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26 results about "Micro array" patented technology

Micro array - Computer Definition. A semiconductor device that is used to detect the DNA makeup of a human cell. DNA chains comprise molecules that pair with each other, and micro arrays contain millions of DNA strands designed to mate with their other half as the liquefied human cells are poured over them.

Device, image sensor and method for examining samples using time-resolved fluorescence measurement

A device for examining samples is disclosed, comprising a microarray, an excitation light source, and an image sensor (10). The image sensor (10) has a plurality of SPAD arrays (11), a plurality of additional photodiodes (12), and computing electronics. The SPAD arrays (11) are configured to detect the decay behavior of fluorescence light emitted as a result of irradiation with excitation light (L) in a respective detection area of ​​the SPAD array (11). The additional photodiodes (12) are configured to measure the respective intensity of the excitation light (L) incident on each of them. The computing electronics are configured to determine a normalized decay behavior of fluorescence light for one or more of the SPAD arrays (11) from the detected decay behavior and at least one of the measured intensities of the excitation light (L).Furthermore, a method for examining a sample is disclosed.
Owner:IMMS INST FUR MIKROELEKTRONIK UND MECHATRONIK SYST GEMEINNUTZIGE GMBH IMMS GMBH

MicroLED pixels and microLED array panels

A micro-LED pixel includes: a first light-emitting platform; a second light-emitting platform disposed above the first light-emitting platform; and a third light-emitting platform disposed above the second light-emitting platform, wherein at least a portion of the third light-emitting platform completely covers the second light-emitting platform; and the first light-emitting platform, the second light-emitting platform, and the third light-emitting platform do not contact each other.
Owner:JADE BIRD DISPLAY (SHANGHAI) LTD

A method for fabricating controllable crystallization micron-sized perovskite light-emitting devices based on solution pretreatment

This invention belongs to the field of optoelectronic technology, specifically relating to a method for fabricating a controllable crystallization micron-scale perovskite light-emitting device based on solution pretreatment. The method includes the following steps: Step 1: Obtaining a patterned microporous substrate; Step 2: Pre-wetting and seed layer construction; Step 3: Deposition of the main perovskite layer; Step 4: Slow-release controllable crystallization; The spin-coated wet film is placed in a vapor atmosphere of a good solvent for treatment, followed by thermal annealing to form a perovskite thin film within the patterned micropores; Step 5: Fabrication of a controllable crystallization micron-scale perovskite light-emitting device based on solution pretreatment. This invention, using pre-wetting, seed guidance, slow-release crystallization, and vapor annealing on a patterned microporous substrate, achieves precise control over the entire process of film nucleation and growth kinetics within the confined space of the micropores, thereby achieving high-quality, uniform fabrication of perovskite thin films within micron-scale micropores, and ultimately obtaining a high-performance, highly uniform microarray perovskite light-emitting device.
Owner:NINGBO INST OF NORTHWESTERN POLYTECHNICAL UNIV

Lithium ion battery electrode material high-throughput screening method based on single-particle electrochemical technology

The invention discloses a lithium ion battery electrode material high-throughput screening method based on a single-particle electrochemical technology, which comprises the following steps: firstly, depositing sample solutions of various different electrode materials on the same conductive substrate in an array form through an automatic sample application technology to form a microarray comprising a plurality of independent deposition points; then assembling into an electrochemical testing unit, and synchronously monitoring the dynamic optical response of each deposition point in situ by using an optical imaging system in the charging and discharging process; and finally, extracting and analyzing the optical signal of each point, and fitting to obtain electrochemical parameters for evaluating the performance of the material. The intrinsic electrochemical response data of dozens of to hundreds of material particles can be obtained in parallel by one experiment, the flux is high, the operation is simple and convenient, the interference of a conductive agent and a binder in the traditional electrode preparation is avoided, the material characteristics can be truly reflected, and the research, development and screening efficiency of the electrode material is remarkably improved.
Owner:NANJING UNIV

