The invention relates to a
wafer film sticking
machine, and discloses a full-automatic
wafer film sticking
machine and a method thereof, and the full-automatic
wafer film sticking
machine comprises a rack, a carrying table, a pre-calibration table mechanism, a film sticking unit, a
manipulator and a
cutting tool. The carrying table is arranged on the rack and is used for storing wafers; the pre-calibration table mechanism is used for calibrating the center point and the positioning surface of the wafer or the orientation of a NOVTCH port; the film pasting unit is installed on the rack and comprises a working disc, a feeding mechanism, a front tongue plate, a waste film recycling mechanism, a rolling film pasting mechanism and a release film recycling mechanism, the front tongue plate separates a protective film into a base material film and a release film, the rolling film pasting mechanism pastes the base material film and the waste film, and the release film recycling mechanism recycles the corresponding films; the mechanical arm is installed on the rack and grabs and conveys wafers to the working disc, a
cutting tool on the mechanical arm is used for
cutting a base material film, and an
ultrasonic generator in the mechanical arm drives the
cutting tool to conduct vibration cutting. The automatic film pasting and cutting device can automatically pull a film, accurately
cut the film, cooperate with automatic film feeding, waste film collection and the like, complete wafer feeding and full
automation from film pasting to film cutting, improve efficiency and quality, and reduce labor cost and errors.