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Technological method for composite asynchronous polishing of ceramics using picosecond-nanosecond laser

A picosecond laser and process method technology, applied in laser welding equipment, manufacturing tools, metal processing equipment, etc., can solve the problems of easily damaged surface morphology, large amount of material removal, large thermal/mechanical stress affected area, etc., to achieve High surface activity and low melting point

Active Publication Date: 2019-03-26
BEIJING UNIV OF TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] Aiming at the problems of microcracks and pores, large thermal / mechanical stress affected area, large amount of material removal and easy damage of surface morphology in the existing ceramic material polishing technology, the invention provides a picosecond-nanosecond laser composite asynchronous The technical solution for polishing ceramics can effectively overcome the above-mentioned problems and realize the high-precision sub-micron polishing effect without destroying the geometric shape of the material surface.

Method used

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  • Technological method for composite asynchronous polishing of ceramics using picosecond-nanosecond laser
  • Technological method for composite asynchronous polishing of ceramics using picosecond-nanosecond laser
  • Technological method for composite asynchronous polishing of ceramics using picosecond-nanosecond laser

Examples

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Embodiment 1

[0022] To polish the 95% alumina ceramic substrate, first use the picosecond laser with an average power of 60W, a repetition rate of 100,000KHz, and a defocus of 0 to start scanning irradiation, with a scanning speed of 400mm / s and a scanning path gap of 0.05mm. Sputtering used to remove material microscopic surface protrusions and excite micro-nano particles. After 50μs, the average power is 5W, the repetition frequency is 100KHz, and the nanosecond laser tracking the picosecond laser scanning path with a defocus of +0.3mm is irradiated at the same speed, which is used to melt the micro-nano particles produced by picosecond laser irradiation. It produces a layer of uniform and dense fine-grained fused layer. The used polishing process was taken out from the processing platform, and the surface micro-morphology was tested using a laser confocal microscope. The roughness Ra decreased from the original 1.70 μm to 0.68 μm. The three-dimensional surface morphology before and afte...

Embodiment 2

[0024] To polish the zirconia ceramic substrate, first use a picosecond laser with an average power of 30W, a repetition rate of 50,000KHz, and a defocus of 0 to start scanning irradiation. The scanning speed is 1000mm / s, and the scanning path gap is 0.01mm. , for sputtering to remove material microscopic surface protrusions and excite micro-nano particles. After 50μs, the average power is 3W, the repetition frequency is 50KHz, and the nanosecond laser tracking the picosecond laser scanning path with a defocus of +0.5mm is irradiated at the same speed, which is used to melt the micro-nano particles produced by picosecond laser irradiation, so that It produces a uniform dense fine-grained fused layer. The used polishing process was taken out from the processing platform, and the surface micro-morphology was tested using a laser confocal microscope. The roughness Ra decreased from the original 1.30 μm to 0.52 μm. The three-dimensional surface morphology before and after polishin...

Embodiment 3

[0026]To polish the aluminum nitride ceramic substrate, first use a picosecond laser with an average power of 55W, a repetition rate of 100,000KHz, and a defocus of 0 to start scanning irradiation, with a scanning speed of 300mm / s and a scanning path gap of 0.5mm. Sputtering used to remove microscopic surface protrusions and excite micro-nano particles of materials. After 100μs, the average power is 14W, the repetition frequency is 100KHz, and the nanosecond laser tracking picosecond laser scanning path is irradiated at the same speed with a defocus of +0.1mm, which is used to melt the micro-nano particles produced by picosecond laser irradiation, so that It produces a uniform dense fine-grained fused layer. The used polishing process was taken out from the processing platform, and the surface micromorphology was tested using a laser confocal microscope. The roughness Ra dropped from the original 1.81 μm to 0.65 μm.

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Abstract

The invention discloses a technological method for composite asynchronous polishing of ceramics using picosecond-nanosecond laser. The technological method comprises the steps of firstly, irradiatingthe ceramic surface to be machined through picosecond laser along a certain scanning trace, and removing micro protrusions of the ceramic surface, so that the preliminary flattening is achieved; meanwhile, generating a large number of micro-nano particles by using a removal mechanism for the electronic state of ceramic materials through picosecond laser, wherein the micro-nano particles exist at adjacent space areas of the irradiated ceramic surface; starting a low power nanosecond laser according to the preset time for tracing the scanning path of the picosecond laser, and irradiating and fusing the micro-nano particles uniformly distributed on the ceramic surface; and finally forming a compact and smooth fine-grain melted layer so that the polishing effect is achieved. According to the technological method, original pore cracks of the ceramic materials are repaired, and the shortcomings that a heat affected zone generated by traditional laser polishing is large and the material surface is liable to generate micro-cracks and pores are overcome; and low removal amount, high efficiency and accuracy and submicron-level fine polishing of the ceramic materials is achieved.

Description

technical field [0001] The invention relates to the field of laser polishing on the surface of ceramic materials, in particular to a submicron level high-precision laser composite polishing processing method on the surface of alumina ceramics. technical background [0002] Alumina (Al 2 o 3 ), zirconia (ZrO 2 ) as the main ceramic material, used for thick film integrated circuits and ceramic structural parts. Engineering ceramics such as alumina and zirconia have good conductivity, mechanical strength and high temperature resistance. They are widely used ceramics. Use and special performance needs. However, the conventional mechanical polishing method for ceramic materials has long processing time and low processing efficiency, and most of the mechanical processing is contact processing, which is easy to cause mechanical damage to the ceramic surface, subsurface cracks and other defects, and mechanical processing is limited by its processing principle and is difficult to...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/00
CPCB23K26/0006B23K26/0604B23K26/0626B23K26/0624B23K26/082B23K26/60B23K2103/52B23K26/354
Inventor 季凌飞张熙民王文豪燕天阳马瑞
Owner BEIJING UNIV OF TECH
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