Laser processing system, laser processing method and method of obtaining oval light spot
Patent Information
- Authority / Receiving Office
- CN · China
- Current Assignee / Owner
- 深圳市大族半导体装备科技有限公司
- Publication Date
- 2021-12-10
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Abstract
Description
technical field
[0001] The invention relates to the technical field of laser processing, in particular to a laser processing system, a laser processing method and a method for obtaining an elliptical spot. Background technique
[0002] Laser processing is widely used in the processing of transparent and brittle materials such as sapphire and glass because of its non-contact, simple operation, and high flexibility.
[0003] However, in conventional laser processing technology, Gaussian beams are often used for drilling and cutting operations. Irregular cracks usually occur on both sides of the cutting line formed by Gaussian beam cutting. Because the cracks are uncontrollable, it will further lead to brittle materials. Edge chipping occurs during the process; moreover, the cross-section obtained by Gaussian beam cutting has a large taper, which makes the cross-section uneven. Contents of the invention
[0004] Based on this, it is necessary to provide a laser processing sy...