1298results about "Automatic grinding control" patented technology

The invention relates to the technical field of optical manufacturing and processing control, in particular to an intelligent control system of lens processing equipment, which comprises a process relationship pre-storage module, a pressure distribution acquisition module, a surface shape error prediction module, a pressure compensation decision module, an actuator control module and a processing effect verification module. Wherein the process relation pre-storage module is used for establishing a pressure-removal rate relation mapping table; the pressure distribution acquisition module is used for acquiring pressure distribution data; the surface shape error prediction module is used for predicting surface shape error data generated by the lens; the pressure compensation decision module is used for generating a regionalized pressure compensation amount; and the actuator control module is used for dynamically adjusting the pressure applied to different areas of the lens by the polishing head. According to the method, by constructing the pressure-removal rate mapping and closed-loop self-calibration mechanism, intelligent pressure regulation and control and surface shape error dynamic correction in the lens polishing process are achieved, and the machining precision and stability are remarkably improved.

The invention belongs to the technical field of metallurgical engineering, and relates to an intelligent guide grinding system and method for the surface of a casting blank. By arranging the parameter initialization module, the parameter compensation module and the deviation correction module, the problem of unstable grinding quality caused by grinding force fluctuation, temperature change and material difference in the casting blank surface grinding process is solved. The method specifically comprises the steps that the feeding speed is dynamically adjusted by collecting grinding force data in real time, thermal deformation compensation is conducted according to the casting blank temperature and the steel grade characteristics, the upper limit value is determined based on quantitative analysis of surface state parameters and historical standard samples, and adaptive adjustment of the next round of coping parameters is achieved. According to the method, the consistency of the grinding depth is effectively improved, the over-grinding risk in the high-temperature casting blank grinding process is prevented, closed-loop optimization and continuous improvement of the grinding process are achieved, the stability and reliability of the casting blank surface grinding quality are improved, and it is ensured that the product quality cannot be affected by surface defects in the subsequent rolling process of the casting blank.

The invention relates to the technical field of precision machining, discloses a double-shaft DFG grinding machine Z1-Z2 linkage removal amount control and grinding wheel loss optimization method and system, and aims to solve the problems of unreasonable Z1-Z2 removal amount distribution, inaccurate grinding wheel loss control and poor wafer surface damage adaptability of existing DFG grinding. According to the method and system, Z1 rough grinding parameters are determined and adjusted through multi-objective optimization and self-adaptive control by means of the initial morphology and material characteristics of a wafer; in combination with a Z1 result, a deep learning model is utilized to intelligently distribute Z2 accurate grinding removal amount and parameters, and adaptive adjustment and abnormal Air Cut are realized; and meanwhile, the grinding parameters are continuously optimized by adopting the grinding wheel loss prediction model. By adopting the technical scheme, the grinding efficiency and precision can be remarkably improved, the service life of the grinding wheel is prolonged, the cost is reduced, and the problems of removal amount distribution, grinding wheel loss and wafer damage are solved.

The invention belongs to the technical field of precision machining and in-situ measurement, and discloses an in-situ measurement and bidirectional tool setting integrated system and method for an internal thread grinding machine. Various system errors and random errors are effectively eliminated through a non-hardware error compensation model and a high-fidelity data processing algorithm, in-situ measurement of the internal thread is completed in a modularized mode, and high-precision and high-efficiency in-situ automatic measurement of key parameters such as the pitch diameter, the thread pitch and the thread angle of the thread is achieved. The system can be directly integrated on the internal thread grinding machine, measurement is rapidly completed after machining or between procedures, workpieces do not need to be disassembled, secondary clamping errors are effectively avoided, and the detection efficiency and consistency are greatly improved.