3D semiconductor device and structure with logic and memory

A 3D semiconductor device including: a first level including a single crystal layer, a memory control circuit, a first metal layer, a second metal layer, and a third metal layer; connection of the first transistors comprises the first, and / or the second, and / or the third metal layer; a fourth metal layer disposed atop third transistors disposed atop second transistors disposed atop said first level; a memory array including word-lines and at least four memory mini arrays which include at least four rows by four columns of memory cells, each of the memory cells includes at least one of the second transistors (at least one with a metal gate) or at least one of the third transistors; a connection path from the fourth metal to the third metal including a via disposed through the memory array; the memory control circuit includes first transistors and voltage regulators.
Owner:MONOLITHIC 3D INC

ICE catheter with controllable spiral deformation of micro array and imaging range expansion method

The invention discloses a micro array controllable spiral deformation ICE catheter and an imaging range expanding method.In the ICE catheter, a hollow acoustic window structure is arranged at the far end of a sheath tube and used for being filled with a liquid acoustic coupling medium, and a supporting assembly, a power assembly, a micro transducer linear array and a traction piece are connected into the hollow acoustic window structure; the supporting assembly is arranged in the axial direction of the sheathing canal. The micro transducer linear array comprises a plurality of transducer array elements which are rotatably arranged on the supporting assembly and are sequentially arranged in the axial direction of the sheath tube, and each transducer array element is provided with a piezoelectric layer perpendicular to the axial direction of the sheath tube; the traction piece is sequentially connected with the transducer array elements and is eccentrically connected with the transducer array elements; the output end of the power assembly is in transmission connection with the traction piece and can drive the traction piece to swing, the traction piece drives at least part of transducer array elements of the micro transducer linear array to rotate asynchronously so as to be arranged in a spiral form, clear image quality can be achieved in a dynamic view field, and the bending adjustment requirement of the sheath tube can be lowered.
Owner:ACOUSTIC LIFE SCI CO LTD

3D semiconductor device, structure and methods with memory arrays and connectivity structures

ActiveUS12622001B2Memory cellDevice material
A 3D semiconductor device including: a first level including a first single crystal layer and a memory control circuit including first transistors and control circuit connectivity provided by first, second, and third metal layers; a second level including second transistors (one which includes a metal gate) disposed atop the first level; third transistors disposed atop second transistors with a fourth metal layer disposed atop; a memory array including word-lines, the memory array includes at least four memory mini arrays, where each mini array includes at least four rows by four columns of memory cells, and where each of the memory cells includes at least one of the second or third transistors; a connection path from the fourth metal to the third or second metal layer, which includes a via disposed through the second level, and where the memory control circuit includes at least one power down control circuit.
Owner:MONOLITHIC 3D INC

Microled array with integrated photodetectors

Devices and methods for analyzing polymer arrays formed on integrated surfaces of microLEDs. One microarray includes a plurality of individually controllable microLED elements, a plurality of photodetector elements, an integrated surface, and a CMOS driver chip. Each microLED element is paired with a photodetector element. The CMOS driver chip controls activation of the microLED elements and the photodetector elements.
Owner:POLYMER FORGE INC

Micro array nozzle homogenization and deceleration method and system based on fluid simulation analysis

The invention relates to the technical field of fluid simulation, and discloses a micro array nozzle homogenization and deceleration method and system based on fluid simulation analysis, and the method comprises the steps: building a three-dimensional fluid simulation model of a coupling temperature field, a flow field and a self-oscillation field, detecting the outlet flow velocity, a pressure pulsation signal and a temperature signal of each micro nozzle; and a multivariable fuzzy PID controller is adopted, outlet speed uniformity, average speed and pressure pulse rate are taken as control targets, controllable parameters are dynamically adjusted, and active suppression and compensation of dynamic disturbance are realized. And meanwhile, real-time monitoring data is compared with a simulation result, a simulation model is continuously corrected by utilizing deviation, so that the simulation model infinitely approaches physical reality, a high-reliability control parameter set is generated, and the problem of control failure caused by model mismatch is fundamentally solved. Through a periodic online calibration mechanism, the flow distribution of each nozzle is adjusted in a self-adaptive manner, and automatic compensation of performance drift is realized, so that the targets of homogenization and deceleration are stably achieved for a long time.
Owner:HANGZHOU ZHIYI TECHNOLOGY CO LTD

