Ultrafast laser polishing method for ceramic matrix composites

Abstract

An ultrafast laser polishing method for ceramic matrix composite material At first, that proces sample of SiC ceramic matrix composite is fixed on the lase processing equipment, the laser processing equipment comprise an optical path system and a processing platform, the optical path system comprises a femtosecond laser, and the laser of the femtosecond laser acts on the processing platform afterpassing through a mirror, a beam expanding mirror, an aperture, a vibrating mirror and a field mirror assembly; The machining platform comprises a three-dimensional movement mechanism and a fixture inthe x, y and z axes directions relative to the worktable, an angular displacement table is installed in the three-dimensional movement mechanism, and the included angle between the y axis direction and the normal of the worktable can be changed by adjusting the angular displacement table to obtain a large incident angle of the laser beam; The laser parameters of the femtosecond laser, the scanning of the vibrating mirror and the movement of the three-dimensional moving mechanism are controlled by the computer to polish the sample. The invention utilizes the laser and the processing platform to work cooperatively, adjusts the transverse and longitudinal light spot overlap ratio according to the need, ensures the uniformity of the processing, and has high processing efficiency.

Description

technical field [0001] The invention relates to the technical field of laser processing of ceramic matrix composite materials, in particular to an ultrafast laser polishing processing method for ceramic matrix composite materials. Background technique [0002] SiC ceramic matrix composites have the advantages of high temperature resistance, high specific strength, high specific modulus, and anti-oxidation corrosion of SiC ceramics, and under the reinforcement and toughening of SiC fibers, they overcome the low fracture toughness of SiC ceramics and are prone to catastrophic The shortcomings of damage, improve the reliability and service temperature of materials, have been widely used in many fields such as aerospace. Due to the high hardness of this material, it is difficult to achieve micro-nano machining with high precision polishing by traditional processing methods. [0003] Compared with traditional processing methods, ultrashort pulse laser processing has the characte...

AI Technical Summary

Problems solved by technology

At present, domestic laser polishing processing methods are still in the preliminary research stage, and most of them are carried out on existing laser processing equipment. It works relatively independently of the processing platform action. For the processing of the entire plane, especially for the processing with oblique angle incident, it is difficult to ensure the uniformity of the polished surface in the horizontal and vertical directions, the processing efficiency is low, the operation is difficult, and the processing effect is not obvious. , the experimental error is large

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