Laser cutting system
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- SHENZHEN INTE LASER TECH
- Publication Date
- 2021-03-16
- Estimated Expiration
- Not applicable · inactive patent
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Abstract
Description
technical field
[0001] The invention relates to the technical field of laser processing, in particular to a laser cutting system. Background technique
[0002] Compared with traditional mechanical cutting tools, the laser beam cuts materials in a non-contact way and uses its peak energy. This cutting method has fast processing speed and high processing efficiency, and has gradually become the mainstream processing equipment for material cutting.
[0003] At present, there are two main methods of laser cutting system, one is to change the focal plane of the laser cutting head and repeat cutting many times, and the other is to use Bessel laser beam to realize one-time cutting with long focal depth. At present, one-time cutting mainly uses the Bessel laser beam method to increase the focal depth of the cutting head, which has high processing efficiency, but there is a problem that the laser beam emitted by the laser has a Gaussian distribution of light intensity, that is, the l...