Three-dimensional gradient structure zinc-free negative electrode material and application thereof

The application discloses a three-dimensional gradient structure zinc-free negative electrode material and application thereof, and belongs to the technical field of batteries. An aluminum foil and a copper sheet are tightly attached together to obtain a composite sheet; one side of the composite sheet with the aluminum foil is subjected to laser treatment under a protective atmosphere to obtain a three-dimensional gradient structure zinc-free negative electrode material with a microarray structure. The three-dimensional gradient structure zinc-free negative electrode material has the microarray structure on the surface; the three-dimensional gradient structure zinc-free negative electrode material comprises a conductive layer and an alloy layer grown in situ on the conductive layer, the conductive layer is Cu, the alloy layer is Cu9Al4, and the microarray structure comprises Cu9Al4 and Cu from top to bottom. The negative electrode material effectively optimizes the electrode surface electric field distribution, zinc ion concentration distribution and zinc nucleation behavior, thereby realizing uniform zinc deposition and inhibiting dendrite generation and corrosion / secondary reaction, and exhibiting excellent electrochemical performance and flexible performance in practical application, so that the electrode stability is improved.
Owner:UNIV OF JINAN

Multiple power supply circuits for LED arrays

A power system for an LED pixel array includes at least two power supplies that are respectively connectable to sub-arrays in the LED pixel array and provide adjustable power. A controller is connected to the at least two power supplies, where the controller is capable of adjusting the power provided based on measured needs of the sub-arrays in the LED pixel array. In one embodiment, the LED pixel array is a micro-LED array.
Owner:LUMILEDS LLC

Housing, display cover plate and electronic device

The application relates to the technical field of electronic equipment, in particular to a shell, a display cover plate and electronic equipment, wherein the shell comprises a shell body, the shell body comprises a base and a microarray layer, the base has an inner surface and an outer surface, the microarray layer is arranged on the outer surface, the microarray layer comprises a plurality of spaced-apart bosses, the axial cross-sectional diameter of the boss is D, the height of the boss 121 is H, the distance between two adjacent bosses is L, 10 nm<=D<=1.8 mu m, H>=100 nm, 10 nm<=L<=1.8 mu m, and H / (L+D)>=1. In the application, a cavity is formed between the bosses, electromagnetic waves can resonate in the cavity, the emissivity is improved, and the heat dissipation efficiency of the electronic equipment is improved. According to the scheme, the emissivity of the shell in the 2.5 mu m-25 mu m wave band can be improved to >=88% without affecting the appearance of the shell surface, so that the shell can be applied to various application scenarios.
Owner:HUAWEI TECH CO LTD

3D semiconductor devices and structures with logic and memory, and a semiconductor die

ActiveUS12666619B2Memory cellDevice material
A 3D semiconductor device including: a first level including a single-crystal layer, a memory control-circuit including first transistors, a first metal layer, a second metal layer, a third metal layer; connection of the first transistors includes the first, and / or the second, and / or the third metal layer; a fourth metal layer disposed atop third transistors disposed atop second transistors disposed atop said first level; a memory array including word-lines, including at least four memory mini-arrays including at least four-rows-by-four-columns of memory cells, each of the memory cells includes at least one of the second transistors (at least one with a metal-gate) or at least one of the third transistors; a connection path from the fourth metal to the third metal including a via disposed through the memory array; a semiconductor die, including second transistors and at least one alignment mark positioned toward the die edge, disposed atop said first level.
Owner:MONOLITHIC 3D INC