The invention provides a model training method, a silicon wafer processing method, a silicon wafer processing device, a storage medium and equipment. The model training method comprises the following steps: acquiring initial state information and target state information of a silicon wafer to be processed; through an action decision model, according to the initial state information and the target state information, machining action information for the machining machine table is generated; determining an award parameter corresponding to the processing action information, wherein the award parameter represents the processing quality and efficiency when the processing machine processes the to-be-processed silicon wafer based on the processing action information; if the reward parameter is not more than the preset condition, updating the initial action decision model according to the reward parameter to obtain an updated action decision model; and based on the updated action decision model, returning to execute the step of generating the processing action information through the action decision model according to the initial state information and the target state information until the reward parameter is greater than the preset condition, and obtaining a target action decision model. According to the invention, the processing machine table can be accurately adjusted.

The invention discloses an integrated tile-shaped magnet outer circle grinding device and method based on artificial intelligence, and belongs to the technical field of grinding machining. The integrated tile-shaped magnet outer circle grinding device comprises a feeding device, a grinding device and a visual detection device; the feeding device comprises a feeding conveying belt, a guide groove, a spring bin, a material blocking barrel, a feeding barrel, a magnetic suction cup, an electromagnetic push rod, a cooperative mechanical arm, a reset spring and a discharging conveying belt. The visual detection device comprises a magnetic shoe counting camera, an annular light source, a counting camera bracket, a measuring camera bracket, a backlight plate, an outer contour measuring camera, a positioning camera and a positioning camera bracket; integrated automatic operation of feeding, grinding, detection and discharging is achieved, the production efficiency is greatly improved, automatic counting, precision detection and discharging are completed through cooperation of visual detection and the conveying belt, the manual operation intensity is effectively reduced, production interruption caused by personal errors is avoided, and the productivity in unit time is remarkably improved.

The invention provides a system and method for inhibiting wafer scratching in double-sided polishing and double-sided polishing equipment. The system comprises: a shunt manifold valve group, which shunts a polishing liquid main flow path into at least three independent branches respectively corresponding to the inner, middle and outer areas of a polishing pad; the at least three online heating units are respectively arranged on each branch to independently heat the polishing solution; the temperature monitoring device comprises at least three temperature sensors which are arranged in different areas and is used for monitoring the temperature of the three areas in real time; and the control system independently regulates and controls the power of each heating unit based on temperature feedback, a preset non-uniform radial temperature gradient is established and maintained on the polishing pad, and the gradient is configured that the temperature of the middle area is not lower than that of the inner area, and the temperature of the inner area is higher than that of the outer area. Thermal deformation of the polishing pad is optimized through partitioned independent temperature control, and wafer scratching is effectively restrained.

The invention relates to a chemical mechanical polishing method, a chemical mechanical polishing control device and a chemical mechanical polishing control system. The chemical mechanical polishing method is used for grinding and polishing a semiconductor wafer. The method comprises the steps that based on a prediction model, target parameters are obtained, and the target parameters represent the relation between the predicted polishing thickness and polishing duration of a to-be-polished layer on the semiconductor wafer; in the same preventive maintenance period, in response to the fact that the current batch of polishing is the first batch of polishing, obtaining the predicted first batch of polishing duration based on the target parameter and the target polishing thickness of the first batch of polishing; and on the basis of the predicted first-batch polishing duration, performing chemical mechanical polishing treatment on the to-be-polished layer in the semiconductor wafer. According to the method, the target parameter is constructed, the target parameter is predicted through the prediction model to obtain the predicted first-batch polishing duration, the requirement for pilot production can be reduced or even eliminated, and therefore time and labor consumption is reduced.

