Vertical interconnection substrate based on laser nanoprocessing technology and manufacturing method thereof

A nano-fabrication, vertical interconnection technology, applied in the manufacture of printed circuits, mechanically removing conductive materials, and electrically connecting printed components, etc., can solve the problem of large parasitic inductance and capacitance, low system integration, long signal delay, etc. problems, to achieve the effect of reducing parasitic inductance and capacitance, high technical precision, and reducing signal delay

Active Publication Date: 2020-05-15
SHANGHAI SPACEFLIGHT ELECTRONICS & COMM EQUIP RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the traditional pure PTFE material has low strength and must be filled with reinforcing materials such as glass fibers before it can be used as a substrate.
[0004] As a new type of microwave/millimeter-wave substrate material, LCP can not only meet the requirements of high-performance microwave/millimeter-wave systems, but also micro

Method used

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  • Vertical interconnection substrate based on laser nanoprocessing technology and manufacturing method thereof
  • Vertical interconnection substrate based on laser nanoprocessing technology and manufacturing method thereof
  • Vertical interconnection substrate based on laser nanoprocessing technology and manufacturing method thereof

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Embodiment 1

[0046] see figure 1 and Figures 2a to 2d as shown, figure 1 It is a flowchart of a method for manufacturing a vertically interconnected substrate based on laser nanoprocessing technology according to an embodiment of the present invention. The present invention provides a method for manufacturing a vertically interconnected substrate based on laser nanoprocessing technology, including the following steps:

[0047] S1: provide a substrate, see Figure 2a As shown, the substrate includes an LCP substrate 102 and a first metal layer 101 and a second metal layer 103 covering both sides of the LCP substrate 102. In this embodiment, the first metal layer 101 and the second metal layer 103 are both copper layer;

[0048] S2: see Figure 2b As shown, the first metal layer 101 is formed through positive photoresist photolithography, hard film, excess copper corrosion, and glue removal to form the first circuit wiring layer 105;

[0049] S3: see Figure 2b As shown, according to ...

Embodiment 2

[0060] Based on the same inventive concept, such as Figure 2d As shown, the present invention also provides a vertical interconnect substrate based on laser nanoprocessing technology, which is manufactured by the vertical interconnect substrate manufacturing method based on laser nanoprocessing technology described in Embodiment 1, which includes At least one solid metal via 106, the first circuit wiring layer 105, the LCP substrate 102 and the second circuit wiring layer 107, the first circuit wiring layer 105 and the second circuit wiring layer 107 are respectively covered on both sides of the LCP substrate 102, The solid metal via 106 is a metal conductor for vertically interconnecting the first circuit wiring layer 105 and the second circuit wiring layer 107 in the substrate. Preferably, the materials of the first circuit wiring layer 105, the second circuit wiring layer 107 and the solid metal via post 106 are all copper, and metallized through holes are used to realize ...

Embodiment 3

[0064] Based on the same inventive concept, such as Figure 5 as shown, Figure 5 It is a flowchart of a method for manufacturing a vertically interconnected substrate based on laser nanoprocessing technology according to an embodiment of the present invention. The present invention also provides a method for manufacturing a vertically interconnected substrate based on laser nanoprocessing technology, including the following steps:

[0065] S1: provide a substrate, the substrate includes an LCP substrate and a first metal layer and a second metal layer covering both sides of the LCP substrate;

[0066] S2: According to the preset position of the through hole in the first metal layer, laser nanoprocessing technology is used to open a blind hole at the corresponding position on the substrate, and the bottom of the blind hole is connected to the second metal layer, and the blind hole is cleaned. ;

[0067] S3: after reserving electrodeposited contacts on the second metal layer,...

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Abstract

The invention discloses a vertical interconnection substrate manufacturing method based on a laser nanometer processing technology. The method comprises the following steps of photoetching, corrodingand degumming a dielectric layer to form a first circuit wiring layer at one side of the substrate, then, forming a blind hole at the corresponding position of the substrate by adopting a laser nano machining technology, putting the substrate into an electro-deposition solution for electro-deposition, filling the blind hole, and finally photoetching, corroding and degumming the dielectric layer toform a second circuit wiring layer at the other side of the substrate. The manufacturing method is concise in process flow, and the laser nano-machining technology is high in precision. Cavities do not exist in the through holes, the interconnection is reliable, and the density and reliability of the three-dimensional packaging of a LCP flexible substrate are improved. Meanwhile, the vertical interconnection between LCP double-sided circuit wiring layers is achieved through the metallized through holes, the interconnection distance can be effectively shortened, the signal delay is reduced, the parasitic inductance and capacitance are reduced, and the high-frequency characteristic is improved, and therefore the system integration performance is improved.

Description

technical field [0001] The invention belongs to the technical field of electronic packaging, and in particular relates to a vertical interconnect substrate based on laser nano-processing technology and a manufacturing method thereof. Background technique [0002] With the development of electronic products in the direction of thinner, lighter, wearable and multifunctional, higher requirements are put forward for packaging substrates in terms of miniaturization, flexibility and high density. At present, the flexible substrate materials used for microwave / millimeter wave mainly include: polyimide (PI), polyethylene (PE), thermoplastic polymer (PEN, PET) and liquid crystal polymer (Liquid Crystal Polymer, LCP) and so on. Compared with other flexible materials, LCP has high molecular structure symmetry and weak dipole polarization, making it a high-performance flexible substrate material. [0003] LCP materials can maintain low dielectric constant and tangent loss in a very wid...

Claims

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Application Information

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IPC IPC(8): H05K1/02H05K1/09H05K1/11H05K3/00H05K3/04H05K3/10H05K3/18H05K3/42
CPCH05K3/42H05K3/00H05K3/046H05K3/107H05K3/18H05K3/188H05K1/02H05K1/09H05K1/116
Inventor 刘凯张诚丁蕾罗燕任卫朋王立春
Owner SHANGHAI SPACEFLIGHT ELECTRONICS & COMM EQUIP RES INST
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