the pitch diameter, the thread pitch and the thread angle of the thread is achieved. The system can be directly integrated on the internal thread grinding machine, measurement is rapidly completed after machining or between procedures, workpieces do not need to be disassembled, secondary clamping errors are effectively avoided, and the detection efficiency and consistency are greatly improved.

The invention provides a model training method, a silicon wafer processing method, a silicon wafer processing device, a storage medium and equipment. The model training method comprises the following steps: acquiring initial state information and target state information of a silicon wafer to be processed; through an action decision model, according to the initial state information and the target state information, machining action information for the machining machine table is generated; determining an award parameter corresponding to the processing action information, wherein the award parameter represents the processing quality and efficiency when the processing machine processes the to-be-processed silicon wafer based on the processing action information; if the reward parameter is not more than the preset condition, updating the initial action decision model according to the reward parameter to obtain an updated action decision model; and based on the updated action decision model, returning to execute the step of generating the processing action information through the action decision model according to the initial state information and the target state information until the reward parameter is greater than the preset condition, and obtaining a target action decision model. According to the invention, the processing machine table can be accurately adjusted.

The invention discloses a numerical control machine tool autonomous tool setting method based on 3D visual guidance. The method comprises the following steps: firstly, acquiring three-dimensional point cloud data of a cutter and a workpiece by using a 3D visual sensor and preprocessing; then, segmenting the point clouds through a region growing algorithm, realizing the separation of the tool point clouds and the workpiece point clouds, and extracting the point clouds of each cylindrical section of the workpiece; thirdly, based on a cylinder fitting algorithm, cylinder model fitting is conducted on the segmented tool and workpiece point cloud, and geometric parameters such as the axis direction, the radius and the center coordinate are obtained; calculating a relative position relation between the tool and the workpiece according to the geometric parameters, generating a tool setting path and converting the tool setting path into an NC code; and finally, the NC code is transmitted to a grinding machine control system through a grinding machine communication module, and tool setting operation is completed. The automatic tool setting device has the advantages that the relative position relation between the workpiece and the tool can be automatically measured in the machining process, automatic and rapid tool setting is completed, and the machining quality and efficiency are guaranteed.

The invention discloses an integrated tile-shaped magnet outer circle grinding device and method based on artificial intelligence, and belongs to the technical field of grinding machining. The integrated tile-shaped magnet outer circle grinding device comprises a feeding device, a grinding device and a visual detection device; the feeding device comprises a feeding conveying belt, a guide groove, a spring bin, a material blocking barrel, a feeding barrel, a magnetic suction cup, an electromagnetic push rod, a cooperative mechanical arm, a reset spring and a discharging conveying belt. The visual detection device comprises a magnetic shoe counting camera, an annular light source, a counting camera bracket, a measuring camera bracket, a backlight plate, an outer contour measuring camera, a positioning camera and a positioning camera bracket; integrated automatic operation of feeding, grinding, detection and discharging is achieved, the production efficiency is greatly improved, automatic counting, precision detection and discharging are completed through cooperation of visual detection and the conveying belt, the manual operation intensity is effectively reduced, production interruption caused by personal errors is avoided, and the productivity in unit time is remarkably improved.

The invention belongs to the technical field of wafer processing, and particularly discloses an ultrasonic displacement vision cooperation wafer detection and edge grinding system. According to the invention, the control module coordinates the grinding mechanism, the wafer carrying table and the assembly integrated with displacement and visual detection, so that cooperative detection and edge grinding are realized. Specifically, the displacement detection module obtains the distance between the wafer and the grinding mechanism in real time, and an accurate physical reference is provided for compensation control; and the visual detection module captures continuous images during rotation of the wafer, so that the control module can extract micro texture features to identify the deviation state of the wafer. The combination of the two realizes the comprehensive real-time perception of the grinding working condition, and overcomes the limitation of insufficient perception. And finally, the control module fuses the displacement and offset information to generate an edge grinding instruction, and dynamically controls the grinding mechanism and the wafer carrying table to carry out linked rigid body transformation, so that real-time sensing information is directly converted into compensation action, and the problem of uneven grinding caused by insufficient dynamic compensation capability is effectively solved.