The invention discloses grinding and polishing equipment for the inner wall of a pipe workpiece. The grinding and polishing equipment comprises a rack, a workpiece rotating and supporting mechanism, a grinding mechanism, a radial feeding mechanism, an axial moving mechanism, a workpiece stabilizing mechanism and an electric control system. The grinding assembly is a flexible grinding wheel formed by splicing a plurality of arc-shaped grinding pieces, a pneumatic motor drives the flexible grinding wheel to rotate at a high speed to serve as main cutting motion, constant-pressure contact control is achieved through a radial feeding mechanism, abrasion of the grinding wheel can be compensated in a self-adaptive mode through the control mode, and it is guaranteed that the grinding pressure is stable; therefore, the reference size of the workpiece is protected to the maximum extent while the defects of the inner wall are effectively removed, the problem of size out-of-tolerance caused by uneven pressure or abrasion in traditional rigid grinding is avoided, constant-pressure, efficient and high-quality grinding is guaranteed, and the grinding and polishing efficiency and quality of the inner wall of the pipe workpiece are effectively improved.

The invention discloses an intelligent control method for precise grinding of a robot, and the method comprises the steps: obtaining the information of a to-be-ground workpiece and initial grinding parameters, and the initial grinding parameters comprise the load gravity of the tail end of the robot; generating a target contact force based on the to-be-ground workpiece information and the initial grinding parameters; constructing a gravity compensation model through preset coordinate parameters based on the load gravity at the tail end of the robot; in the grinding process, grinding force data are collected in real time; on the basis of the grinding force data, actual contact force is obtained through a gravity compensation model; comparing the actual contact force with the target contact force to generate a contact force deviation and a deviation change rate; based on the contact force deviation and the deviation change rate, a force-position hybrid control instruction is output through a fuzzy PID controller; and on the basis of the force-position hybrid control instruction, control adjustment parameters of the robot are generated. By forming a complete intelligent control closed loop, constant-force grinding can be achieved, and the problems of uneven surface roughness, excessive grinding and the like are effectively solved.

The invention relates to the technical field of grinding control, in particular to a constant-power grinding control method, system and equipment of a numerical control grinding machine. According to the method, in a preset historical time period of a to-be-regulated moment, a time sequence curve of the deviation of the grinding power of the numerical control grinding machine relative to the preset grinding power is obtained and subjected to time sequence decomposition, and then proportional gain in PID control parameters is obtained according to the change trend of a trend component and the power deviation at the to-be-regulated moment in the trend component; obtaining an integral gain in the PID control parameters according to the periodic fluctuation characteristics of the seasonal components; according to the change trend of the time sequence curve and the fluctuation characteristics of the residual component, and in combination with the proportional gain and the integral gain, obtaining the differential gain in the PID control parameters; and finally carrying out constant-power grinding control on the numerical control grinding machine. The PID control parameters are adaptively adjusted based on the time sequence decomposition result of the power deviation, and the constant power control effect on the numerical control grinding machine is improved.

The invention relates to the technical field of semiconductor material precision machining, and discloses a 12-inch silicon wafer double-sided polishing upper and lower surface removal amount monitoring system and method, and the system comprises a macroscopic thickness monitoring unit, a microcosmic contact state decoupling sensing unit and a data processing controller. The method comprises the following steps: synchronously acquiring a total thickness signal of a silicon wafer, an acoustic emission signal of an upper / lower fixed disc side and a fluid dynamic pressure signal; the method comprises the following steps: constructing a lubrication state correction coefficient by utilizing fluid dynamic pressure, and carrying out nonlinear correction on a mechanical friction energy index extracted by acoustic emission to obtain an effective vector removal index representing real cutting capacity; and the removal distribution ratio of the upper surface and the lower surface is calculated, and the independent absolute removal amount of the upper surface and the lower surface is obtained through decoupling in combination with the total thickness variation. According to the method, by eliminating the interference of a fluid'water cushion effect 'on a friction signal, visualization and closed-loop feedback control of a single-face removal behavior in the double-face polishing process are achieved, and the problem of silicon wafer warping caused by removal asymmetry is effectively solved.

