Laser processing system, laser processing method and method of obtaining oval light spot

An elliptical spot, laser processing technology, applied in laser welding equipment, metal processing equipment, manufacturing tools, etc., can solve the problems of uneven section, large section taper, brittle material edge collapse, etc.
CN113770548APending Publication Date: 2021-12-10深圳市大族半导体装备科技有限公司

Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
深圳市大族半导体装备科技有限公司
Publication Date
2021-12-10

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Abstract

The invention relates to a laser processing system, a laser processing method and a method of obtaining an oval light spot. In the laser processing system, by arranging a first phase modulation element and a second phase modulation element to modulate a phase of a light beam, after the light beam is focused by a first focusing unit, the light beam irradiates a to-be-processed workpiece to form the oval light spot with a large focal depth, a crack is more easily formed in a long axis direction of the oval light spot, and a direction of the crack can be controlled only by reasonably controlling the long axis direction of the oval light spot, so that the crack develops in a direction beneficial to cutting the to-be-processed workpiece , and the edge breakage phenomenon of the to-be-workpiece is not prone to occurring; and in addition, a first cutting light beam is in penetrative energy distribution in the to-be-processed workpiece in a light propagation direction, so that a cutting channel is more uniform, the taper is relatively small, and the cutting section is smoother.
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Description

technical field

[0001] The invention relates to the technical field of laser processing, in particular to a laser processing system, a laser processing method and a method for obtaining an elliptical spot. Background technique

[0002] Laser processing is widely used in the processing of transparent and brittle materials such as sapphire and glass because of its non-contact, simple operation, and high flexibility.

[0003] However, in conventional laser processing technology, Gaussian beams are often used for drilling and cutting operations. Irregular cracks usually occur on both sides of the cutting line formed by Gaussian beam cutting. Because the cracks are uncontrollable, it will further lead to brittle materials. Edge chipping occurs during the process; moreover, the cross-section obtained by Gaussian beam cutting has a large taper, which makes the cross-section uneven. Contents of the invention

[0004] Based on this, it is necessary to provide a laser processing sy...

Claims

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