Periodic bowl-shaped structural template and preparation method thereof

Abstract

The invention discloses a periodic bowl-shaped structural template and a preparation method thereof. The preparation method comprises the following steps: depositing a silicon dioxide mask layer on a substrate, spin-coating photoresist on the silicon dioxide mask layer, preparing a periodic micro / nano photoresist lattice pattern, depositing a thin metal film on the photoresist structure, peeling to obtain a metal hole array pattern, forming a bowl-shaped array structure of the silicon dioxide by adopting a wet etching technology by taking the metal hole array structure as a mask, and finally, removing the metal mask. The periodic bowl-shaped structural template prepared by the preparation method is large in area and uniform and complete in structure, has a very good application prospect in the aspects of preparation of patterned structures, photonic crystals, surface roughening, surface flocking and micro / nano devices and the like, can be widely applied to the aspects of LEDs (Light-Emitting Diodes), solar batteries, photonic crystals, quantum devices and the like, or serves as an etching mask layer of the substrate material, or is used for the manufacturing of other micro / nano structures.

Description

technical field [0001] The invention relates to the technical field of micro-nano structure preparation and application, and specifically designs a periodic bowl-shaped structure template and a preparation method thereof. Background technique [0002] Materials and structures exhibit many new features at the micro-nano scale that are different from those at the macro-scale. Nanotechnology has become one of the hot areas of current scientific research and industrial development, and the development of semiconductor device technology largely relies on micro-nano processing technology. The miniaturization of semiconductors relies on micro-nano-scale functional structures and devices, and the basis for realizing micro-nano functional structures is advanced micro-nano processing technology. [0003] In the existing semiconductor planar process technology, with the continuous improvement of lithography precision, the resolution of planar two-dimensional graphics has reached ten na...

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Problems solved by technology

[0003] In the existing semiconductor planar process technology, with the continuous improvement of lithography precision, the resolution of planar two-dimensional graphics has reached ten nanometers; however, traditional semiconductor technologies based on planar processes (such as etching, deposition, etc.) Both can only realize straight line structures such as vertical sidewalls or inclined sidewalls, and cannot realize the manufacture of curved surface structures; this severely limits the design ideas of micro-nano devices and hinders the realization of some special structures; and emerging technologies represented by 3D printing Although the technology has a large degree of structural freedom, its precision is far from reaching the micro-nano level

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