The invention discloses a diamond microstructure precision grinding system and method with visual positioning, and the method comprises the following steps: collecting a microscopic visual image, calibrating a visual coordinate system and a machine tool coordinate system, and building a unified positioning coordinate system; extracting composite visual features, constructing an energy field, performing adaptive partitioning, and generating risk partitioning codes; the risk partition codes are input into a double-flow network, grinding signals are input into grinding branches, and parameter tracks are generated; precisely grinding according to a segmented parameter track, reducing the cutting depth and the speed in a high potential energy area, and increasing the speed in a low potential energy area; after grinding, obtaining a three-dimensional shape, performing error analysis and energy spectrum generation, and mapping to risk partition coding; and according to the error energy and the energy field, the grinding priority is judged, and high-priority partitions are selectively ground and remeasured. According to the method, the visual potential energy field is constructed and the improved double-flow neural network is fused, so that accurate positioning, self-adaptive grinding control and high-precision micro-area grinding of the diamond microstructure are realized.

The invention discloses a ceramic workpiece grinding control system based on vision measurement, which relates to the technical field of ceramic workpiece grinding and comprises a multi-source data acquisition module, a data preprocessing module, a vision measurement and grinding calculation module and a grinding control execution module, the vision measurement and grinding calculation module comprises a vision guide contour deviation module, a grinding allowance calculation module and a grinding feeding speed adjusting module. Self-adaptive grinding is achieved through cooperation of three modules in the vision measurement module and the grinding calculation module, precise deviation is output in combination with parameters such as vision guidance and curvature, a basis is provided for allowance adjustment, allowance is optimized in combination with parameters such as adaptive material characteristics and grinding wheel abrasion, the precision and the material utilization rate are balanced, and the grinding precision is improved. The speed is dynamically adjusted according to the allowance, the temperature and the like, quality and efficiency are considered, and the machining quality, efficiency and the adaptability of the system to different working conditions are improved under multi-source data cooperation.

The invention relates to a compensation method of a spring compression type grinding sleeve wear compensation device based on an Archard model. The spring compression type grinding sleeve wear compensation device based on the Archard model comprises a grinding shaft, a grinding sleeve, a spring compression assembly, a parameter acquisition module, a compensation execution mechanism and a control module. According to the solution integrating abrasion prediction, real-time monitoring and dynamic compensation, accurate compensation of abrasion of the grinding sleeve is achieved by constructing the abrasion prediction model fusing the compression characteristics of the spring and combining a pressure feedback adjusting mechanism, and the stability and consistency of the machining process are guaranteed.

The invention discloses a thin-wall stainless steel pipe welding seam polishing device, and belongs to the technical field of metal processing machine tools, the thin-wall stainless steel pipe welding seam polishing device comprises a main shaft, a through hole used for containing a thin-wall steel pipe to be polished is formed in the middle of the main shaft, a clamping groove is formed in the circumferential side wall of the through hole, and an electromagnetic strip is movably embedded in the clamping groove; and the ejector rod is coaxially opposite to the through hole and is driven by an ejector rod sliding table to be horizontally close to or far away from the main shaft. By means of the highly-integrated dual-mode power relay part, integration and rapid lossless switching of the grinding function and the ultrasonic peening function are achieved, the two working procedures are combined into one, the production efficiency is greatly improved, and positioning errors caused by multiple times of clamping are avoided.

The invention belongs to the technical field of numerical control machining, and discloses a numerical control machining tool path regulation and control method and system based on a dynamic coordinate system and overcut pre-judgment. The method aims at the problems that in complex curved surface grinding, due to static programming, tracks and poses are disjointed, and the overcut risk is difficult to control in time. The method comprises the steps that a dynamic coordinate system updated along with a tool edge line in real time is constructed, and design coordinates are mapped to the coordinate system; a sampling point is preset in the neighborhood of a grinding wheel theoretical contact point, and the theoretical distance and the actual distance between the sampling point and the axis of the grinding wheel are quantitatively calculated to achieve intelligent pre-judgment of the overcut risk before machining; and when it is judged that the risk exists, differentiated grinding wheel dynamic deflection angle correction is triggered in a grading mode according to the overcut occurrence position, and a perception pre-judgment correction closed loop is formed till the risk is eliminated. Dynamic coupling and self-adaptive regulation and control of the tool path and the real-time pose are achieved, and the machining precision, the consistency and the process reliability are remarkably improved.