Electronic microarray chip data processing and signal extraction method and system, storage medium and electronic equipment

The invention belongs to the technical field of biological detection signal processing, and particularly relates to an electronic microarray chip data processing and signal extraction method and system. The method comprises the steps that stable dot matrix inner and outer well data are obtained through integral screening, the voltage difference is calculated, and preprocessing is carried out through double smoothing filtering, standardization and PCA dimension reduction; first-order and second-order derivatives of the preprocessed data are calculated and smoothed; searching and positioning a signal starting point st and an end point ed at the front section of the smoothed first-order derivative signal through a sliding window, and repairing a missing point based on second-order derivative characteristics and linear fitting; and finally, performing baseline fitting according to st and ed, and calculating an area difference between a signal curve and a baseline as an effective semaphore. The method effectively solves the problems of weak anti-interference capability, inaccurate start and end point positioning, large semaphore calculation deviation and the like in the prior art, and has the advantages of high data processing precision, high adaptability and high automation degree.
Owner:CHENGDU WANZHONG FUTURE BIOTECHNOLOGY CO LTD

Multi-layer modified ultra-micro array electrode and method for detecting selenium ions by using multi-layer modified ultra-micro array electrode

PendingCN121521959AMaterial electrochemical variablesGold filmDifferential pulse voltammetry
The invention discloses a multi-layer modified ultra-micro array electrode and a method for detecting selenium ions by using the multi-layer modified ultra-micro array electrode, and relates to the technical field of electrochemical analysis. L-cysteine is adopted as a modifier, and a firm Au-S covalent bond can be formed by sulfydryl in the molecular structure of L-cysteine and the surface of the gold film, so that an orderly-arranged and stable modification layer is constructed; meanwhile, amino groups and carboxyl groups in molecules can generate specific recognition and coordination with selenium ions, especially Se (IV), through hydrogen bonds and electrostatic attraction, so that the selective adsorption capacity to selenium is remarkably enhanced. The enrichment efficiency of selenium on the surface of the electrode is improved by more than 10 times under the dual action of anchoring multilayer modification and specific recognition, and the detection limit is as low as 0.1 microgram / L by combining the high resolution of differential pulse voltammetry and is reduced by 1-2 orders of magnitude compared with a traditional unmodified gold electrode, a glassy carbon electrode or other modification systems. The precise capture and detection of the ultra-trace selenium in the complex matrix are successfully realized.
Owner:ANHUI JIULU BIOTECHNOLOGY CO LTD

Micron-sized full-laser additive and subtractive composite manufacturing method and composite manufacturing equipment

The invention belongs to the technical field of additive manufacturing, and particularly relates to a micron-sized full-laser additive and subtractive composite manufacturing method and composite manufacturing equipment. The composite manufacturing method comprises the following steps that S1, metal powder is filled, a powder laying scraper is calibrated, and inert gas is introduced; s2, a lifting table of the forming cylinder descends according to the preset layer thickness, a lifting table of the powder cylinder ascends synchronously, a powder spreading device is started, and the metal powder above the powder cylinder is spread in a machining area of the forming cylinder; s3, a continuous laser is started, melting forming is conducted on the metal powder in the machining area according to the scanning path, and forming of the current layer is completed; s4, starting an ultrafast pulse laser, and scanning the current layer prepared in the step S3; and S5, the steps S2-S4 are repeated until the target micro-size part is manufactured. According to the micron-sized full-laser additive and subtractive composite manufacturing method, micro-sized structural parts with micron-sized precision and high aspect ratio micropores, microgrooves or complex internal microarrays can be efficiently manufactured in a high-quality mode.
Owner:GUANGDONG UNIV OF TECH