The invention belongs to the technical field of threaded pipe machining, and particularly relates to an intelligent control method, device and equipment for self-adaptive force control of a grinding device and a medium. Comprising the following steps that real-time data of a polishing device in the polishing process are collected; real-time data in the polishing process are analyzed, and control data of preset polishing force Fd are obtained; based on the control data of the preset polishing force, the polishing device is controlled in real time to reach the preset polishing force; by acquiring the polishing force data in real time and analyzing and acquiring the control data of the preset polishing force, the polishing quality of the pipeline is accurately controlled, so that the actual polishing force quickly and accurately approaches the preset polishing force, and the polishing effect on the threaded pipe is optimized.

The invention discloses a self-adaptive grinding control method and system for a rigid contact network, and belongs to the technical field of maintenance of rail transit power supply equipment. The method comprises the following steps: acquiring pantograph-catenary action historical data of each position of the contact network along a busbar direction, and constructing a contact line damage index distribution curve; identifying a high damage interval based on the damage index, extracting roughness, ripple amplitude and oxidation thickness parameters, constructing a damage intensity vector, and calculating a damage grade score of each position by adopting a fuzzy comprehensive evaluation method; a preset polishing strategy library is matched according to the scoring result, a corresponding polishing wheel combination, the rotating speed and the contact pressure are determined, and a control parameter set is generated; the grinding device dynamically adjusts the working state according to the control parameters in the advancing process. The method achieves full-process self-adaptive closed-loop control of state recognition, strategy decision, execution control and quality feedback of contact line grinding operation.

The invention discloses precise honing equipment for a planetary reducer sun gear, and particularly relates to the field of sun gear finish machining, the precise honing equipment comprises a honing shell and an operation table fixedly connected in the honing shell, an angle adjusting assembly is installed on the operation table, and the output end of the angle adjusting assembly is connected with a first motor; the angle adjusting assembly is used for driving the first motor to move in the preset direction, the output end of the first motor is fixedly connected with a telescopic rod, the first motor is used for driving the telescopic rod to rotate, the telescopic rod is fixedly connected with a honing wheel, and the two sides of the operation table are fixedly connected with a first positioning support and a second positioning support correspondingly. Uniform radial expansion clamping is carried out from the inner hole of the sun gear through a conical rod-expansion block mechanism, centering clamping with the inner hole of a workpiece as the standard is achieved, clamping deformation is greatly reduced, the original precision of the workpiece is ensured, a reliable standard is laid for subsequent high-precision honing, and the yield is increased.

The invention provides a system and method for inhibiting wafer scratching in double-sided polishing and double-sided polishing equipment. The system comprises: a shunt manifold valve group, which shunts a polishing liquid main flow path into at least three independent branches respectively corresponding to the inner, middle and outer areas of a polishing pad; the at least three online heating units are respectively arranged on each branch to independently heat the polishing solution; the temperature monitoring device comprises at least three temperature sensors which are arranged in different areas and is used for monitoring the temperature of the three areas in real time; and the control system independently regulates and controls the power of each heating unit based on temperature feedback, a preset non-uniform radial temperature gradient is established and maintained on the polishing pad, and the gradient is configured that the temperature of the middle area is not lower than that of the inner area, and the temperature of the inner area is higher than that of the outer area. Thermal deformation of the polishing pad is optimized through partitioned independent temperature control, and wafer scratching is effectively restrained.

The invention relates to the technical field of machining, in particular to a grinding wheel polishing process monitoring system. The device specifically comprises the following modules: a grinding wheel polisher is used for polishing the surface of a workpiece; the data acquisition module is used for acquiring operation parameters in the grinding wheel polishing process in real time; the data processing and analyzing module is used for processing and analyzing the acquired operation parameters; the visual monitoring module is used for carrying out visual display on the analyzed information; the intelligent adjusting module automatically adjusts operation parameters of the grinding wheel polisher according to the analysis result; and the fault detection alarm module is used for detecting abnormal conditions in the grinding process and sending out an alarm signal. The novel grinding wheel polishing process monitoring system provided by the invention has the functions of comprehensive data acquisition, real-time data processing and analysis, intelligent fault detection and alarm, friendly user interaction interface and remote monitoring and alarm, and has important practical significance for improving the efficiency, quality and safety of the polishing process.