The invention belongs to the technical field of steel pipe coping, and particularly relates to a round steel surface coping device for producing seamless steel pipes, which constructs a deflection dynamic compensation mechanism aiming at ultra-long round steel through cooperation of an electric telescopic rod of a knife rest, a driven wheel component and a driving wheel component. When radial run-out caused by deflection is detected, the deformation amount is offset through precise stretching and retracting; the driven wheel component and the driving wheel component form a double-fulcrum stable supporting structure, so that the swing amplitude of the round steel during rotation is reduced; the mounting rigidity of the tool rest is strengthened through the main supporting plate, excessive feeding is limited through the limiting block, stable clamping of the grabbing fingers and the pneumatic finger fixing plate is matched, and vibration in the coping process is effectively restrained. According to the mechanism, the deflection problem of the rigid grinding rod is thoroughly solved, the grinding depth uniformity of the super-long pipe is improved, the abnormal loss of a tool and the adhesion of chippings are reduced, the rejection rate is remarkably reduced, and the operation efficiency is improved.

The invention discloses a sampling needle outer wall self-adaptive polishing method and system, a product and a medium, and relates to the field of edge calculation. The method comprises the following steps: acquiring force and vibration signals to calculate an energy dissipation index; judging a cutting edge area, a sound window area or a transition area according to the index gradient; in the cutting edge area, a force signal is stabilized by controlling the feeding speed, and the rotating speed of a main shaft is adjusted, so that the kurtosis value tends to be minimum; in the sound window area, the feeding speed is controlled to stabilize the kurtosis target value; and in the transition area, the feeding rotation speed is synchronously adjusted according to the relative position, so that the force and the kurtosis track the dynamically changing target. By implementing the technical scheme provided by the invention, the polishing precision of the sampling needle is improved.

The invention discloses a robot polishing process regulation and control method based on deep learning, and relates to the technical field of workpiece machining. The regulation and control method comprises the steps that S01, the to-be-polished surface of a workpiece is divided into a plurality of areas, attribute division is conducted on the areas, the areas with the same attribute are divided into the same group, and a plurality of area groups are obtained; s02, establishing a corresponding surface parameter standard range for the same group of areas; by introducing the deep learning-based look-ahead prediction method, the change trend of multi-dimensional information data in the polishing process can be analyzed in real time, physical roots (such as polishing tool abrasion and temperature accumulation) are diagnosed in advance based on the associated network diagram, a prediction adjustment instruction is generated, active compensation optimization of a subsequent polishing program is achieved, and the polishing efficiency is improved. The lagging of post adjustment is effectively overcome, the efficiency and quality consistency of grinding operation are remarkably guaranteed, and meanwhile time waste caused by re-grinding is reduced.

The invention relates to the technical field of multi-manipulator control, and discloses an intelligent multi-manipulator knife sharpening cooperative control system. The system comprises a data acquisition module, a state analysis module, a cooperative calculation module and a control optimization module. The data acquisition module acquires real-time operation data of the multiple manipulators in the sharpening process, and the real-time operation data comprises position data, force data and tool wear data; the state analysis module identifies a stable working mode and a changing working mode according to the changing mode of the real-time operation data of each manipulator along with time; the cooperative calculation module calculates the cooperative performance index of each manipulator based on the real-time operation data in the stable working mode and the variable working mode; and the control optimization module generates a multi-manipulator collaborative sharpening control strategy according to the collaborative performance indexes and the real-time operation data. The system can realize effective cooperative control of multi-manipulator sharpening operation, and is suitable for a multi-manipulator cooperative sharpening scene in the field of machining.

