The invention relates to a hard and brittle material large depth-
diameter ratio
small hole laser milling-precision
grinding process and a device thereof.The method comprises the steps that firstly, a mapping relation between an inlet aperture and
laser parameters is established through a response surface method,
laser machining parameters are determined, and laser
machining parameters are obtained on the basis of an
optical image acquisition
system; a pulse laser is adopted to prepare the large-depth-
diameter-ratio micro through hole with the accurate and controllable
ablation amount, the
grinding amount is reduced, meanwhile, the strength,
hardness or
fracture toughness of materials at the
machining position is reduced, and therefore the
grinding force for machining hard and brittle materials and tool abrasion are reduced; and secondly, machining damage such as microcracks, recast
layers and taper caused by laser machining is removed through grinding machining, and the machining quality of the
small hole with the large depth-
diameter ratio is improved. The device mainly comprises a
machine body, a
workbench, a laser machining main shaft, a grinding machining main shaft, a differential interference difference
microscope, an optical
CCD camera and an X-axis and Y-axis
servo driving module, different machining processes and in-situ detection can be completed on the same
machine tool, the problems of secondary clamping, poor repeated positioning precision and the like of workpieces are solved, the machining efficiency is improved, and the machining cost is reduced. According to the method, bottom hole laser machining of the hard and brittle materials is highly combined with grinding hole repairing and hole expanding, high-quality and high-efficiency machining of the hard and brittle materials is achieved, tool abrasion is reduced, and the machining cost is reduced.