The invention relates to a chemical mechanical polishing method, a chemical mechanical polishing control device and a chemical mechanical polishing control system. The chemical mechanical polishing method is used for grinding and polishing a semiconductor wafer. The method comprises the steps that based on a prediction model, target parameters are obtained, and the target parameters represent the relation between the predicted polishing thickness and polishing duration of a to-be-polished layer on the semiconductor wafer; in the same preventive maintenance period, in response to the fact that the current batch of polishing is the first batch of polishing, obtaining the predicted first batch of polishing duration based on the target parameter and the target polishing thickness of the first batch of polishing; and on the basis of the predicted first-batch polishing duration, performing chemical mechanical polishing treatment on the to-be-polished layer in the semiconductor wafer. According to the method, the target parameter is constructed, the target parameter is predicted through the prediction model to obtain the predicted first-batch polishing duration, the requirement for pilot production can be reduced or even eliminated, and therefore time and labor consumption is reduced.

The invention discloses grinding and polishing equipment for the inner wall of a pipe workpiece. The grinding and polishing equipment comprises a rack, a workpiece rotating and supporting mechanism, a grinding mechanism, a radial feeding mechanism, an axial moving mechanism, a workpiece stabilizing mechanism and an electric control system. The grinding assembly is a flexible grinding wheel formed by splicing a plurality of arc-shaped grinding pieces, a pneumatic motor drives the flexible grinding wheel to rotate at a high speed to serve as main cutting motion, constant-pressure contact control is achieved through a radial feeding mechanism, abrasion of the grinding wheel can be compensated in a self-adaptive mode through the control mode, and it is guaranteed that the grinding pressure is stable; therefore, the reference size of the workpiece is protected to the maximum extent while the defects of the inner wall are effectively removed, the problem of size out-of-tolerance caused by uneven pressure or abrasion in traditional rigid grinding is avoided, constant-pressure, efficient and high-quality grinding is guaranteed, and the grinding and polishing efficiency and quality of the inner wall of the pipe workpiece are effectively improved.

The invention discloses an intelligent control method for precise grinding of a robot, and the method comprises the steps: obtaining the information of a to-be-ground workpiece and initial grinding parameters, and the initial grinding parameters comprise the load gravity of the tail end of the robot; generating a target contact force based on the to-be-ground workpiece information and the initial grinding parameters; constructing a gravity compensation model through preset coordinate parameters based on the load gravity at the tail end of the robot; in the grinding process, grinding force data are collected in real time; on the basis of the grinding force data, actual contact force is obtained through a gravity compensation model; comparing the actual contact force with the target contact force to generate a contact force deviation and a deviation change rate; based on the contact force deviation and the deviation change rate, a force-position hybrid control instruction is output through a fuzzy PID controller; and on the basis of the force-position hybrid control instruction, control adjustment parameters of the robot are generated. By forming a complete intelligent control closed loop, constant-force grinding can be achieved, and the problems of uneven surface roughness, excessive grinding and the like are effectively solved.

The invention provides an automatic detection method and system for the grinding machining surface of a precision workpiece, and belongs to the technical field of precision workpiece machining detection.The method comprises the steps that multi-mode image data of the grinding machining surface of a target precision workpiece and grinding parameters in the machining process are obtained; performing fusion preprocessing on the multi-modal image data to generate fused image features; feature extraction and cleaning are conducted on the grinding parameters, and grinding process features are generated; inputting the fused image features into a first-stage defect screening model to obtain a first detection result; when the existence confidence of any first defect is greater than a preset first confidence threshold, inputting the grinding process features into a defect mode diagnosis model to obtain a defect mode diagnosis result of the suspected defect area; determining a target defect detection model according to the defect mode diagnosis result; and inputting a part, corresponding to the suspected defect area, in the fused image feature into a target defect detection model to obtain surface defect geometric feature parameters of the suspected defect area.