The invention provides a ship plate part contour visual detection and polishing trajectory planning method, which comprises the following steps: obtaining a depth map of a ship part, the depth map comprising the overall contour and spatial height information of the part; extracting an actual contour of the ship part based on the depth map to obtain an actual contour point set of the part; matching the actual contour point set of the part with parts in a template library to complete part identification and pose registration; and according to the recognition result, the polishing edge information of the corresponding part template is called from a template library, the polishing edge information is mapped to the actual part contour point set, an actual polishing edge point set is determined, and a polishing track is planned. The grinding quality problem caused by errors of a model and a real object can be eliminated, the stability of the grinding quality is remarkably improved, the dependence on accurate positioning and a clamp is reduced, the robustness of the system under different working conditions is enhanced, the tool cost is reduced, and the intelligence of the system is improved.

The invention relates to a surface type correction and processing method of an aspherical lens, which comprises the following steps of: changing a radial point location of a polishing disk participating in cutting by adopting a rotary polishing disk and lens tangent layout and through three-axis linkage of numerical control X-axis radial feeding, numerical control B-axis swinging and Z-axis approaching movement, and forming differentiation by utilizing the linear velocity gradient of the disk to remove redundant materials of the lens; and surface shape error differential correction is realized. According to the method, the polishing head does not need to be frequently replaced, over-polishing / under-polishing of traditional air bag polishing is eliminated, and the single-piece machining time is shortened; an air bag structure is omitted, the service life of consumables is prolonged, and batch fluctuation is reduced; accumulative errors are reduced through three-axis linkage, and medium-high frequency ring belt errors are restrained. The matched processing method comprises the steps of initial forming, detection, planning, correction and the like, can be quickly adapted to lenses of multiple specifications, and efficiently completes high-precision batch manufacturing of medium and large-caliber aspheric surfaces.

A concrete surface processing machine (100) for processing a concrete surface, wherein the concrete surface processing machine is arranged to be supported on the concrete surface by one or more support elements (150) extending in a base plane (101) of the machine parallel to the concrete surface, wherein the concrete surface processing machine is arranged to rotate (R) about an axis (C) normal to the base plane (101) by the one or more support elements (150), wherein the concrete surface processing machine comprises control unit (110) connected to at least one laser range finder (120) arranged pointing in a fixed direction from the concrete surface processing machine, and wherein the control unit (110) is arranged to determine a boundary geometry of the concrete surface based on a sequence of ranges obtained by the laser range finder (120).

A spiral magnetorheological polishing method for mid-frequency error control is provided, relating to the technical field of optical polishing. The method includes: scanning along a polishing path by using a magnetorheological polishing method, and removing a material in a spiral manner with a polishing tool to achieve spiral magnetorheological polishing of a workpiece. An angle between a scanning direction and a workpiece material removal direction is changed in real time during scanning, to alter a spatial posture of a removal function on a polishing surface in a spiral manner, thereby reducing mid-frequency errors. The method further includes: during scanning, randomly changing a processing line spacing in real time to further achieve suppression of mid-frequency ripple errors. A scanning strategy employs raster scanning processing; when the scanning strategy employs raster scanning processing, the processing line spacing is a raster scanning spacing.

The invention discloses a tension real-time feedback and slitting online monitoring system for a slitting machine, which belongs to the technical field of coiled material slitting and comprises a first guide roller group, a second guide roller group, a third guide roller group, a shearing mechanism and a polishing mechanism which are mounted on a fixing frame. The tension real-time feedback and slitting online monitoring system of the slitting machine further comprises a second mounting plate and a controller. The power of the first shearing roller is transmitted to the two sets of grinding assemblies through the first transmission belt, so that the multiple grinding parts of the two sets of grinding assemblies rotate synchronously, the top face and the bottom face of the coiled material obtained after slitting are ground, corners and burrs generated in the slitting process are removed, and the requirement of subsequent machining for the surface smoothness of the coiled material is met. The controller can be matched with the corresponding grinding rotating speed according to the burr conditions of different cut coiled materials, the situation that the coiled materials are damaged due to excessive grinding is avoided, and the defect that grinding is insufficient and residues exist is also avoided.