MicroLED pixels and microLED array panels

A micro-LED pixel includes: an integrated circuit (IC) backplane; a first light-emitting mesa disposed on the IC backplane; a second light-emitting mesa disposed above the first light-emitting mesa, a portion of the second light-emitting mesa not covering the first light-emitting mesa; a third light-emitting mesa disposed above the second light-emitting mesa, a portion of the third light-emitting mesa not covering either the first or second light-emitting mesa; a first bottom electrical connection structure configured to connect the bottom surface of a portion of the second light-emitting mesa to the IC backplane; a second bottom electrical connection structure configured to connect the bottom surface of a portion of the third light-emitting mesa to the IC backplane; and an optical isolation structure disposed around at least a portion of the micro-LED pixel.
Owner:JADE BIRD DISPLAY (SHANGHAI) LTD

MicroLED pixels and microLED array panels

A micro LED pixel includes: an integrated circuit (IC) backplane; a first light-emitting mesa disposed on the IC backplane; a second light-emitting mesa disposed above the first light-emitting mesa, a portion of the second light-emitting mesa not covering the first light-emitting mesa; a third light-emitting mesa disposed above the second light-emitting mesa, a portion of the third light-emitting mesa not covering either the first or second light-emitting mesa; a first bottom electrical connection structure configured to connect the bottom surface of a portion of the second light-emitting mesa to the IC backplane; and a second bottom electrical connection structure configured to connect the bottom surface of a portion of the third light-emitting mesa to the IC backplane.
Owner:JADE BIRD DISPLAY (SHANGHAI) LTD

Immunodetection reagent card

The utility model discloses an immunodetection reagent card which comprises a shell and a liquid channel located in the shell, the shell is defined by a bottom plate and a cover plate, the cover plate is provided with a sample adding hole and an observation window, and the immunodetection reagent card further comprises a filter pad used for guiding flow from the sample adding hole to the liquid channel and filtering a sample solution; the liquid channel is at least one micro-channel through which a sample solution passes, and a crossed micro-array which is arranged by adopting a capillary acting force principle and is used for driving the sample solution to flow in the micro-channel is arranged in the micro-channel; a first marking area, a second marking area and a third marking area are sequentially arranged in the microchannel along the flowing direction of a sample solution, and the areas are respectively coated with a marking antibody, a capture antibody 1 and a capture antibody 2 in sequence; and at least the second marking area and the third marking area can be observed through the observation window. The utility model has the advantages that: 1) the overall structure of the chip is simplified, and the production complexity and cost are reduced; and 2, the process controllability and the detection sensitivity are improved.
Owner:SOUTHWEST MEDICAL UNIV

RNA-LNP formulations delivered by HD-map

The present invention relates to stable nucleic acid LNP vaccine formulations for administration via a microprojection array in which the microprojections are densely packed and in which the vaccine formulations are rapidly sprayed or layered on to the microprojections in relatively small amounts such that the formulations dry rapidly. The present invention relates in particular to stabilized RNA-LNP vaccines delivered by high density micro-array patches (HD-MAPs).
Owner:VAXXAS PTY LTD

Nucleic acids delivered by HD-map

PCT designated stageWO2026020195A1SurgeryMicroneedlesHigh densityTGE VACCINE
The present invention relates to stable nucleic acid formulations for administration via a microprojection array in which the microprojections are densely packed and in which the formulations are rapidly sprayed or layered on to the microprojections in relatively small amounts such that the formulations dry rapidly. The present invention relates in particular to nucleic acid cancer vaccines delivered by high density micro-array MAPs (HD-MAP).
Owner:VAXXAS PTY LTD

