6 results about "Nano devices" patented technology

This invention discloses a three-dimensional measurement method for micro / nano devices based on an improved focusing evaluation function. The method includes the following steps: processing acquired sequential images, calculating a structure fidelity index, and assembling the processed images into a three-dimensional image matrix; generating gradient response maps based on sliced ​​images in the three-dimensional image matrix, combining the response maps with the structure fidelity index and a noise reduction term to construct an improved focusing evaluation function, obtaining a focusing value sequence; performing a preliminary peak search on the focusing value sequence, constructing a candidate dataset, and calculating a peak quality factor; calculating the comprehensive effective quality based on the selected candidate fitting dataset, and solving for the final depth coordinates of the pixels based on the effective quality; generating an initial sparse point cloud, and using the point cloud to generate a surface consistency index, driving an anisotropic diffusion algorithm and depth iteration, outputting a three-dimensional morphology model and size parameters. This invention improves the depth measurement accuracy and edge details of three-dimensional reconstruction of micro / nano devices.

This invention discloses a semi-flexible sealed composite material beam-membrane-island structure for micro / nano devices and its fabrication method. The invention employs both rigid and flexible materials to construct the beam-membrane-island structure of the micro / nano device. The beam and island structures are made of rigid materials that can be fabricated in micro / nano dimensions, while flexible materials fill the periphery of the beam and island structures. The flexible filling layer acts as a "displacement coordination layer," ensuring a clear mechanical response while maintaining the high modulus of the silicon beam. Simultaneously, the local deformation of the flexible layer absorbs lateral coupling stress, allowing strain fields in different directions to be separated and amplified in the beam / island region. The flexible material forms a stress transition zone between the beam and island, preventing strong stress concentration in the pure silicon beam-island structure under concentrated loads. This invention still uses materials compatible with micro / nano fabrication processes as the main structural material, enabling integration with standard photolithography, reactive ion etching, deep silicon reactive ion etching, anodic bonding processes, through-silicon vias (TSVs), and glass vias, among other micro / nano processes.

This invention discloses a multifunctional fiber optic electronic system based on D-shaped optical fiber and its fabrication method, belonging to the technical field of fiber optic optoelectronic integration and information functional devices. The system includes a D-shaped optical fiber and various heterogeneous micro / nano devices integrated in situ on the polished side surface of the D-shaped optical fiber. The D-shaped optical fiber is used for optical signal transmission and also serves as an integration substrate. The flat, processable area formed by polishing its side surface is called the polished side surface, which is used to integrate various heterogeneous micro / nano devices. These heterogeneous micro / nano devices are used to realize in-situ signal detection, logic processing, temperature self-monitoring, and wireless energy and signal interaction functions. This overcomes the losses and complexity caused by the traditional "fiber-chip" discrete architecture, significantly improving system integration, energy efficiency, and reliability.

This invention relates to the fields of micro / nano fabrication and micro-assembly technology, specifically to a microneedle array-based mass transfer device and its fabrication method, and a micro / nano device transfer method. The micro / nano device transfer method includes providing a mass transfer device comprising a carrier and a microneedle array. The mass transfer device is moved above the micro / nano device, and near-infrared light irradiation and pressure are applied to the mass transfer device to cause the microneedles to bend. The near-infrared light is removed, and the microneedles are allowed to cool to room temperature. The microneedles then pick up the micro / nano device based on dry adhesion and move it to a target substrate. Patterned near-infrared light is used to irradiate the microneedles, triggering deformation recovery and achieving selective release of the micro / nano device. This solution utilizes the synergy of near-infrared light, photothermal conversion materials, and shape memory polymers to enable the microneedle array to respond rapidly, achieving precise control of the microneedle adhesion force, thereby realizing precise and efficient pickup, mass transfer, and selective release of micro / nano devices.

The application belongs to the technical field of micro-nano scale thermal measurement, and particularly relates to a thermal conductivity measurement method and a measurement device. The thermal conductivity measurement method comprises the following steps: providing a heat sink, a plurality of micro-nano devices and a sample to be measured, wherein the micro-nano devices have a first thermal resistance, the sample to be measured has a second thermal resistance, the sample to be measured and the heat sink and each contact area form a contact thermal resistance, the first thermal resistance is greater than the second thermal resistance and greater than the contact thermal resistance; applying a heating power to a thermal measurement circuit of a first micro-nano device; obtaining actual contact temperatures of contact areas of the sample to be measured and adjacent second and third micro-nano devices; obtaining actual heat flow powers of a part corresponding to the second and third micro-nano devices flowing through the sample to be measured; calculating a thermal conductivity of the sample to be measured; and calculating the thermal conductivity of the sample to be measured according to the geometric size and the thermal conductivity of the sample to be measured. The application can exclude the influence of the contact thermal resistance, improve the measurement accuracy, and has a simple structure, low cost and is suitable for mass production.

This invention discloses a transfer stamp with controllable adhesion and multi-dimensional force sensing. The stamp integrates a driving sensing system within its cylindrical unit. This system has a stool-shaped frame, which is inverted. A driving module for inducing active deformation of the system is located on the outer side of any one "leg" of the stool-shaped frame, and a sensing module for receiving force changes is located on the outer side of each of the remaining "legs." Both the sensing module and the driving module have electrodes positioned at their respective feet. The adhesion force is adjusted by changing the stamp's bending amplitude through regulating the electrical excitation parameters of the driving module. This invention also discloses a method for transfer printing using the aforementioned stamp. This invention features "active bending" and "multi-dimensional force sensing" functions, enabling adjustment of the adhesion force between the stamp and the interface of micro / nano devices, thereby switching between the pickup and release states of the micro / nano devices; it can also instantly determine the pickup and release states of the micro / nano devices.