The invention relates to a high-thermal-
conductivity epoxy resin conductive
adhesive containing a composite conductive filler and a preparation method of the high-thermal-
conductivity epoxy resin conductive
adhesive. The high-thermal-
conductivity epoxy resin conductive
adhesive containing the composite conductive filler comprises 6-16% of
graphene oxide modified epoxy resin, 0.6-3% of a curing agent, 0-1% of a curing accelerator, 2-7% of
epoxidized soybean oil modified single-layer / multi-layer carbon nanotubes, 3-7% of
carbon fibers, 3-7% of nano silver
powder, 40-70% of micron silver
powder, 5.0-15.0% of a surface treating agent, 0.3-2.7% of a
coupling agent, 0.5-1.5% of a dispersing agent, 0.1-0.3% of an
antioxidant and 0.1-0.3% of a
lubricant. 0.5% and the balance of a
solvent. The
graphene oxide modified epoxy resin and the
epoxidized soybean oil modified single-layer / multi-layer carbon nanotubes are utilized to improve the
dispersion stability of the filler, the modified single-layer / multi-layer carbon nanotubes are adopted as a short-range conductive additive, the
carbon fibers are adopted as a long-range conductive additive, and the
graphene oxide modified epoxy resin and the
epoxidized soybean oil modified single-layer / multi-layer carbon nanotubes and the
carbon fibers cooperate to improve the conductivity. The conductive adhesive disclosed by the invention is high in heat conductivity, low in volume resistivity and high in tensile strength and bending strength, and has a wide application prospect in the fields of
automotive electronics,
wind power photovoltaics, LEDs (
Light Emitting Diode), LCDs (
Liquid Crystal Display) and the like.