A bio-detection chip and a detection method thereof

ActiveCN117563691BAnalysis material containersBurettes/pipettesComputer hardwareBiochip
This invention discloses a biochip and its detection method. The chip includes: a chip substrate, a glass slide base plate fitted outside the chip substrate, a glass slide cover plate installed above the glass slide plate, a plurality of nylon membranes arranged on the chip substrate, and molecular microarrays arranged on each of the plurality of nylon membranes. One end of the chip substrate is connected to a fixing plate, which is fixedly inserted into the glass slide base plate. The glass slide cover plate has a plurality of liquid inlet chambers, and liquid inlet heads are respectively installed on the liquid inlet ends of the plurality of liquid inlet chambers. A needle is respectively installed at the front end of the plurality of liquid inlet heads. This invention relates to the field of biochip technology and has the functions of extracting test liquid and chip detection, which are combined into one. It is easy to carry and easy to aseptically package. In use, pushing and pulling the plate can realize a series of processes such as extracting test liquid, delivering test liquid onto the biochip, and biochip detection.
Owner:LIAONING QIANYI BIOLOGICAL TECH

Super-hydrophobic thermal-mechanical coupling deicing surface based on liquid crystal elastomer and preparation method of super-hydrophobic thermal-mechanical coupling deicing surface

The invention discloses a preparation method of a super-hydrophobic thermal-mechanical coupling ice-phobic surface based on a liquid crystal elastomer. A liquid crystal box is prepared by constructing a microscopic array structure on the surface of a glass substrate, then liquid crystal monomers, a photoinitiator and hydrophobic conductive particles are fully mixed and dispersed and then are introduced into the liquid crystal box through a vacuum diversion technology, and finally the hydrophobic self-heating liquid crystal elastomer surface with a regular array is obtained through a photocuring reaction. Compared with a conventional super-hydrophobic electric heating surface, the micro array structure designed in the super-hydrophobic electric heating surface effectively induces crack initiation and expansion of an ice layer in the force-induced deicing process, and the mechanical deicing efficiency of the thermal response liquid crystal elastomer is remarkably improved. In addition, the thermal response liquid crystal elastomer can be driven by the electrothermal effect of itself, surface reversible contraction / expansion can be achieved without extra energy, integrated thermal-mechanical coupling deicing is achieved, the deicing energy consumption is effectively reduced, and the thermal response liquid crystal elastomer has wide application prospects in the technical field of aerospace deicing.
Owner:NANJING UNIV OF AERONAUTICS & ASTRONAUTICS

Lightweight heat dissipation airborne computer shell for unmanned aerial vehicle edge AI calculation

The utility model relates to the technical field of unmanned aerial vehicles, in particular to a light-weight heat dissipation airborne computer shell used for unmanned aerial vehicle edge AI calculation, low heat resistance transfer from a chip to the outside is achieved through a three-dimensional layered heat conduction structure (microarray copper column-graphene sheet-aluminum alloy fin), a Venturi air channel and a phase change energy storage material are combined, and the heat dissipation performance of the computer shell is improved. Under the design of a certain total weight, the temperature rise of the AI chip is controlled within 22 DEG C, the wind speed of the micro worm wheel fan is dynamically adjusted based on a PID algorithm, and the heat dissipation efficiency of the whole machine reaches 0.35 DEG C / W, which is improved compared with a traditional scheme.
Owner:HANGZHOU ZHUIFENGYU TECHNOLOGY CO LTD

3D semiconductor devices and structures with logic and memory, and a semiconductor die

A 3D semiconductor device including: a first level including a single-crystal layer, a memory control-circuit including first transistors, a first metal layer, a second metal layer, a third metal layer; connection of the first transistors includes the first, and / or the second, and / or the third metal layer; a fourth metal layer disposed atop third transistors disposed atop second transistors disposed atop said first level; a memory array including word-lines, including at least four memory mini-arrays including at least four-rows-by-four-columns of memory cells, each of the memory cells includes at least one of the second transistors (at least one with a metal-gate) or at least one of the third transistors; a connection path from the fourth metal to the third metal including a via disposed through the memory array; a semiconductor die, including second transistors and at least one alignment mark positioned toward the die edge, disposed atop said first level.
Owner:MONOLITHIC 3D INC