The invention relates to the technical field of grinding control, in particular to a constant-power grinding control method, system and equipment of a numerical control grinding machine. According to the method, in a preset historical time period of a to-be-regulated moment, a time sequence curve of the deviation of the grinding power of the numerical control grinding machine relative to the preset grinding power is obtained and subjected to time sequence decomposition, and then proportional gain in PID control parameters is obtained according to the change trend of a trend component and the power deviation at the to-be-regulated moment in the trend component; obtaining an integral gain in the PID control parameters according to the periodic fluctuation characteristics of the seasonal components; according to the change trend of the time sequence curve and the fluctuation characteristics of the residual component, and in combination with the proportional gain and the integral gain, obtaining the differential gain in the PID control parameters; and finally carrying out constant-power grinding control on the numerical control grinding machine. The PID control parameters are adaptively adjusted based on the time sequence decomposition result of the power deviation, and the constant power control effect on the numerical control grinding machine is improved.

The invention relates to the technical field of semiconductor material precision machining, and discloses a 12-inch silicon wafer double-sided polishing upper and lower surface removal amount monitoring system and method, and the system comprises a macroscopic thickness monitoring unit, a microcosmic contact state decoupling sensing unit and a data processing controller. The method comprises the following steps: synchronously acquiring a total thickness signal of a silicon wafer, an acoustic emission signal of an upper / lower fixed disc side and a fluid dynamic pressure signal; the method comprises the following steps: constructing a lubrication state correction coefficient by utilizing fluid dynamic pressure, and carrying out nonlinear correction on a mechanical friction energy index extracted by acoustic emission to obtain an effective vector removal index representing real cutting capacity; and the removal distribution ratio of the upper surface and the lower surface is calculated, and the independent absolute removal amount of the upper surface and the lower surface is obtained through decoupling in combination with the total thickness variation. According to the method, by eliminating the interference of a fluid'water cushion effect 'on a friction signal, visualization and closed-loop feedback control of a single-face removal behavior in the double-face polishing process are achieved, and the problem of silicon wafer warping caused by removal asymmetry is effectively solved.

Provided is an information processing device including an information acquisition section that acquires substrate polishing information including measured temperature distribution information indicating a measured value of a temperature distribution of a polishing surface when a polishing process for polishing a substrate with the polishing surface of a polishing pad is performed by a substrate polishing device and device state information indicating a device state of the substrate polishing device, and an information generation section that inputs the substrate polishing information acquired by the information acquisition section into a learning model to generate polishing surface temperature control information indicating a control amount of a polishing surface temperature adjustment section when a polishing process is performed by the substrate polishing device. The learning model is a trained model that has learned a correlation between the substrate polishing information and the polishing surface temperature control information by machine learning.

The invention relates to the technical field of pipeline production, and aims to solve the technical problems of leak detection, high labor intensity of manual repair and the like. In order to solve the technical problem, the invention provides the pipeline robot and the method for detecting and repairing the defects of the inner wall of the pipeline. The pipeline robot comprises a robot body walking in a pipeline; the three-dimensional detection assembly is arranged at the front end of the robot body; a laser of the three-dimensional detection assembly emits a laser beam and forms a light ring on the inner wall of the to-be-detected pipeline; the 3D camera is used for shooting light rings; the lifting assembly is connected with the robot body and the three-dimensional detection assembly to drive the three-dimensional detection assembly to lift; the repairing assembly is arranged at the tail end of the robot body. A polishing brush of the repairing assembly is connected with a rotary power part so as to drive the polishing brush to rotate in the horizontal plane and the vertical plane. According to the invention, surface defects can be detected with high precision and high efficiency, detection and repair are integrated, and labor intensity is reduced.

The invention discloses a diamond microstructure precision grinding system and method with visual positioning, and the method comprises the following steps: collecting a microscopic visual image, calibrating a visual coordinate system and a machine tool coordinate system, and building a unified positioning coordinate system; extracting composite visual features, constructing an energy field, performing adaptive partitioning, and generating risk partitioning codes; the risk partition codes are input into a double-flow network, grinding signals are input into grinding branches, and parameter tracks are generated; precisely grinding according to a segmented parameter track, reducing the cutting depth and the speed in a high potential energy area, and increasing the speed in a low potential energy area; after grinding, obtaining a three-dimensional shape, performing error analysis and energy spectrum generation, and mapping to risk partition coding; and according to the error energy and the energy field, the grinding priority is judged, and high-priority partitions are selectively ground and remeasured. According to the method, the visual potential energy field is constructed and the improved double-flow neural network is fused, so that accurate positioning, self-adaptive grinding control and high-precision micro-area grinding of the diamond microstructure are realized.