The invention belongs to the technical field of intelligent manufacturing, and provides a thin plate welding seam polishing control method which comprises the following steps: calculating a defect judgment parameter for any point in each cluster, judging whether the point is a defect point and a defect type according to the defect judgment parameter, clustering the defect points to form a defect cluster set, and obtaining a target removal amount of each defect cluster; determining a trajectory for the gravity center projection point set of the defect cluster, and stepping from the starting point to the ending point of the trajectory with a dynamic step length to generate a discrete path point set; the track line comprises a center line obtained through curve fitting in the welding seam direction; according to the radius of the cutter and the expected removal depth of the current pass, the position and posture of the polishing cutter are calculated for each path point; and the discrete cutter positions and postures are fitted to form a continuous cutter pose track. The method is suitable for automatic grinding of automobile door frame type welding seams, and has the advantages of being simple in engineering, high in feasibility, low in cost, robust to welding slag artifacts and the like.

The utility model relates to a superhard material guide rail machining device which comprises a lathe bed. The working table is arranged above the machine body; the two ends of the cross beam are arranged on the workbench through stand columns; the X-axis linear motor module is arranged on the cross beam; the Z-axis linear module is arranged on the X-axis linear motor module; the spindle box is arranged on the Z-axis linear module, an electric spindle is arranged in the spindle box, and a grinding tool or a polishing tool is installed on the electric spindle; the Y-axis linear motor module is arranged on the workbench; and the workpiece carrying plate is arranged above the Y-axis linear motor module. Through multi-axis linkage of the X-axis linear motor module, the Y-axis linear motor module and the Z-axis linear motor module, the long guide rail is pressurized and polished through a small tool, the grinding amount is controlled through the dwell time and the polishing pressure, and high-precision machining of the long guide rail is achieved.

The invention discloses a grinding robot end effector with a vibration reduction function. The grinding robot end effector comprises a motor mounting frame, a rotating motor, a vibration reduction mechanism assembling frame, a magnetorheological damper and a vibration reduction plate. One end of the motor mounting frame is connected with the polishing robot; the rotating motor is mounted at the other end of the motor mounting frame; one end, corresponding to an output shaft of the rotating motor, of the vibration reduction mechanism assembly frame is fixedly sleeved on a shell of the rotating motor; the output shaft of the rotating motor penetrates through the vibration reduction mechanism assembly frame and is vertically and fixedly connected with the grinding turntable; the multiple magnetorheological dampers are all installed in the vibration reduction mechanism assembling frame, and the moving end of each magnetorheological damper abuts against the output shaft and applies radial damping force to the output shaft. The multiple vibration reduction plates are fixed to the vibration reduction mechanism assembling frame, and each vibration reduction plate is provided with the multiple elastic buffering units. The grinding robot end effector with the vibration reduction function has an excellent vibration reduction effect, and the grinding precision is improved.

An integrated cleaning and liquid supply device and online cleaning method for polyurethane polishing pads are disclosed. The device includes a base, a rotating seat, a swing arm, an independent liquid supply pipeline system and cleaning pipeline, a high-pressure nozzle array, and a positioning sensor assembly. During the polishing stage, polishing liquid is dripped through the liquid supply outlet. During the cleaning stage, the swing arm moves centripetally to a preset position aligned with the center of the polishing pad. The positioning sensor triggers a high-pressure pump, causing pure water to be sprayed as an atomized jet along the diameter of the pad surface through the high-pressure nozzle array. Simultaneously, the polishing pad rotates at a low speed, utilizing the synergistic effect of centrifugal force and high-pressure water flow to thoroughly remove residual contaminants within the micropores of the polyurethane. This invention integrates liquid supply and deep cleaning functions into the same motion mechanism, eliminating the need for machine shutdown or manual intervention. It offers advantages such as non-contact, non-destructive, thorough cleaning, and high automation, extending the life of the polishing pad and improving the stability of the CMP process.